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US5285559A
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US
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Method and apparatus for isolating electronic boards from shock and thermal environments
Assignee: Honeywell International Inc
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Filing: 1992-09-10
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Granted: 1994-02-15
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Expires: 2012-09-10
Abstract
Abstract A method and apparatus for isolating electronic devices from mechanical shock and thermal environments utilizes a metal outer protective shell surrounding the electronic device to be protected. Interposed between the protective shell and the electronic device are a thermal insulating layer, a layer of phase change material and a layer of mechanical shock absorbent material.
Inventors
- 👤 Craig Thompson
- 👤 Lawrence L. Eakin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:24
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/14; H05K7/1417; H05K5/00; H05K5/02; H05K5/0209; H05K5/021; H05K5/0213; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
140 words
A method of isolating an electronic device from mechanical shock and thermal environments, comprising the steps of: providing a mass of wax-like material having a high heat of fusion for absorbing a substantial quantity of heat before rising above a critical temperature limit, said mass taking the form of two pre-formed sections, one of said sections having an accessible cavity formed therein; filling said cavity with a fluid that subsequently cures into a solid having a rubber-like consistency; placing said electronic device into the fluid-filled cavity; assembling said two sections to render the cavity inaccessible; applying heat insulating material around an outer surface of said mass of wax-like material for minimizing heat transfer to said electronic device; and surrounding said heat insulating material with a metal shell for minimizing impact forces directed toward said memory device from outside said shell.
Claim 2
Independent Claim
140 words
A method of isolating an electronic device from mechanical shock and thermal environments, comprising the steps of: providing a mass of wax-like material having a high heat of fusion for absorbing a substantial quantity of heat before rising above a critical temperature limit, said mass taking the form of two pre-formed sections, one of said sections having an accessible cavity formed therein; filling said cavity with a fluid that subsequently cures into a solid having a rubber-like consistency; placing said electronic device into the fluid-filled cavity; assembling said two sections to render the cavity inaccessible; applying heat insulating material around an outer surface of said mass of wax-like material for minimizing heat transfer to said electronic device; and surrounding said heat insulating material with a metal shell for minimizing impact forces directed toward said memory device from outside said shell.
Claim 3
Dependent Claim
30 words
The method of claim 1, including the step of: curing said fluid to form a resilient layer of shock resistant material for protecting said memory device against mechanical shock forces.
Claim 4
Dependent Claim
26 words
The method of claim 1, wherein: said fluid is a silicone rubber of a type that cures in time to form a layer of rubber-like consistency.
Claim 5
Dependent Claim
26 words
The method of claim 3, wherein: said silicone rubber has a non-adhesive property after curing so as to be readily peeled away from said electronic device.
Claim 6
Dependent Claim
26 words
The method of claim 3, including the step of: curing said silicone rubber for a period of approximately twenty-four hours after said cavity has been filled.
Claim 7
Dependent Claim
15 words
The method recited in claim 5, wherein said silicone rubber is cured at room temperature.
Claim 8
Independent Claim
73 words
A method of isolating a heat and mechanical shock sensitive device from heat and mechanical shock, comprising: pre-forming a heat sink from a quantity of material having a high heat of fusion into a structure having a cavity capable of receiving said device; filling said cavity with a fluid that is transformed over time to a solid having a resilient, shock absorbing consistency; placing said device into said fluid; and closing said cavity.
Claim 9
Independent Claim
73 words
A method of isolating a heat and mechanical shock sensitive device from heat and mechanical shock, comprising: pre-forming a heat sink from a quantity of material having a high heat of fusion into a structure having a cavity capable of receiving said device; filling said cavity with a fluid that is transformed over time to a solid having a resilient, shock absorbing consistency; placing said device into said fluid; and closing said cavity.
Claim 10
Dependent Claim
20 words
The method recited in claim 7 further including surrounding said heat sink with heat insulating and physical penetration resistant material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-14 | 1997-08-16 | 1998-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-14 | 2001-08-16 | 2002-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-14 | 2005-08-16 | 2006-02-15 | $7700.00 | Window Closed / Lapsed |