US5275841A
Expired / Lapsed
US
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Method for encapsulating integrated circuit
Assignee: Nokia Bell Labs
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Filing: 1992-07-30
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Granted: 1994-01-04
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Expires: 2012-07-30
Abstract
Abstract A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encapsulation (14) and protects it and the integrated circuit device from the effects of rough handling. The gel, however, gives all of the protection from the external environment that it would in the absence of the elastomer encapsulation.
Inventors
- 👤 Ching-Ping Wong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:04
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/121; H10W74/40; H10W74/47; H10W74/476
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A method for encapsulating an integrated circuit device comprising the steps of: encapsulating the device with a first encapsulant of silicone gel which protects the device from the environment but which is mechanically relatively soft; and encapsulating the first encapsulant with a second encapsulant of silicone elastomer that is mechanically harder than the first encapsulant.
Claim 2
Independent Claim
55 words
A method for encapsulating an integrated circuit device comprising the steps of: encapsulating the device with a first encapsulant of silicone gel which protects the device from the environment but which is mechanically relatively soft; and encapsulating the first encapsulant with a second encapsulant of silicone elastomer that is mechanically harder than the first encapsulant.
Claim 3
Dependent Claim
74 words
The method of claim 1 wherein: the second encapsulant is initially an uncured silicone elastomer resin containing an alkoxysilane as an adhesion promoter; and further comprising the step of: adding to the uncured silicone resin a quantity of a titanate having the form Ti(OR) 4 , where R is an isopropyl, butyl, octyl or acetylacetonate, whereby said titanate bonds with excess alkoxy functional components of the alkoxysilane; and thereafter curing the silicone elastomer resin.
Claim 4
Dependent Claim
10 words
The method of claim 2 wherein: the alkoxysilane is γ-glycidoxypropyltrimethoxysilane.
Claim 5
Dependent Claim
24 words
The method of claim 3 wherein: the titanate is selected from the group consisting of titanium butyl titanate, titanium octyl titanate and titanium acetylacetonate.
Claim 6
Dependent Claim
26 words
The method of claim 4 wherein: the adding step comprises the step of making the uncured silicone resin to contain 0.05-4 weight percent of said titanate.
Claim 7
Dependent Claim
52 words
The method of claim 1 further comprising the step of: after encapsulating the inergrated circuit device in the first encapsulant, placing the encapsulated device in a container; and the step of encapsulating the second encapsulant comprises at least partially filling the container with the second encapsulant to completely cover the first encapsulant.
Claim 8
Independent Claim
39 words
A method for encapsulating an electronic device comprising: encapsulating the device with a first uncured silicone gel encapsulant; curing the first encapsulant; covering the cured first encapsulant with an uncured silicone elastomer encapsulant; and curing the silicone elastomer encapsulant.
Claim 9
Independent Claim
39 words
A method for encapsulating an electronic device comprising: encapsulating the device with a first uncured silicone gel encapsulant; curing the first encapsulant; covering the cured first encapsulant with an uncured silicone elastomer encapsulant; and curing the silicone elastomer encapsulant.
Claim 10
Dependent Claim
14 words
The method of claim 7 wherein: the electronic device is a silicon integrated circuit.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-03 | 1997-07-05 | 1998-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-03 | 2001-07-05 | 2002-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-03 | 2005-07-05 | 2006-01-04 | $7700.00 | Window Closed / Lapsed |