US5281684A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder bumping of integrated circuit die
Assignee: NXP USA Inc
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Filing: 1992-04-30
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Granted: 1994-01-25
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Expires: 2012-04-30
Abstract
Abstract A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.
Inventors
- 👤 Kevin D. Moore
- 👤 Carl Missele
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W72/00; H10W72/20; H05K3/346; H10W72/01; H10W72/012; H10W70/00; H10W70/60; H10W72/241; H10W72/244; H10W72/251; H10W72/252; H10W72/281; H10W72/287; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
123 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and a metal contact exposed through an opening in the layer, said method comprising forming a terminal on said die, said terminal comprising a bond pad overlying said passivation layer remote from the metal contact and a runner section extending between the bond pad and the metal contact for conducting electrical signals therebetween, said terminal being formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder, and heating and cooling a body of a solder metal in contact with the bond pad to reflow the metal to form a solder bump bonded to the bond pad.
Claim 2
Independent Claim
123 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and a metal contact exposed through an opening in the layer, said method comprising forming a terminal on said die, said terminal comprising a bond pad overlying said passivation layer remote from the metal contact and a runner section extending between the bond pad and the metal contact for conducting electrical signals therebetween, said terminal being formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder, and heating and cooling a body of a solder metal in contact with the bond pad to reflow the metal to form a solder bump bonded to the bond pad.
Claim 3
Dependent Claim
15 words
The method in accordance with claim 1 wherein the copper particles include a silver coating.
Claim 4
Dependent Claim
18 words
The method in accordance with claim 1 wherein the binder is composed of a resol type phenolic resin.
Claim 5
Independent Claim
163 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and formed of a dielectric polymer material, and a metal contact exposed through an opening in the layer, said method comprising printing a copper powder ink onto the die in a pattern corresponding to a terminal having a bond pad overlying the passivation layer spaced apart from the metal contact and a runner section extending between the bond pad and the metal contact, said ink comprising at least about 70 weight percent copper particles and a vehicle, said vehicle comprising a resol type phenolic resin and a vaporizable solvent, and drying and curing the ink pattern to bond the copper particles into an unitary film to form an electrically conductive, solder-wettable terminal, and heating and cooling a body of a solder alloy in contact with the bond pad to reflow the alloy to form a solder bump bonded to the bond pad.
Claim 6
Independent Claim
163 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and formed of a dielectric polymer material, and a metal contact exposed through an opening in the layer, said method comprising printing a copper powder ink onto the die in a pattern corresponding to a terminal having a bond pad overlying the passivation layer spaced apart from the metal contact and a runner section extending between the bond pad and the metal contact, said ink comprising at least about 70 weight percent copper particles and a vehicle, said vehicle comprising a resol type phenolic resin and a vaporizable solvent, and drying and curing the ink pattern to bond the copper particles into an unitary film to form an electrically conductive, solder-wettable terminal, and heating and cooling a body of a solder alloy in contact with the bond pad to reflow the alloy to form a solder bump bonded to the bond pad.
Claim 7
Dependent Claim
15 words
The method in accordance with claim 4 wherein the copper particles include a silver coating.
Claim 8
Dependent Claim
32 words
The method in accordance with claim 4 further comprising applying a solder resist to the terminal runner section prior to forming the bump for containing the solder alloy at the bond pad.
Claim 9
Dependent Claim
39 words
The method in accordance with claim 4 wherein the terminal comprises a generally circular bond pad having a diameter and a runner having a linear section adjacent to the bond pad and having a width less than the diameter.
Claim 10
Independent Claim
166 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and formed of a dielectric polymer material, and an aluminum metal contact exposed through an opening in the layer, said method comprising printing a copper powder ink onto the die in a pattern corresponding to a terminal having a bond pad overlying the passivation layer spaced apart from the metal contact and a runner section extending between the bond pad and the metal contact, said ink comprising at least about 70 weight percent silver-coated copper particles and a vehicle, said vehicle comprising a resol type phenolic resin and a vaporizable solvent, heating the ink pattern to cure the resin to bond the copper particles into an unitary film to form an electrically conductive, solder-wettable terminal, and heating and cooling a body of a solder alloy in contact with the bond pad to reflow the alloy to form a solder bump bonded to the bond pad.
Claim 11
Independent Claim
166 words
A method for forming a solder bump on an integrated circuit die comprising a substrate, a passivation layer overlying the substrate and formed of a dielectric polymer material, and an aluminum metal contact exposed through an opening in the layer, said method comprising printing a copper powder ink onto the die in a pattern corresponding to a terminal having a bond pad overlying the passivation layer spaced apart from the metal contact and a runner section extending between the bond pad and the metal contact, said ink comprising at least about 70 weight percent silver-coated copper particles and a vehicle, said vehicle comprising a resol type phenolic resin and a vaporizable solvent, heating the ink pattern to cure the resin to bond the copper particles into an unitary film to form an electrically conductive, solder-wettable terminal, and heating and cooling a body of a solder alloy in contact with the bond pad to reflow the alloy to form a solder bump bonded to the bond pad.
Claim 12
Dependent Claim
33 words
The method in accordance with claim 8 further comprising applying a solder resist to the runner section prior to forming the bump for containing the solder alloy at the bond pad during reflow.
Claim 13
Dependent Claim
39 words
The method in accordance with claim 8 wherein the terminal comprises a generally circular bond pad having a diameter and a runner having a linear section adjacent to the bond pad and having a width less than the diameter.
Claim 14
Dependent Claim
15 words
The method in accordance with claim 8 wherein the solder alloy comprises tin and lead.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-24 | 1997-07-26 | 1998-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-24 | 2001-07-26 | 2002-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-24 | 2005-07-26 | 2006-01-25 | $7700.00 | Window Closed / Lapsed |