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US5286330A
Expired / Lapsed
US
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Method of producing copper-clad laminated board
Assignee: Circuit Foil Japan Co Ltd
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Filing: 1992-05-01
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Granted: 1994-02-15
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Expires: 2012-05-01
Abstract
Abstract A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or a plurality of prepregs bonded together, (c) placing the resulting laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170 degrees C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170 degrees C. or higher, a pressure of 10 kgf/cm2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board. The copper-clad laminated board can be used for a printed circuit board.
Inventors
- 👤 Keiji Azuma
- 👤 Kimikazu Katoh
- 👤 Ryoichi Oguro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:17
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B29; B29C; B29C33/00; B29C33/56; B29C33/68; B32B37/00; B32B37/14; B32B37/26; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; B29L; B29L2031/00; B29L2031/34; B29L2031/3425; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2203/00; H05K2203/06; H05K2203/068; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
177 words
A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or plurality of prepegs bonded together, whereby a side of the roughened copper foil is exposed, (c) placing the result laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170° C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170° C. or higher, a pressure of 10 kgf/cm 2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board.
Claim 2
Independent Claim
177 words
A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or plurality of prepegs bonded together, whereby a side of the roughened copper foil is exposed, (c) placing the result laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170° C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170° C. or higher, a pressure of 10 kgf/cm 2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board.
Claim 3
Dependent Claim
13 words
The method according to claim 1, wherein the fabric is a nonwoven fabric.
Claim 4
Dependent Claim
26 words
The method according to claim 1, wherein the polyamide-type film is selected from the group consisting of a nylon 6 film and a nylon 66 film.
Claim 5
Dependent Claim
18 words
The method according to claim 1, wherein the polyamide-type film has a thickness of 10 to 100 μm.
Claim 6
Dependent Claim
13 words
The method according to claim 3, wherein the fabric is a nonwoven fabric.
Claim 7
Dependent Claim
13 words
The method according to claim 4, wherein the fabric is a nonwoven fabric.
Claim 8
Dependent Claim
18 words
The method according to claim 3, wherein the polyamide film has a thickness of 10 to 100 μm.
Claim 9
Dependent Claim
13 words
The method according to claim 7, wherein the fabric is a non-woven fabric.
Claim 10
Dependent Claim
31 words
The method according to claim 7, wherein the thermosetting resin is selected from the group consisting of a phenolic resin, an epoxy resin, a polyimide resin and a cyanate ester resin.
Claim 11
Dependent Claim
16 words
The method according to claim 7, wherein the thermosetting resin is an epoxy modified polyimide resin.
Claim 12
Dependent Claim
27 words
The method according to claim 9, wherein the fabric is a fabric of a glass fiber, an aramid fiber, a polyester fiber, a carbon fiber or paper.
Claim 13
Dependent Claim
33 words
The method according to claim 1, wherein the thermosetting resin is an epoxy resin, the polyamide-type film is made from nylon 6, the temperature is 170° C. and the time is 180 minutes.
Claim 14
Dependent Claim
31 words
The method according to claim 1, wherein the thermosetting resin is an epoxy resin, the polyamide-type film is nylon 66, the temperature is 170° C. and the time is 180 minutes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-14 | 1997-08-16 | 1998-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-14 | 2001-08-16 | 2002-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-14 | 2005-08-16 | 2006-02-15 | $7700.00 | Window Closed / Lapsed |