US5248351A
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Copper Ni-Si-P alloy for an electronic device
Assignee: Mitsubishi Electric Corp
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Filing: 1992-02-18
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Granted: 1993-09-28
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Expires: 2012-02-18
Abstract
Abstract A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities. The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.
Inventors
- 👤 Kenji Kubozono
- 👤 Takashi Nakagima
- 👤 Takefumi Itou
- 👤 Kimio Hashizume
- 👤 Shinichi Iwase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; C; C22; C22C; C22C9/00; C22C9/06; H10W70/01; H10W70/04
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
67 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si and the rest being Cu and unavoidable impurities, wherein the weight ratio of Ni: P+Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 2
Dependent Claim
67 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si and the rest being Cu and unavoidable impurities, wherein the weight ratio of Ni: P+Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 3
Dependent Claim
77 words
A copper alloy for an electronic device which consists essentially of 2.0 wt% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si and the rest being Cu and unavoidable impurities, wherein the oxygen content is 20 ppm or less and wherein he weight ratio of Ni: P+Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 4
Dependent Claim
77 words
A copper alloy for an electronic device which consists essentially of 2.0 wt% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si and the rest being Cu and unavoidable impurities, wherein the oxygen content is 20 ppm or less and wherein he weight ratio of Ni: P+Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 5
Dependent Claim
73 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si, 0.03 wt.% ≧2.0 wt.% of Zn and the rest being Cu and unavoidable impurities, wherein the weight ratio of Ni: P+Si is within the range of rom 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 6
Dependent Claim
73 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt% of P, 0.06 wt.% -1 wt.% of Si, 0.03 wt.% ≧2.0 wt.% of Zn and the rest being Cu and unavoidable impurities, wherein the weight ratio of Ni: P+Si is within the range of rom 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 7
Dependent Claim
83 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt.% of P, 0.06 wt.% -1 wt.% of Si, 0.03 wt.% -2.0 wt.% of Zn and the rest being cu and unavoidable impurities, wherein the oxygen content is 20 ppm or less and wherein he weight ratio of Ni: P'Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
Claim 8
Dependent Claim
83 words
A copper alloy for an electronic device which consists essentially of 2.0 wt.% -8 wt.% of Ni, 0.1 wt.% -0.8 wt.% of P, 0.06 wt.% -1 wt.% of Si, 0.03 wt.% -2.0 wt.% of Zn and the rest being cu and unavoidable impurities, wherein the oxygen content is 20 ppm or less and wherein he weight ratio of Ni: P'Si is within the range of from 4.12:1 to 6.06:1; and wherein Ni 5 P 2 and Ni 2 Si intermetallic compounds are present.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-27 | 1997-03-29 | 1997-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-27 | 2001-03-29 | 2001-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-27 | 2005-03-29 | 2005-09-28 | $7700.00 | Window Closed / Lapsed |