← Back to Patent Explorer
US5232492A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroless gold plating composition

Assignee: Applied Electroless Concepts Inc
•
Filing: 1992-01-23
•
Granted: 1993-08-03
•
Expires: 2012-01-23
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract An electroless gold plating solution comprising a gold(I) complex, a thiosulfate, a sulfite, a pH regulator and an oxidation controller. The electroless gold plating solution uses a novel reducing agent system, the thiosulfate-sulfite-sulfate system. It shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing borohydride, thiourea, hydrazine, and other reducing agents.

Inventors

  • 👤 Gerald A. Krulik
  • 👤 Nenad V. Mandich

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 10:52
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/42; C23C18/44

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 49 words
An electroless gold plating solution consisting essentially of water, a non-cyanide gold (I) complex selected from the group consisting of a gold sulfite, a gold thiosulfate and mixtures of both, a thiosulfate, a sulfite, and a chelating agent, said solution having a pH adjusted to between 6 and 11.
Claim 2
Dependent Claim 49 words
An electroless gold plating solution consisting essentially of water, a non-cyanide gold (I) complex selected from the group consisting of a gold sulfite, a gold thiosulfate and mixtures of both, a thiosulfate, a sulfite, and a chelating agent, said solution having a pH adjusted to between 6 and 11.
Claim 3
Dependent Claim 19 words
An electroless gold plating solution according to claim 1, wherein said gold(I) concentration is between 0.5 and 60 g/l.
Claim 4
Dependent Claim 19 words
An electroless gold plating solution according to claim 1, wherein said gold(I) concentration is between 1.5 and 15 g/l.
Claim 5
Dependent Claim 21 words
An electroless gold plating solution according to claim 1, wherein the ratio of thiosulfate to gold is from 1/1 to 400/1.
Claim 6
Dependent Claim 21 words
An electroless gold plating solution according to claim 1, wherein the ratio of thiosulfate to gold(I) is from 2/1 to 40/1.
Claim 7
Dependent Claim 21 words
An electroless gold plating solution according to claim 1, wherein the ratio of thiosulfate to sulfite is from 1/50 to 400/1.
Claim 8
Dependent Claim 21 words
An electroless gold plating solution according to claim 1, wherein the ratio of thiosulfate to sulfite is from 1/10 to 200/1.
Claim 9
Dependent Claim 47 words
An electroless gold plating solution according to claim 1, wherein the content of gold(I) complex is 0.0025 to 0.3 moles per liter, the content of the free thiosulfate is 0.01 to 1 moles per liter, and the content of sulfite is 0.001 to 0.5 moles per liter.

References Cited (Backward Citations)

US5106413A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-08-02 1997-02-01 1997-08-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-08-02 2001-02-01 2001-08-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-08-02 2005-02-01 2005-08-03 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag