US5236736A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing an electromagnetic wave shield printed wiring board
Assignee: Nippon CMK Corp
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Filing: 1991-10-11
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Granted: 1993-08-17
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Expires: 2011-10-11
Abstract
Abstract A printed-wiring board shielded from electromagnetic wave radiation is made by forming a conductive circuit pattern on an insulating substrate, disposing a first insulating layer over the circuit pattern, forming a jumper wire over the first insulating layer and between connecting terminals of the conductive pattern, forming a second insulating layer covering the jumper wire and the first insulating layer, and disposing an electromagnetic wave shielding layer over the conductive pattern. The jumper wire is formed by a printing process using a conductive paste containing a conductive metal such as silver, carbon or copper. The shield layer is formed by a printing process using a conductive metal resin paste such as copper. The shield layer is protected by providing an overcoat layer over the shield layer.
Inventors
- 👤 Shin Kawakami
- 👤 Hirotaka Okonogi
- 👤 Katsutomo Nikaido
- 👤 Yoshio Nishiyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:46
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K3/00; H05K3/46; H05K3/4685
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
78 words
A method for manufacturing an electromagnetic wave shield printed wiring board, comprising the steps of: forming a conductive pattern containing connecting terminals on an insulating substrate, forming an insulating layer over said conductive pattern, forming a jumper wire from a conductive paste between the connecting terminals of said conductive pattern, forming a second insulating layer over said jumper wire, and forming a shield layer by disposing a conductive paste on said second insulating layer over said jumper wire.
Claim 2
Independent Claim
78 words
A method for manufacturing an electromagnetic wave shield printed wiring board, comprising the steps of: forming a conductive pattern containing connecting terminals on an insulating substrate, forming an insulating layer over said conductive pattern, forming a jumper wire from a conductive paste between the connecting terminals of said conductive pattern, forming a second insulating layer over said jumper wire, and forming a shield layer by disposing a conductive paste on said second insulating layer over said jumper wire.
Claim 3
Dependent Claim
41 words
A method for manufacturing an electromagnetic wave shield printed wiring board as set forth in claim 1; wherein the step of forming said shield layer comprises depositing a conductive metallic resin paste containing copper by the use of a printing method.
Claim 4
Dependent Claim
44 words
A method for manufacturing an electromagnetic wave shield printed wiring board as set forth in claim 1; wherein the step of forming said jumper wire comprises depositing a conductive metallic resin paste containing silver, carbon or copper by the use of a printing method.
Claim 5
Dependent Claim
81 words
A method for manufacturing an electromagnetic wave shield printed wiring board as set forth in claim 1 wherein the process step of forming said jumper wire and the shield layer thereof comprises depositing an insulating layer between the connecting terminals of said conductive pattern, thereafter wiring a jumper wire through printing by a conductive paste and covering the jumper wire with an insulating layer, and depositing a conductive paste to cover the shield layer and thereafter hardening said each deposited layer.
Claim 6
Independent Claim
93 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves, comprising: providing an insulating substrate; forming a conductive pattern having connecting terminals and at least one ground terminal on the insulating substrate; deposing a first insulating layer on the conductive pattern; forming a jumper wire between two connecting terminals of the conductive pattern and over the first insulating layer; disposing a second insulating layer on the jumper wire; and disposing an electromagnetic wave shield layer over the conductive pattern to shield the conductive pattern and the jumper wire from electromagnetic waves.
Claim 7
Independent Claim
93 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves, comprising: providing an insulating substrate; forming a conductive pattern having connecting terminals and at least one ground terminal on the insulating substrate; deposing a first insulating layer on the conductive pattern; forming a jumper wire between two connecting terminals of the conductive pattern and over the first insulating layer; disposing a second insulating layer on the jumper wire; and disposing an electromagnetic wave shield layer over the conductive pattern to shield the conductive pattern and the jumper wire from electromagnetic waves.
Claim 8
Dependent Claim
38 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; wherein the first insulating layer is disposed to cover the entire conductive pattern except for the connecting terminals and the ground terminals.
Claim 9
Dependent Claim
34 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; wherein the jumper wire contains a conductive metal selected from a group consisting of silver, carbon and copper.
Claim 10
Dependent Claim
30 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; wherein the electromagnetic wave shield layer is formed using a conductive metal resin paste.
Claim 11
Dependent Claim
24 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 8; wherein the conductive metal resin paste contains copper.
Claim 12
Dependent Claim
30 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; including the step of disposing an overcoat layer over the electromagnetic wave shield layer.
Claim 13
Dependent Claim
29 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; wherein the second insulating layer is also disposed on the first insulating layer.
Claim 14
Dependent Claim
34 words
A method of manufacturing a printed wiring board shielded from electromagnetic waves according to claim 5; wherein the jumper wire, the second insulating layer and the electromagnetic wave shield layer are formed by printing.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-16 | 1997-02-15 | 1997-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-16 | 2001-02-15 | 2001-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-16 | 2005-02-15 | 2005-08-17 | $7700.00 | Window Closed / Lapsed |