Fixture for backside wafer etching

Claim 2

A fixture for protecting a first surface of a semiconductor wafer while exposing a second surface of said wafer during processing, comprising: a lower base having an end, said end having a central surface portion and a remaining surface portion, with said central surface portion recessed from said remaining surface portion, said remaining surface portion having means for supporting a semiconductor wafer at a peripheral portion of said wafer first surface with a remaining portion of said wafer first surface spaced from said central surface portion and protected from said processing; a clamp having a tubular portion and a ring portion, said tubular portion having an open first end and a second end, said second end joined substantially perpendicularly to said ring portion, said ring portion extending inwardly, said clamp for complementary receipt on said lower base, with said tubular portion surrounding at least a part of said lower base; and means on said clamp for resting on a peripheral portion of said second surface of said wafer, with said means comprising a lower surface on said ring portion.

Claim 3

Fixture of claim 1 wherein said means for supporting said semiconductor wafer comprises: said remaining surface portion of said lower base having a groove, said groove for receipt of an O ring, with said O ring supporting said semiconductor wafer.

Claim 4

Fixture of claim 2 wherein said fixture further comprises said remaining surface portion of said lower base having a lip surrounding said groove, said lip for positioning said semiconductor wafer on said lower base.

Claim 5

The fixture of claim 1 further comprising at least one hole for pressure equalization, said hole extending between an edge and an inner wall of said lower base.

Claim 6

The fixture of claim 4 further comprising at least one pin and at least one hole for aligning said clamp with said lower base.

Claim 7

A fixture for use when backside stripping a semiconductor wafer, said wafer having a first surface and a second surface, comprising: means for supporting said wafer at a peripheral portion of said first surface while protecting a remaining portion of said first surface from said backside stripping; and a clamp, said clamp having means for contacting and for covering a peripheral portion of said second surface with said remaining second surface substantially exposed to said backside stripping.

Claim 8

A fixture for use when backside stripping a semiconductor wafer, said wafer having a first surface and a second surface, comprising: means for supporting said wafer at a peripheral portion of said first surface while protecting a remaining portion of said first surface from said backside stripping; and a clamp, said clamp having means for contacting and for covering a peripheral portion of said second surface with said remaining second surface substantially exposed to said backside stripping.

Claim 9

Fixture of claim 6 wherein said means for supporting and protecting comprises a disk, said disk having an upper surface, said upper surface having a raised peripheral portion, for supporting said wafer at said first surface with said first surface spaced from a remaining portion of said upper surface.

Claim 10

Fixture of claim 7 wherein said means for supporting and protecting further comprises sealing means located between said raised peripheral portion of said upper surface and said peripheral portion of said first surface of said wafer.

Claim 11

Fixture of claim 8 wherein said raised peripheral portion of said upper surface further comprises a groove extending along said raised peripheral portion, said groove for receiving an O ring.

Claim 12

Fixture of claim 7 wherein said raised peripheral portion of said upper surface further comprises a groove extending along said raised peripheral portion, said groove for receiving an O ring.

Claim 13

Fixture of claim 5 further comprising means for aligning said band with said disk.

Claim 14

Fixture of claim 11 wherein said means for aligning comprises at least one pin projecting from said raised peripheral portion and a hole in said band for receiving said at least one pin.

Claim 15

A fixture for protecting a first surface of a semiconductor wafer while exposing a second surface of said wafer during processing, comprising: a lower generally cylindrical portion having a first end, said first end having a central surface portion and an peripheral surface portion, with said central surface portion recessed from said peripheral surface portion, said peripheral surface portion for supporting a semiconductor wafer with a peripheral portion of said wafer first surface resting on said peripheral surface portion of said first end and a remaining first surface portion spaced from said central surface portion; a clamp having a tubular portion having an open first end and a second end joined substantially perpendicularly to a ring portion, said ring portion extending inwardly and having a lower surface, said clamp for complementary receipt on said lower generally cylindrical portion, with said tubular portion surrounding at least a portion of said lower generally cylindrical portion and means on said clamp for resting on a peripheral portion of said second surface of said wafer, with said means comprising a lower surface on said ring portion.

Claim 16

A fixture for protecting a first surface of a semiconductor wafer while exposing a second surface of said wafer during processing, comprising: a lower generally cylindrical portion having a first end, said first end having a central surface portion and an peripheral surface portion, with said central surface portion recessed from said peripheral surface portion, said peripheral surface portion for supporting a semiconductor wafer with a peripheral portion of said wafer first surface resting on said peripheral surface portion of said first end and a remaining first surface portion spaced from said central surface portion; a clamp having a tubular portion having an open first end and a second end joined substantially perpendicularly to a ring portion, said ring portion extending inwardly and having a lower surface, said clamp for complementary receipt on said lower generally cylindrical portion, with said tubular portion surrounding at least a portion of said lower generally cylindrical portion and means on said clamp for resting on a peripheral portion of said second surface of said wafer, with said means comprising a lower surface on said ring portion.

Claim 17

Fixture of claim 13 further comprising a groove in said peripheral surface portion of said first end; and an O ring for receipt in said groove, said O ring supporting said wafer with said wafer first surface spaced from said peripheral surface portion of said first end.

Claim 18

Fixture of claim 14 further comprising said peripheral surface portion of said first end having a lip, said lip for aligning said wafer with said lower generally cylindrical portion.

Claim 19

Fixture of claim 14 further comprising means for aligning said clamp with said lower generally cylindrical portion.

Claim 20

Fixture of claim 16 wherein said means for aligning comprises at least one pin and at least one hole.