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US5214250A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of reworking circuit panels, and circuit panels reworked thereby

Assignee: International Business Machines Corp
•
Filing: 1991-09-19
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Granted: 1993-05-25
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Expires: 2011-09-19
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Abstract

Abstract Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

Inventors

  • 👤 Burtran J. Cayson
  • 👤 John A. Covert
  • 👤 Steven A. Duncan
  • 👤 John M. Lauffer
  • 👤 Issa S. Mahmoud
  • 👤 Richard A. Schumacher

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 05:14
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/092; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4685; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 116 words
A method of rerouting circuitization in a multilayer circuit panel having a first pair of conductive surface features at a surface thereof, said method comprising the steps of: A. depositing and curing at least one conformal, polymeric dielectric layer on the surface of the panel between a first surface feature and a second surface feature; B. thereafter depositing circuitization on the conformal, polymeric dielectric layer between the first surface feature and the second surface feature; C. providing terminators electrically in contact with the circuitization at the ends thereof over and in contact with the surface features; and D. thereafter depositing and curing a top layer of dielectric overlaying at least the deposited circuitization and the terminators.
Claim 2
Independent Claim 116 words
A method of rerouting circuitization in a multilayer circuit panel having a first pair of conductive surface features at a surface thereof, said method comprising the steps of: A. depositing and curing at least one conformal, polymeric dielectric layer on the surface of the panel between a first surface feature and a second surface feature; B. thereafter depositing circuitization on the conformal, polymeric dielectric layer between the first surface feature and the second surface feature; C. providing terminators electrically in contact with the circuitization at the ends thereof over and in contact with the surface features; and D. thereafter depositing and curing a top layer of dielectric overlaying at least the deposited circuitization and the terminators.
Claim 3
Dependent Claim 17 words
The method of claim 1 comprising depositing circuitization chosen from the group consisting of Cu and Ag.
Claim 4
Dependent Claim 28 words
The method of claim 1 comprising depositing and curing a dielectric atop the deposited circuitization, said dielectric being chosen from the group consisting of epoxies, phenolics, and polyimides.
Claim 5
Dependent Claim 17 words
The method of claim 1 comprising successively depositing curing two bottom polymeric layers one atop the other.
Claim 6
Dependent Claim 14 words
The method of claim 1 comprising joining the rerouting terminators to land surface features.
Claim 7
Dependent Claim 16 words
The method of claim 1 comprising joining the rerouting terminators to surface mount device surface features.
Claim 8
Dependent Claim 99 words
The method of claim 1 comprising rerouting a second circuit between a second pair of surface features, said method including providing at least one conformal, polymeric dielectric layer between the second pair of surface features and overlaying at least a portion of the first rerouting; thereafter depositing circuitization the conformal, polymeric dielectric layer between the second pair of surface features; providing terminators electrically in contact with the conductive layer at the ends thereof over the second pair of surface features; and depositing and curing a second layer of dielectric overlaying at least the second circuitization and the second terminators.

References Cited (Backward Citations)

US4310811A Cited
US4438561A Cited
US4654102A Cited
US4731704A Cited
US4866507A Cited
US4864723A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-05-24 1996-11-23 1997-05-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-05-24 2000-11-23 2001-05-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-05-24 2004-11-23 2005-05-25 $7700.00 Window Closed / Lapsed

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