Abstract An apparatus for forming deposited films with a microwave plasma CVD method comprises a reactor vessel within which the pressure can be reduced, means for supplying a source gas into the reactor vessel, means for introducing the microwave into the reactor vessel and exciting a microwave discharge plasma, and means for holding a plurality of substrates so as to enclose a discharge space formed within the reactor vessel, and is characterized by comprising a holding member holding together dielectric windows for introducing the microwave into the reactor vessel, substrates for the formation of deposited films disposed so as to surround the dielectric windows and a cooling device for cooling the dielectric windows, and conveying means for conveying the holding member into and out of the reactor vessel in a vacuum atmosphere.
An apparatus for forming deposited films with a microwave plasma CVD method having a reactor vessel within which the pressure can be reduced, means for supplying a source gas into said reactor vessel, means for introducing the microwave into said reactor vessel and exciting a microwave discharge plasma, and means for holding a plurality of substrates so as to enclose a discharge space formed within said reactor vessel, characterized by comprising a holding member holding together dielectric windows for introducing the microwave into said reactor vessel, substrates for the formation of deposited films disposed so as to surround said dielectric windows and a cooling device for cooling said dielectric windows, and conveying means for conveying said holding member into and out of said reactor vessel in a vacuum atmosphere.
Claim 2
Independent Claim
129 words
An apparatus for forming deposited films with a microwave plasma CVD method having a reactor vessel within which the pressure can be reduced, means for supplying a source gas into said reactor vessel, means for introducing the microwave into said reactor vessel and exciting a microwave discharge plasma, and means for holding a plurality of substrates so as to enclose a discharge space formed within said reactor vessel, characterized by comprising a holding member holding together dielectric windows for introducing the microwave into said reactor vessel, substrates for the formation of deposited films disposed so as to surround said dielectric windows and a cooling device for cooling said dielectric windows, and conveying means for conveying said holding member into and out of said reactor vessel in a vacuum atmosphere.
Claim 3
Dependent Claim
48 words
The apparatus for forming deposited films according to claim 1, wherein, in addition to said reactor vessel, there are provided a vacuum vessel for the heating of said substrates, a vacuum vessel for the transportation of said substrates, and a vacuum vessel for the cooling of said substrates.