US5221895A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe with microstrip transmission lines
Assignee: Tektronix Inc
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Filing: 1991-12-23
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Granted: 1993-06-22
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Expires: 2011-12-23
Abstract
Abstract A probe for testing integrated circuits includes a stiff elastic substrate including a conductive plane, the substrate having a major portion with fingers projecting therefrom in cantilever fashion. A layer of dielectric material is adhered to the substrate and has a main surface remote from the substrate. A plurality of conductor runs are adhered to the layer of dielectric material at the main surface thereof. The conductor runs extend over at least some of the fingers and are configured to form transmission lines when the conductive plane is connected to a reference potential level.
Inventors
- 👤 Bozidar Janko
- 👤 Valdis E. Garuts
- 👤 J. Lynn Saunders
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:11
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07357
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
100 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: a stiff substrate of elastic, conductive material, the substrate having a major portion with fingers projecting therefrom in cantilever fashion, and also having a main surface, a layer of dielectric material adhered to the substrate at its main surface and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the layer of dielectric material at the main surface thereof, the conductor runs extending over at least some of the fingers and being configured to form transmission lines.
Claim 2
Dependent Claim
100 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: a stiff substrate of elastic, conductive material, the substrate having a major portion with fingers projecting therefrom in cantilever fashion, and also having a main surface, a layer of dielectric material adhered to the substrate at its main surface and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the layer of dielectric material at the main surface thereof, the conductor runs extending over at least some of the fingers and being configured to form transmission lines.
Claim 3
Dependent Claim
26 words
A probe according to claim 1, wherein said elastic material is a metal having an elastic modulus of at least about 100×10 9 N/m 2 .
Claim 4
Dependent Claim
29 words
A probe according to claim 1, wherein the substrate has a thickness of about 250 μm and the layer of dielectric material has a thickness of about 25 μm.
Claim 5
Dependent Claim
22 words
A probe according to claim 1, wherein said conductor runs are configured to form microstrip transmission lines in conjunction with the substrate.
Claim 6
Dependent Claim
136 words
A probe for use in testing an integrated circuit embodied in an integrated circuit ship, comprising: a stiff elastic substrate including a conductive plane, the substrate having a major portion with fingers projecting therefrom in cantilever fashion, and also having a main surface, a layer of dielectric material adhered to the substrate at its main surface and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the layer of dielectric material at the main surface thereof, the conductor runs extending over at least some of the fingers and being configured to form transmission lines and at least one of said conductor runs being connected to the conductive plane at a location that is substantially closer to the distal end of the conductor run than to the proximal end thereof.
Claim 7
Dependent Claim
136 words
A probe for use in testing an integrated circuit embodied in an integrated circuit ship, comprising: a stiff elastic substrate including a conductive plane, the substrate having a major portion with fingers projecting therefrom in cantilever fashion, and also having a main surface, a layer of dielectric material adhered to the substrate at its main surface and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the layer of dielectric material at the main surface thereof, the conductor runs extending over at least some of the fingers and being configured to form transmission lines and at least one of said conductor runs being connected to the conductive plane at a location that is substantially closer to the distal end of the conductor run than to the proximal end thereof.
Claim 8
Dependent Claim
22 words
A probe according to claim 5, comprising a bond wire connecting said one conductor run to the conductive plane of the substrate.
Claim 9
Dependent Claim
18 words
A probe according to claim 5, comprising a via connecting said one conductor run to the conductive plane.
Claim 10
Dependent Claim
13 words
A probe according to claim 5, wherein the substrate is an elastic metal.
Claim 11
Dependent Claim
23 words
A probe according to claim 8, wherein the elastic metal has an elastic modulus of at least about 100×10 9 N/m 2 .
Claim 12
Dependent Claim
30 words
A probe according to claim 2, wherein the substrate is made of conductive material and the conductor runs are configured to form microstrip transmission lines in conjunction with the substrate.
Claim 13
Independent Claim
151 words
A method of fabricating a probe for use in testing an integrated circuit embodied in an integrated circuit chip, said method comprising: providing a stiff substrate of elastic, conductive material, the substrate having a major portion with a tip portion projecting therefrom, and also having a main surface, adhering a layer of dielectric material to the main surface of the substrate, the layer of dielectric material having a main surface remote from the substrate, forming a plurality of conductor runs on the layer of dielectric material at the main surface thereof, the conductor runs extending substantially parallel to one another over said tip portion and being configured to form transmission lines, and slitting the tip portion of the substrate and slitting the layer of dielectric material over the tip portion, whereby fingers are formed that project from the major portion of the substrate in cantilever fashion and support respective conductor runs.
Claim 14
Independent Claim
151 words
A method of fabricating a probe for use in testing an integrated circuit embodied in an integrated circuit chip, said method comprising: providing a stiff substrate of elastic, conductive material, the substrate having a major portion with a tip portion projecting therefrom, and also having a main surface, adhering a layer of dielectric material to the main surface of the substrate, the layer of dielectric material having a main surface remote from the substrate, forming a plurality of conductor runs on the layer of dielectric material at the main surface thereof, the conductor runs extending substantially parallel to one another over said tip portion and being configured to form transmission lines, and slitting the tip portion of the substrate and slitting the layer of dielectric material over the tip portion, whereby fingers are formed that project from the major portion of the substrate in cantilever fashion and support respective conductor runs.
Claim 15
Dependent Claim
70 words
A method according to claim 11, wherein each conductor run has a distal end over the finger on which the conductor run is disposed and a proximal end spaced from the distal end, and the method further comprises connecting the conductive material to at least one of the conductor runs at a point that is substantially nearer the distal end of the conductor run than is the proximal end thereof.
Claim 16
Dependent Claim
56 words
A method according to claim 11, wherein each conductor run has a distal end over the finger on which the conductor run is disposed, and the method further comprises depositing a contact bump of a metal that is more wear resistant than the material of the conductor runs on the distal end of each conductor run.
Claim 17
Dependent Claim
29 words
A method according to claim 11, comprising slitting the tip portion of the substrate before adhering the layer of dielectric material to the main surface of the metal substrate.
Claim 18
Dependent Claim
21 words
A method according to claim 11, comprising slitting the tip portion of the substrate and the layer of dielectric material concurrently.
Claim 19
Dependent Claim
95 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: a stiff substrate having a major portion with fingers projecting therefrom in cantilever fashion, said substrate being composed of a stiff plate of elastic, conductive material, a layer of insulating material adhered to the plate and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the main surface of the layer of insulating material, the conductor runs extending over at least some of the fingers and being configured to form transmission lines.
Claim 20
Dependent Claim
95 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: a stiff substrate having a major portion with fingers projecting therefrom in cantilever fashion, said substrate being composed of a stiff plate of elastic, conductive material, a layer of insulating material adhered to the plate and having a main surface remote from the substrate, and a plurality of conductor runs adhered to the main surface of the layer of insulating material, the conductor runs extending over at least some of the fingers and being configured to form transmission lines.
Claim 21
Dependent Claim
26 words
A probe according to claim 16, wherein said elastic material is a metal having an elastic modulus of at least about 100×10 9 N/m 2 .
Claim 22
Dependent Claim
29 words
A probe according to claim 16, wherein the substrate has a thickness of about 250 μm and the layer of dielectric material has a thickness of about 25 μm.
Claim 23
Dependent Claim
22 words
A probe according to claim 16, wherein said conductor runs are configured to form microstrip transmission lines in conjunction with the substrate.
Claim 24
Dependent Claim
121 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: an elastic substrate comprising a stiff plate of an elastic metal, the plate having a main surface, said substrate having a major portion with fingers projecting therefrom in cantilever fashion, a layer of insulating material adhered to the plate at said main surface, and a plurality of conductor runs adhered to the layer of insulating material, the conductor runs extending over at least some of the fingers and being configured to form transmission lines, at least one conductor run being connected to the plate at a location that is substantially closer to the distal end of the conductor run that to the proximal end thereof.
Claim 25
Dependent Claim
121 words
A probe for use in testing an integrated circuit embodied in an integrated circuit chip, comprising: an elastic substrate comprising a stiff plate of an elastic metal, the plate having a main surface, said substrate having a major portion with fingers projecting therefrom in cantilever fashion, a layer of insulating material adhered to the plate at said main surface, and a plurality of conductor runs adhered to the layer of insulating material, the conductor runs extending over at least some of the fingers and being configured to form transmission lines, at least one conductor run being connected to the plate at a location that is substantially closer to the distal end of the conductor run that to the proximal end thereof.
Claim 26
Dependent Claim
18 words
A probe according to claim 20, comprising a bond wire connecting said one conductor run to the plate.
Claim 27
Dependent Claim
17 words
A probe according to claim 20, comprising a via connecting said one conductor run to the plate.
Claim 28
Dependent Claim
24 words
A probe according to claim 20, wherein the substrate the conductor runs are configured to form microstrip transmission lines in conjunction with the substrate.
Claim 29
Independent Claim
132 words
A method of fabricating a probe for use in testing an integrated circuit embodied in an integrated circuit chip, said method comprising: providing a stiff substrate having a major portion with a tip portion projecting therefrom, said substrate being composed of a stiff plate of elastic, conductive material, providing a layer of insulating material adhered to the plate and having a main surface remote from the substrate, forming a plurality of conductor runs on the main surface of the layer of insulating material, the conductor runs extending substantially parallel to one another over said tip portion and being configured to form transmission lines, and slitting the tip portion of the substrate, whereby fingers are formed that project from the major portion of the substrate in cantilever fashion and support respective conductor runs.
Claim 30
Independent Claim
132 words
A method of fabricating a probe for use in testing an integrated circuit embodied in an integrated circuit chip, said method comprising: providing a stiff substrate having a major portion with a tip portion projecting therefrom, said substrate being composed of a stiff plate of elastic, conductive material, providing a layer of insulating material adhered to the plate and having a main surface remote from the substrate, forming a plurality of conductor runs on the main surface of the layer of insulating material, the conductor runs extending substantially parallel to one another over said tip portion and being configured to form transmission lines, and slitting the tip portion of the substrate, whereby fingers are formed that project from the major portion of the substrate in cantilever fashion and support respective conductor runs.
Claim 31
Dependent Claim
32 words
A method according to claim 24, wherein said conductive material is a metal and the step of forming the conductor runs comprises adhering the conductor runs to the layer of insulating material.
Claim 32
Dependent Claim
69 words
A method according to claim 25, wherein each conductor run has a distal end over the finger on which the conductor run is disposed and a proximal end spaced from the distal end, and the method further comprises connecting the plate to at least one of the conductor runs at a point that is substantially nearer the distal end of the conductor run than is the proximal end thereof.
Claim 33
Dependent Claim
28 words
A method according to claim 25, comprising slitting the tip portion of the plate before adhering the layer of insulating material to the main surface of the plate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-21 | 1996-12-21 | 1997-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-21 | 2000-12-21 | 2001-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-21 | 2004-12-21 | 2005-06-22 | $7700.00 | Window Closed / Lapsed |