US5230965A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High density interconnect with electroplated conductors
Assignee: Lockheed Martin Corp
•
Filing: 1992-06-08
•
Granted: 1993-07-27
•
Expires: 2012-06-08
Abstract
Abstract Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.
Inventors
- 👤 Herbert S. Cole, Jr.
- 👤 James W. Rose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 09:48
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/02; C25D5/024; C25D5/022; H; H05; H05K; H05K3/00; H05K3/10; H05K3/108; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/611; H10W70/614; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/0361; H05K2203/10; H05K2203/107; H05K3/38; H05K3/388; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/12458; Y10T428/12493; Y10T428/12535; Y10T428/12583; Y10T428/1259
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
76 words
An electronic circuit comprising: a first layer of metal having a surface, with an electroplating-preventing compound of the metal formed on said surface in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having an electroplating-enabling metal interdiffused on a selected region to define a pattern, and capable of being electroplated; and an electroplated metal conductor deposited by electroplating directly on said interdiffused portion of said first layer.
Claim 2
Dependent Claim
76 words
An electronic circuit comprising: a first layer of metal having a surface, with an electroplating-preventing compound of the metal formed on said surface in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having an electroplating-enabling metal interdiffused on a selected region to define a pattern, and capable of being electroplated; and an electroplated metal conductor deposited by electroplating directly on said interdiffused portion of said first layer.
Claim 3
Dependent Claim
32 words
The circuit recited in claim 1 wherein: said circuit includes a high density interconnect structure which interconnects a plurality of integrated circuit, said high density interconnect structure including said electroplated metal conductor.
Claim 4
Dependent Claim
12 words
The circuit recited in claim 1, wherein said compound-forming metal comprises titanium.
Claim 5
Dependent Claim
12 words
The circuit recited in claim 3, wherein said electroplating-enabling metal comprises gold.
Claim 6
Dependent Claim
12 words
The circuit recited in claim 1, wherein said electroplating-enabling metal comprises gold.
Claim 7
Dependent Claim
21 words
The circuit recited in claim 1, wherein said compound-forming metal is selected from the group consisting of titanium, chromium and aluminum.
Claim 8
Dependent Claim
22 words
The circuit recited in claim 6, wherein said electroplating-enabling metal is selected from the group consisting of gold, platinum, palladium and silver.
Claim 9
Dependent Claim
22 words
The circuit recited in claim 1, wherein said electroplating-enabling metal is selected from the group consisting of gold, platinum, palladium and silver.
Claim 10
Dependent Claim
75 words
In combination: a first layer of metal having a surface, with an electroplating-preventing compound of the metal formed on said surface in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having an electroplating-enabling metal interdiffused on a selected region to define a pattern, and capable of being electroplated; and a second layer of metal deposited by electroplating directly on said interdiffused portion of said first layer.
Claim 11
Dependent Claim
75 words
In combination: a first layer of metal having a surface, with an electroplating-preventing compound of the metal formed on said surface in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having an electroplating-enabling metal interdiffused on a selected region to define a pattern, and capable of being electroplated; and a second layer of metal deposited by electroplating directly on said interdiffused portion of said first layer.
Claim 12
Dependent Claim
21 words
The combination recited in claim 9, wherein said compound-forming metal is selected from the group consisting of titanium, chromium and aluminum.
Claim 13
Dependent Claim
22 words
The combination recited in claim 10, wherein said electroplating-enabling metal is selected from the group consisting of gold, platinum, palladium and silver.
Claim 14
Dependent Claim
22 words
The combination recited in claim 9, wherein said electroplating-enabling metal is selected from the group consisting of gold, platinum, palladium and silver.
Claim 15
Dependent Claim
97 words
An electronic circuit comprising: a layer of a first metal selected from the group consisting of titanium, chromium and aluminum, with an electroplating-preventing oxide of the metal formed on a surface of said layer in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having a second metal selected from the group consisting of gold, platinum, palladium and silver interdiffused on a selected region to define a pattern, and capable of being electroplated; and an electroplated metal conductor deposited by electroplating directly on said interdiffused portion of said surface.
Claim 16
Dependent Claim
97 words
An electronic circuit comprising: a layer of a first metal selected from the group consisting of titanium, chromium and aluminum, with an electroplating-preventing oxide of the metal formed on a surface of said layer in an amount sufficient to prevent electroplating; at least a portion of said surface being an interdiffused portion having a second metal selected from the group consisting of gold, platinum, palladium and silver interdiffused on a selected region to define a pattern, and capable of being electroplated; and an electroplated metal conductor deposited by electroplating directly on said interdiffused portion of said surface.
References Cited (Backward Citations)
US3098804A
Cited
US3505181A
Cited
US3708403A
Cited
US3915811A
Cited
US4092448A
Cited
US4443454A
Cited
US4236940A
Cited
US4786523A
Cited
US4753851A
Cited
US4917963A
Cited
US4988412A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-26 | 1997-01-25 | 1997-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-26 | 2001-01-25 | 2001-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-26 | 2005-01-25 | 2005-07-27 | $7700.00 | Window Closed / Lapsed |