Patent EP0668614A2 successfully refreshed from Google Patents.
US5217599A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding of polyimide film
Assignee: Taiflex Scientific Co Ltd
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Filing: 1991-11-08
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Granted: 1993-06-08
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Expires: 2011-11-08
Abstract
Abstract Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.
Inventors
- 👤 Ker-Ming Chen
- 👤 Syh-Ming Ho
- 👤 Tsung-Hsiung Wang
- 👤 Richard P. Cheng
- 👤 Aina Hung
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:08
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/20; C; C25; C25D; C25D3/00; C25D3/02; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/38; H05K3/382; H05K3/384; B32B2311/00; B32B2311/12; B32B2311/22; B32B2311/24; B32B2379/00; B32B2379/08; B32B2439/00; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0212; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/20; H05K2201/2063; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
29 words
A method for electroplating a metal sheet, comprising: electroplating said metal sheet in a metal plated solution, wherein bismaleimide and its derivatives is added into said metal plated solution.
Claim 2
Independent Claim
29 words
A method for electroplating a metal sheet, comprising: electroplating said metal sheet in a metal plated solution, wherein bismaleimide and its derivatives is added into said metal plated solution.
Claim 3
Dependent Claim
28 words
A method for electroplating a metal foil as claimed in claim 1, wherein said bismaleimide and its derivatives has the structural formula of: ##STR3## wherein R is ##STR4##
Claim 4
Dependent Claim
22 words
A method for electroplating a metal sheet as claimed in claim 2, wherein R of said bismaleimide and its derivatives is ##STR5##
Claim 5
Dependent Claim
22 words
A method for electroplating a metal sheet as claimed in claim 2, wherein R of said bismaleimide and its derivatives is ##STR6##
Claim 6
Dependent Claim
20 words
A method for electroplating a metal sheet as claimed in claim 1, wherein said metal sheet is a copper foil.
Claim 7
Dependent Claim
20 words
A method for electroplating a metal sheet as claimed in claim 1, wherein said metal foil is a nickel foil.
Claim 8
Dependent Claim
20 words
A method for electroplating a metal sheet as claimed in claim 1, wherein said metal sheet is an aluminum foil.
Claim 9
Dependent Claim
20 words
A method for electroplating a metal sheet as claimed in claim 1, wherein said metal sheet is a resistance foil.
Claim 10
Dependent Claim
60 words
A method for bonding a metal sheet to a polyimide film, comprising the following steps: a) electroplating said metal sheet according the method as claimed in claim 1, b) applying polyamic acid on one surface of said metal sheet prepared in step a) to form a coating layer thereon, and c) thermal imidizing said layer to form said polyimide film.
Claim 11
Dependent Claim
32 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 9, wherein said bismaleimide and its derivatives has the structural formula of: ##STR7## wherein R is ##STR8##
Claim 12
Dependent Claim
26 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 10, wherein R of said bismaleimide and its derivatives is ##STR9##
Claim 13
Dependent Claim
26 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 10, wherein R of said bismaleimide and its derivatives is ##STR10##
Claim 14
Dependent Claim
24 words
A method for bonding a metal sheet. to a polyimide film as claimed in claim 9, wherein said metal sheet is a copper foil.
Claim 15
Dependent Claim
24 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 9, wherein said metal foil is a nickel foil.
Claim 16
Dependent Claim
24 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 9, wherein said metal sheet is an aluminum foil.
Claim 17
Dependent Claim
24 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 9, wherein said metal sheet is a resistance foil.
Claim 18
Dependent Claim
29 words
A method for bonding a metal sheet to a polyimide film as claimed in claim 9, wherein said thermal imidization is carried out at a temperature of 350° C.
References Cited (Backward Citations)
US4246077A
Cited
US4406755A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-07 | 1996-12-07 | 1997-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-07 | 2000-12-07 | 2001-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-07 | 2004-12-07 | 2005-06-08 | $7700.00 | Window Closed / Lapsed |