Abstract An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.
A method for producing a lead frame for a semiconductor package, comprising: forming a combined lead frame portion from a portion of lead frame material; separating the combined lead frame portion into a plurality of lead frame segments wherein one or more of said lead frame segments includes a voltage plane; assembling the lead frame segments on a package body to form the lead frame; and securing the lead frame segments to said package body to form the lead frame.
Claim 2
Independent Claim
80 words
A method for producing a lead frame for a semiconductor package, comprising: forming a combined lead frame portion from a portion of lead frame material; separating the combined lead frame portion into a plurality of lead frame segments wherein one or more of said lead frame segments includes a voltage plane; assembling the lead frame segments on a package body to form the lead frame; and securing the lead frame segments to said package body to form the lead frame.
Claim 3
Dependent Claim
85 words
The method for producing a lead frame of claim 1, wherein: the combined lead frame portion has about its outer perimeter a lead connecting strip for joining a plurality of individual leads; each of the lead frame segments so separated retains a portion of said connecting strip such that the individual leads of the lead frame segment are joined by said retained portion of said connecting strip; and said connecting strip is removed from the lead frame segments after final assembly of the semiconductor package.
Claim 4
Dependent Claim
20 words
The method for producing a lead frame of claim 1, wherein: the voltage plane is a ground potential voltage plane.
Claim 5
Dependent Claim
32 words
The method for producing a lead frame of claim 1, wherein: each of said lead frame segments is alike to the other, such that the lead frame formed therewith is substantially symmetrical.