US5229016A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for dispensing spherical-shaped quantities of liquid solder
Assignee: MICROFAB TECHNOLOGIES Inc A Corp OF TX
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Filing: 1991-08-08
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Granted: 1993-07-20
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Expires: 2011-08-08
Abstract
Abstract A method and apparatus for producing solidified solder balls and for ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to impact on a surface to be wetted is disclosed. The apparatus comprises a preload reservoir to hold and maintain solder in a liquid state, an ejection chamber to hold and maintain the solder in a liquid state, a connection between the preload reservoir and the ejection chamber to allow liquid solder in the preload reservoir to be transferred to the ejection chamber while maintaining the oxides in the preload reservoir, a device to pressurize the ejection chamber with an inert gas and an ejection device operatively connected to receive liquid solder from the ejection chamber and to eject generally spherical-shaped drops of liquid solder to a specific location on a surface to be wetted. Structure is included to provide an atmosphere of inert gas between the ejection device and the specific location on a surface to be wetted. The method includes the steps of maintaining solder in a liquid state in a reservoir, transferring solder in the liquid state from the reservoir to an ejection chamber, maintaining the transferred solder in a liquid state in the ejection chamber, pressurizing the ejection chamber with an inert gas, transferring solder in the liquid state from the ejection chamber to an ejection device, ejecting generally spherical-shaped drops of liquid solder from said ejection device to a specific location on a surface to be wetted. An atmosphere of inert gas is provided between the ejection device and the specific location on a surface to be wetted.
Inventors
- 👤 Donald J. Hayes
- 👤 Michael T. Boldman
- 👤 David B. Wallace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:02
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0623; B23K2101/00; B23K2101/36; B23K2101/42; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
101 words
The method of applying generally spherical-shaped drops of liquid solder through a controlled atmosphere to a surface to be wetted comprising the steps of: (a) maintaining solder in a liquid state in an ejection chamber; (b) pressurizing said ejection chamber with an inert gas; (c) transferring solder in the liquid state from said ejection chamber to an ejection device; (d) filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device; and (e) ejecting generally spherical-shaped drops of liquid solder from said ejection device to a specific location on a surface to be wetted.
Claim 2
Independent Claim
101 words
The method of applying generally spherical-shaped drops of liquid solder through a controlled atmosphere to a surface to be wetted comprising the steps of: (a) maintaining solder in a liquid state in an ejection chamber; (b) pressurizing said ejection chamber with an inert gas; (c) transferring solder in the liquid state from said ejection chamber to an ejection device; (d) filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device; and (e) ejecting generally spherical-shaped drops of liquid solder from said ejection device to a specific location on a surface to be wetted.
Claim 3
Dependent Claim
37 words
The method set forth in claim 1 further including the steps of: (a) maintaining solder in a liquid state in a reservoir; and (b) transferring solder in the liquid state from said reservoir to said ejection chamber.
Claim 4
Dependent Claim
32 words
The method set forth in claim 1 further including the step of providing an atmosphere of inert gas between said ejection device and said specific location on a surface to be wetted.
Claim 5
Dependent Claim
24 words
The method set forth in claim 1 further including the step of maintaining the transferred solder in the liquid state in said ejection device.
Claim 6
Dependent Claim
15 words
The method set forth in claim 1 wherein said ejection device comprises a drop-on-demand system.
Claim 7
Dependent Claim
16 words
The method of set forth in claim 1 wherein said ejection device comprises a charge-and-deflection system.
Claim 8
Dependent Claim
27 words
The method set forth in claim 1 wherein said specific location on a surface to be wetted comprises individual wettable metal pads on an integrated circuit chip.
Claim 9
Dependent Claim
24 words
The method set forth in claim 1 wherein said specific location on a surface to be wetted comprises connect pads on a packaging substrate.
Claim 10
Dependent Claim
54 words
The method set forth in claim 1 further including the step of ejecting generally spherical-shaped drops of liquid flux from another ejection device to said specific location so that the generally spherical-shaped drops of liquid flux arrive at said specific location before said generally spherical-shaped drops of liquid solder arrive at said specific location.
Claim 11
Dependent Claim
58 words
The method set forth in claim 1 further including the step of ejecting generally spherical-shaped drops of liquid flux from another ejection device to said specific location so that the generally spherical-shaped drops of liquid flux arrive at said specific location at the same time that said generally spherical-shaped drops of liquid solder arrive at said specific location.
Claim 12
Independent Claim
96 words
The method of ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to produce solidified solder balls of spherical shape comprising the steps of: (a) maintaining solder in a liquid state in an ejection chamber; (b) pressurizing said ejection chamber with an inert gas; (c) transferring solder in the liquid state from said ejection chamber to an ejection device; (d) filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device; and (e) ejecting generally spherical-shaped drops of liquid solder from said ejection device to a catcher.
Claim 13
Independent Claim
96 words
The method of ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to produce solidified solder balls of spherical shape comprising the steps of: (a) maintaining solder in a liquid state in an ejection chamber; (b) pressurizing said ejection chamber with an inert gas; (c) transferring solder in the liquid state from said ejection chamber to an ejection device; (d) filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device; and (e) ejecting generally spherical-shaped drops of liquid solder from said ejection device to a catcher.
Claim 14
Independent Claim
36 words
The method set forth in 11 further including the steps of: (a) maintaining solder in a liquid state in a reservoir; and (b) transferring solder in the liquid state from said reservoir to said ejection chamber.
Claim 15
Independent Claim
36 words
The method set forth in 11 further including the steps of: (a) maintaining solder in a liquid state in a reservoir; and (b) transferring solder in the liquid state from said reservoir to said ejection chamber.
Claim 16
Dependent Claim
25 words
The method set forth in claim 11 further including the step of providing an atmosphere of inert gas between said ejection device and said catcher.
Claim 17
Dependent Claim
24 words
The method set forth in claim 11 further including the step of maintaining the transferred solder in the liquid state in said ejection device.
Claim 18
Dependent Claim
27 words
The method set forth in claim 11 further including the step of maintaining the level of the liquid solder in said ejection chamber above a predetermined level.
Claim 19
Dependent Claim
15 words
The method set forth in claim 11 wherein said ejection device comprises a drop-on-demand system.
Claim 20
Dependent Claim
15 words
The method set forth in claim 11 wherein said ejection device comprises a charge-and-deflection system.
Claim 21
Independent Claim
105 words
The method of applying generally spherical-shaped drops of liquid solder through a controlled atmosphere to a surface to be wetted comprising the steps of: (a) maintaining solder in a liquid state in a reservoir; (b) transferring solder in the liquid state from said reservoir to an ejection chamber; (c) maintaining solder in a liquid state in said ejection chamber; (d) pressurizing said ejection chamber with inert gas; (e) transferring solder in the liquid state from said ejection chamber to an ejection device; and (f) ejecting generally spherical-shaped drops of liquid solder from said ejecting device to a specific location on a surface to be wetted.
Claim 22
Independent Claim
105 words
The method of applying generally spherical-shaped drops of liquid solder through a controlled atmosphere to a surface to be wetted comprising the steps of: (a) maintaining solder in a liquid state in a reservoir; (b) transferring solder in the liquid state from said reservoir to an ejection chamber; (c) maintaining solder in a liquid state in said ejection chamber; (d) pressurizing said ejection chamber with inert gas; (e) transferring solder in the liquid state from said ejection chamber to an ejection device; and (f) ejecting generally spherical-shaped drops of liquid solder from said ejecting device to a specific location on a surface to be wetted.
Claim 23
Dependent Claim
32 words
The method set forth in claim 18 further including the step of providing an atmosphere of inert gas between said ejection device and said specific location on a surface to be wetted.
Claim 24
Dependent Claim
24 words
The method set forth in claim 18 further including the step of maintaining the transferred solder in the liquid state in said ejecting device.
Claim 25
Dependent Claim
30 words
The method set forth in claim 18 further including the step of filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device.
Claim 26
Dependent Claim
15 words
The method set forth in claim 18 wherein said ejection device comprises a drop-on-demand system.
Claim 27
Dependent Claim
15 words
The method set forth in claim 18 wherein said ejection device comprises a charge-and-deflection system.
Claim 28
Dependent Claim
27 words
The method set forth in claim 18 wherein said specific location on a surface to be wetted comprises individual wettable metal pads on an integrated circuit chip.
Claim 29
Dependent Claim
24 words
The method set forth in claim 18 wherein said specific location on a surface to be wetted comprises connect pads on a packaging substrate.
Claim 30
Dependent Claim
54 words
The method set forth in claim 18 further including the step of ejecting generally spherical-shaped drops of liquid flux from another ejection device to said specific location so that the generally spherical-shaped drops of liquid flux arrive at said specific location before said generally spherical-shaped drops of liquid solder arrive at said specific location.
Claim 31
Dependent Claim
58 words
The method set forth in claim 18 further including the step of ejecting generally spherical-shaped drops of liquid flux from another ejection device to said specific location so that the generally spherical-shaped drops of liquid flux arrive at said specific location at the same time that said generally spherical-shaped drops of liquid solder arrive at said specific location.
Claim 32
Independent Claim
100 words
The method of ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to produce solidified solder balls of spherical shape comprising the steps of: (a) maintaining solder in a liquid state in a reservoir; (b) transferring solder in the liquid state from said reservoir to an ejection chamber; (c) maintaining solder in a liquid state in said ejection chamber; (d) pressurizing said ejection chamber with inert gas; (e) transferring solder in the liquid state from said ejection chamber to an ejection device; and (f) ejecting generally spherical-shaped drops of liquid solder from said ejecting device to a catcher.
Claim 33
Independent Claim
100 words
The method of ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to produce solidified solder balls of spherical shape comprising the steps of: (a) maintaining solder in a liquid state in a reservoir; (b) transferring solder in the liquid state from said reservoir to an ejection chamber; (c) maintaining solder in a liquid state in said ejection chamber; (d) pressurizing said ejection chamber with inert gas; (e) transferring solder in the liquid state from said ejection chamber to an ejection device; and (f) ejecting generally spherical-shaped drops of liquid solder from said ejecting device to a catcher.
Claim 34
Dependent Claim
25 words
The method set forth in claim 28 further including the step of providing an atmosphere of inert gas between said ejection device and said catcher.
Claim 35
Dependent Claim
24 words
The method set forth in claim 28 further including the step of maintaining the transferred solder in the liquid state in said ejection device.
Claim 36
Dependent Claim
30 words
The method set forth in claim 28 further including the step of filtering the liquid solder as the liquid solder is transferred from said ejection chamber to said ejection device.
Claim 37
Dependent Claim
27 words
The method set forth in claim 28 further including the step of maintaining the level of the liquid solder in said ejection chamber above a predetermined level.
Claim 38
Dependent Claim
15 words
The method set forth in claim 28 wherein said ejection device comprises a drop-on-demand system.
Claim 39
Dependent Claim
15 words
The method set forth in claim 28 wherein said ejection device comprises a charge-and-deflection system.
References Cited (Backward Citations)
US4527717A
Cited
US4828886A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-19 | 1997-01-18 | 1997-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-19 | 2001-01-18 | 2001-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-19 | 2005-01-18 | 2005-07-20 | $7700.00 | Window Closed / Lapsed |