US5220485A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat removing edge guide system and related method
Assignee: Benhov GmbH LLC
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Filing: 1991-07-12
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Granted: 1993-06-15
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Expires: 2011-07-12
Abstract
Abstract A heat removing edge guide system removes heat from a circuit board. The system includes a heat sink plate, a stationary guide fixed to the mounting surface of the heat sink plate, and a moving guide slidably mounted on a top surface of the stationary guide. Sliding of the moving guide along the upper surface of the stationary guide causes a change in the vertical distance between the mounting surface of the heat sink plate and the upper surface of the moving guide. The moving guide, the stationary guide and the heat sink plate form a thermally conductive path. A screw-adjusted side guide can also be provided to cause a wedging with a lateral wall of the chassis support and thus provide an additional heat sink path and system stability. A method of providing a thermally conductive heat sink path for removal of heat from the circuit board in the edge guide system includes the mounting of the heat sink plate on a spaced fin extending from a support wall, the sliding of the moving guide along the upper surface of the stationary guide until the upper surface of the moving guide contacts a spaced fin located adjacent to the fin on which the heat sink plate is mounted, and the varying of the distance between the moving guide and the outer surface of a side guide until the outer surface of the side guide contacts the support wall.
Inventors
- 👤 Kalyan K. Chakrabarti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:23
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/14; H05K7/1401; H05K7/1402; H05K7/1404
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
369 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising pilot means for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said pilot means is a component of said stationary guide; wherein said moving guide further includes a pilot means interacting with said stationary guide pilot means, for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said stationary guide pilot means comprises a first groove in a first side surface of said stationary guide and a second groove in a second side surface of said stationary guide, said first and second side surface being located on opposite sides of the upper surface of said stationary guide; and said movable guide pilot means comprises a first flange slidably disposed in the first groove and a second flange slidably disposed in the second groove, said first flange and said second flange sliding within the first and second grooves, respectively, during the sliding of said moving guide along the upper surface of said stationary guide.
Claim 2
Dependent Claim
369 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising pilot means for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said pilot means is a component of said stationary guide; wherein said moving guide further includes a pilot means interacting with said stationary guide pilot means, for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said stationary guide pilot means comprises a first groove in a first side surface of said stationary guide and a second groove in a second side surface of said stationary guide, said first and second side surface being located on opposite sides of the upper surface of said stationary guide; and said movable guide pilot means comprises a first flange slidably disposed in the first groove and a second flange slidably disposed in the second groove, said first flange and said second flange sliding within the first and second grooves, respectively, during the sliding of said moving guide along the upper surface of said stationary guide.
Claim 3
Dependent Claim
301 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising pilot means for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said pilot means is a component of said stationary guide; wherein: said stationary guide pilot means comprises a roll pin extending from said stationary guide in a direction corresponding to the sliding of said moving guide along the upper surface of said stationary guide; and said movable guide pilot means comprises an apertured surface in said moving guide through which said roll pin extends, said apertured surface moving relative to said roll pin during the sliding of said moving guide along the upper surface of said stationary guide.
Claim 4
Dependent Claim
301 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising pilot means for preventing lateral movement of said moving guide during the sliding of said moving guide along the upper surface of said stationary guide; wherein said pilot means is a component of said stationary guide; wherein: said stationary guide pilot means comprises a roll pin extending from said stationary guide in a direction corresponding to the sliding of said moving guide along the upper surface of said stationary guide; and said movable guide pilot means comprises an apertured surface in said moving guide through which said roll pin extends, said apertured surface moving relative to said roll pin during the sliding of said moving guide along the upper surface of said stationary guide.
Claim 5
Dependent Claim
256 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising: a side guide mounted on said moving guide and comprising an outer surface facing away from said moving guide; wherein said side guide forms a part of the thermally conductive path, and said side guide is positionally adjustable with respect to said moving guide so that the distance between said moving guide and the outer surface of said side guide can be varied without breaking the thermal conductive path.
Claim 6
Dependent Claim
256 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board said heat sink means constituting a mounting surface; a stationary guide on an edge portion of the mounting surface of said heat sink means, said stationary guide having an upper surface defining a single plane and inclined with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and having an uninterrupted upper surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the single upper surface of said stationary guide for slidably mounting the moving guide on the stationary guide, said moving guide, said stationary guide and said heat sink means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide; further comprising: a side guide mounted on said moving guide and comprising an outer surface facing away from said moving guide; wherein said side guide forms a part of the thermally conductive path, and said side guide is positionally adjustable with respect to said moving guide so that the distance between said moving guide and the outer surface of said side guide can be varied without breaking the thermal conductive path.
Claim 7
Dependent Claim
28 words
A heat removing edge guide system according to claim 3, further comprising a spring for biasing the outer surface of said side guide away from said moving guide.
Claim 8
Dependent Claim
309 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means comprising a mounting surface; support means comprising a wall and a plurality of spaced fins extending from said wall for supporting said heat sink means; a stationary guide on the mounting surface of said heat sink means, said stationary guide comprising an upper surface defining a single plane that forms an angle with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and slidably mounted on said stationary guide and comprising an upper uninterrupted surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the upper surface of said stationary guide, with said moving guide, said stationary guide, said heat sink means and said support means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide and results in contact between one of said spaced fins and the upper surface of said moving guide; further comprising: a side guide mounted on said moving guide and comprising an outer surface facing away from said moving guide; wherein said side guide forms a part of the thermally conductive path, and said side guide is positionally adjustable with respect to said moving guide so that the distance between said moving guide and the outer surface of said side guide can be varied in order to cause contact between said wall and the outer surface of said side guide without breaking the thermally conductive path.
Claim 9
Dependent Claim
309 words
A heat removing edge guide system for removing heat from a circuit board comprising: heat sink means for removing heat from a circuit board, said heat sink means comprising a mounting surface; support means comprising a wall and a plurality of spaced fins extending from said wall for supporting said heat sink means; a stationary guide on the mounting surface of said heat sink means, said stationary guide comprising an upper surface defining a single plane that forms an angle with respect to the mounting surface; a solid moving guide configured to provide a large contact surface for heat removal and slidably mounted on said stationary guide and comprising an upper uninterrupted surface facing away from said heat sink means and a lower complimentary single plane surface contacting only the upper surface of said stationary guide, with said moving guide, said stationary guide, said heat sink means and said support means forming a thermally conductive path; and said moving guide and said stationary guide being configured such that sliding of said moving guide along the upper surface of said stationary guide causes a change in the distance between the mounting surface of said heat sink means and the upper surface of said moving guide and results in contact between one of said spaced fins and the upper surface of said moving guide; further comprising: a side guide mounted on said moving guide and comprising an outer surface facing away from said moving guide; wherein said side guide forms a part of the thermally conductive path, and said side guide is positionally adjustable with respect to said moving guide so that the distance between said moving guide and the outer surface of said side guide can be varied in order to cause contact between said wall and the outer surface of said side guide without breaking the thermally conductive path.
Claim 10
Dependent Claim
28 words
A heat removing edge guide system according to claim 5, further comprising a spring for biasing the outer surface of said side guide away from said moving guide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-14 | 1996-12-14 | 1997-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-14 | 2000-12-14 | 2001-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-14 | 2004-12-14 | 2005-06-15 | $7700.00 | Window Closed / Lapsed |