US5213676A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of generating a substrate electrode for flip chip and other applications
Assignee: Eastman Kodak Co
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Filing: 1992-05-11
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Granted: 1993-05-25
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Expires: 2012-05-11
Abstract
Abstract A method of forming a conductive electrode bump on a first side of a dielectric substrate. The electrode bump is located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate. An electrically conductive test pad, located on a second side of the substrate, is in electrical contact with the opposite end of the via. The method includes the steps of (a)forming a layer of conductive material of generally uniform thickness onto the first side of the substrate, the layer being in a routing pattern for routing electrical signals along the first side; and (b)selectively reducing the thickness of the layer in locations defining the routing pattern to a greater extent than in the location of the bump to provide a bump, that extends from the first side at a height greater than the routing pattern.
Inventors
- 👤 Samuel Reele
- 👤 Thomas R. Pian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:39
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10W; H10W70/00; H10W70/099; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2203/00; H05K2203/03; H05K2203/0369; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
144 words
A method of forming a conductive electrode bump on a first side of a dielectric substrate, the bump being located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate, an electrically conductive test pad being in contact with the opposite end of the via and located on a second side of the substrate, said method comprising the steps of: forming a layer of conductive material of generally uniform thickness onto said first side of said substrate, the layer being in a routing pattern for routing electrical signals along said first side; and selectively reducing the thickness of the layer in locations defining said routing pattern to a greater extent than in the location of the bump to provide a bump that extends from said first side at a height greater than said routing pattern.
Claim 2
Independent Claim
144 words
A method of forming a conductive electrode bump on a first side of a dielectric substrate, the bump being located such that it is in electrical contact with one end of an electrically conductive via passing through the substrate, an electrically conductive test pad being in contact with the opposite end of the via and located on a second side of the substrate, said method comprising the steps of: forming a layer of conductive material of generally uniform thickness onto said first side of said substrate, the layer being in a routing pattern for routing electrical signals along said first side; and selectively reducing the thickness of the layer in locations defining said routing pattern to a greater extent than in the location of the bump to provide a bump that extends from said first side at a height greater than said routing pattern.
Claim 3
Dependent Claim
55 words
The method as defined in claim 1 wherein said depositing step is effective to deposit a layer of conductive material that is about 25 microns or greater in thickness and wherein said reducing step is effective to remove all but about 5 microns of said conductive material except where said bump is to be located.
Claim 4
Dependent Claim
25 words
The method as defined in claim 2 further comprising the step of: coating at least the end of said bump opposite said substrate with gold.
Claim 5
Dependent Claim
31 words
The method as defined in claim 3 further comprising the step of: eliminating an electrical connection between said test pad and other test pads on the second side of the substrate.
Claim 6
Dependent Claim
25 words
The method as defined in claim 1 further comprising the step of: coating at least the end of said electrode opposite said substrate with gold.
Claim 7
Dependent Claim
31 words
The method as defined in claim 5 further comprising the step of: eliminating an electrical connection between said test pad and other test pads on the second side of the substrate.
Claim 8
Dependent Claim
31 words
The method as defined in claim 1 further comprising the step of: eliminating an electrical connection between said test pad and other test pads on the second side of the substrate.
Claim 9
Dependent Claim
14 words
The method as defined in claim 1 wherein said bump directly overlies said via.
Claim 10
Independent Claim
97 words
A method of forming a conductive electrode bump on a first side of a dielectric substrate, said method comprising the steps of: forming a layer of conductive material of generally uniform thickness onto said first side of said substrate, the layer being in a routing pattern for routing electrical signals along said first side; and selectively reducing the thickness of the layer in locations defining said routing pattern to a greater extent than in the location of the bump to provide a bump that extends from said first side at a height greater than said routing pattern.
Claim 11
Independent Claim
97 words
A method of forming a conductive electrode bump on a first side of a dielectric substrate, said method comprising the steps of: forming a layer of conductive material of generally uniform thickness onto said first side of said substrate, the layer being in a routing pattern for routing electrical signals along said first side; and selectively reducing the thickness of the layer in locations defining said routing pattern to a greater extent than in the location of the bump to provide a bump that extends from said first side at a height greater than said routing pattern.
Claim 12
Dependent Claim
55 words
The method as defined in claim 9 wherein said depositing step is effective to deposit a layer of conductive material that is about 25 microns or greater in thickness and wherein said reducing step is effective to remove all but about 5 microns of said conductive material except where said bump is to be located.
Claim 13
Dependent Claim
25 words
The method as defined in claim 10 further comprising the step of: coating at least the end of said bump opposite said substrate with gold.
Claim 14
Dependent Claim
25 words
The method as defined in claim 9 further comprising the step of: coating at least the end of said electrode opposite said substrate with gold.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-24 | 1996-11-23 | 1997-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-24 | 2000-11-23 | 2001-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-24 | 2004-11-23 | 2005-05-25 | $7700.00 | Window Closed / Lapsed |