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US5258322A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of producing semiconductor substrate

Assignee: Canon Inc
•
Filing: 1992-01-14
•
Granted: 1993-11-02
•
Expires: 2012-01-14
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Abstract

Abstract A method of producing a semiconductor substrate, which comprises forming a monocrystalline silicon layer on a porous silicon substrate by epitaxial growth and applying an oxidation treatment to the porous silicon substrate and the monocrystalline silicon layer at least near the interface between the porous silicon substrate and the monocrystalline silicon layer.

Inventors

  • 👤 Kiyofumi Sakaguchi
  • 👤 Takao Yonehara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 14:07
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10P90/12; H10P90/15; H10W; H10W10/00; H10W10/10; H10W10/181; Y; Y10; Y10S; Y10S148/00; Y10S148/116; Y10S438/00; Y10S438/928

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 53 words
A method of producing a semiconductor substrate, which comprises forming a monocrystalline silicon layer on a porous silicon substrate by epitaxial growth and applying an oxidation treatment to the porous silicon substrate and the part of the monocrystalline silicon layer adjacent the interface between the porous silicon substrate and the monocrystalline silicon layer.
Claim 2
Independent Claim 53 words
A method of producing a semiconductor substrate, which comprises forming a monocrystalline silicon layer on a porous silicon substrate by epitaxial growth and applying an oxidation treatment to the porous silicon substrate and the part of the monocrystalline silicon layer adjacent the interface between the porous silicon substrate and the monocrystalline silicon layer.
Claim 3
Dependent Claim 15 words
A method according to claim 1, wherein the silicon substrate is of p-type or n-type.
Claim 4
Dependent Claim 24 words
A method according to claim 1, wherein the monocrystalline silicon layer formed on the substrate has a thickness of not more than 50 microns.
Claim 5
Dependent Claim 15 words
A method according to claim 1, wherein the oxidation includes heating in an oxygen-containing atmosphere.
Claim 6
Dependent Claim 20 words
A method according to claim 4, wherein the oxidation is carried out under a higher pressure than the atmospheric pressure.
Claim 7
Dependent Claim 24 words
A method according to claim 1, wherein the monocrystalline silicon layer is formed by molecular beam epitaxy, plasma CVD, photo CVD or bias sputtering.
Claim 8
Dependent Claim 15 words
A method according to claim 1, wherein the porous silicon substrate is formed by anodization.
Claim 9
Dependent Claim 16 words
A method according to claim 7, wherein the anodization is carried out in a HF solution.
Claim 10
Dependent Claim 20 words
A method according to claim 1, wherein an antioxidant film is formed on the monocrystalline silicon layer before the oxidation.
Claim 11
Dependent Claim 15 words
A method according to claim 9, wherein the antioxidant film is a silicon nitride film.
Claim 12
Dependent Claim 24 words
A method according to claim 1, wherein the opposite side of the monocrystalline silicon to the porous silicon substrate is oxidized by the oxidation.

References Cited (Backward Citations)

JPS56110247A Cited
JPS5825245A Cited
JPS59144149A Cited
US5098850A Cited
EP0449589A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-11-01 1997-05-03 1997-11-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-11-01 2001-05-03 2001-11-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-11-01 2005-05-03 2005-11-02 $7700.00 Window Closed / Lapsed

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