US5243141A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tab tape, method of bonding tab tape and tab tape package
Assignee: International Business Machines Corp
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Filing: 1991-11-18
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Granted: 1993-09-07
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Expires: 2011-11-18
Abstract
Abstract A TAB (tape automated bonding) tape is disclosed which includes one or more openings, each adapted to receive a semiconductor chip, and electrical leads extending into each such opening. Significantly, this TAB tape also includes a device for preventing a semiconductor chip, positioned within a tape opening, from being lifted toward a bonding tool as a result of electrical leads adhering to the bonding tool, when the bonding tool is used to bond contact pads on the semiconductor chip to the leads extending into the opening.
Inventors
- 👤 Katsuyuki Yonehara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W72/0711; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
89 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be bonded to contact pads of said semiconductor chip when said chip is received in said opening; and means extending into said opening for preventing said chip from being lifted toward a bonding tool by adhesion of said leads to said bonding tool when said leads are bonded to the contact pads of said chip.
Claim 2
Dependent Claim
89 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be bonded to contact pads of said semiconductor chip when said chip is received in said opening; and means extending into said opening for preventing said chip from being lifted toward a bonding tool by adhesion of said leads to said bonding tool when said leads are bonded to the contact pads of said chip.
Claim 3
Dependent Claim
24 words
A TAB tape as set forth in claim 1 wherein said means includes metallic members on said insulating tape which extend into said opening.
Claim 4
Dependent Claim
26 words
A TAB tape as set forth in claim 2 wherein said metallic members are positioned on the same surface of said insulating tape as said leads.
Claim 5
Dependent Claim
27 words
A TAB tape as set forth in claim 2 wherein said metallic members include material having the same composition as that of the material of said leads.
Claim 6
Dependent Claim
28 words
A TAB tape as set forth in claim 2 wherein said opening is substantially rectangular and said metallic members are positioned in the four corners of said opening.
Claim 7
Dependent Claim
27 words
A TAB tape as set forth in claim 1 wherein said opening is substantially rectangular and said means extends into said opening at the four corners thereof.
Claim 8
Dependent Claim
92 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be connected to contact pads of said semiconductor chip when said chip is received in said opening; and means, including metallic material, extending into said opening for preventing said chip from being lifted toward a connecting tool by adhesion of said leads to said connecting tool when said leads are connected to the contact pads of said chip.
Claim 9
Dependent Claim
92 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be connected to contact pads of said semiconductor chip when said chip is received in said opening; and means, including metallic material, extending into said opening for preventing said chip from being lifted toward a connecting tool by adhesion of said leads to said connecting tool when said leads are connected to the contact pads of said chip.
Claim 10
Dependent Claim
25 words
A TAB tape as set forth in claim 7 wherein said means is positioned on the same surface of said insulating tape as said leads.
Claim 11
Dependent Claim
30 words
A TAB tape as set forth in claim 7 wherein said metallic material includes material having a composition which is the same as that of the material of said leads.
Claim 12
Dependent Claim
29 words
A TAB tape as set forth in claim 7 wherein said opening is substantially rectangular and said means includes metallic members positioned at the four corners of said opening.
Claim 13
Dependent Claim
83 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be connected to contact pads of said semiconductor chip when said chip is received in said opening; and means, extending into said opening, for engaging said chip so as to prevent said chip from moving toward said leads during the process of connecting said leads to said contact pads.
Claim 14
Dependent Claim
83 words
A TAB tape, comprising: an electrically insulating tape which includes at least one opening intended to receive a semiconductor chip; electrical leads on said tape which extend into said opening and which are to be connected to contact pads of said semiconductor chip when said chip is received in said opening; and means, extending into said opening, for engaging said chip so as to prevent said chip from moving toward said leads during the process of connecting said leads to said contact pads.
Claim 15
Dependent Claim
19 words
A TAB tape as set forth in claim 11 wherein said means includes metallic members on said insulating tape.
Claim 16
Dependent Claim
26 words
A TAB tape as set forth in claim 12 wherein said metallic members are positioned on the same surface of said insulating tape as said leads.
Claim 17
Dependent Claim
30 words
A TAB tape as set forth in claim 12 wherein said metallic members include material having a composition which is the same as that of the material of said leads.
Claim 18
Dependent Claim
40 words
A TAB tape as set forth in claim 12 wherein said chip is substantially rectangular and said metallic members are positioned so as to engage a surface of said chip bearing contact pads, adjacent the four corners of said chip.
Claim 19
Dependent Claim
36 words
A TAB tape as set forth in claim 11 wherein said chip is substantially rectangular and said means serves to engage a surface of said chip bearing contact pads, adjacent the four corners of said chip.
Claim 20
Dependent Claim
85 words
A TAB package, comprising: an electrically insulating layer having at least one opening; electrically conductive leads formed on said insulating layer which include inner lead portions extending into said opening and outer lead portions extending away from said insulating layer; a semiconductor chip disposed in said opening, which chip includes a surface bearing contact pads connected to said inner lead portions; and means extending into said opening for preventing contact between said inner lead portions and portions of said surface other than said contact pads.
Claim 21
Dependent Claim
85 words
A TAB package, comprising: an electrically insulating layer having at least one opening; electrically conductive leads formed on said insulating layer which include inner lead portions extending into said opening and outer lead portions extending away from said insulating layer; a semiconductor chip disposed in said opening, which chip includes a surface bearing contact pads connected to said inner lead portions; and means extending into said opening for preventing contact between said inner lead portions and portions of said surface other than said contact pads.
Claim 22
Dependent Claim
23 words
A TAB package as set forth in claim 17 wherein said means includes one or more metallic members positioned on said insulating layer.
Claim 23
Dependent Claim
29 words
A TAB package as set forth in claim 18 wherein said one or more metallic members are positioned on the same surface of said insulating tape as said leads.
Claim 24
Dependent Claim
33 words
A TAB package as set forth in claim 18 wherein said one or more metallic members include material having a composition which is the same as that of the material of said leads.
Claim 25
Dependent Claim
48 words
A TAB package as set forth in claim 18 wherein said semiconductor chip is substantially rectangular, said one or more metallic members are at least four in number and serve to engage said surface of said chip bearing said contact pads, adjacent the four corners of said chip.
Claim 26
Dependent Claim
33 words
A TAB package as set forth in claim 18 wherein each of said one or more metallic members have a projecting portion bent toward said surface of said chip bearing said contact pads.
References Cited (Backward Citations)
JPS5831566A
Cited
JPH03209735A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-06 | 1997-03-08 | 1997-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-06 | 2001-03-08 | 2001-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-06 | 2005-03-08 | 2005-09-07 | $7700.00 | Window Closed / Lapsed |