← Back to Patent Explorer
US5213622A Expired / Lapsed US ⏱️ 0.0 years remaining

Cleaning agents for fabricating integrated circuits and a process for using the same

Assignee: Versum Materials US LLC
•
Filing: 1991-10-11
•
Granted: 1993-05-25
•
Expires: 2011-10-11
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract This invention is a vapor-phase process for cleaning metal-containing contaminants from the surfaces of integrated circuits and semiconductors between the numerous fabricating steps required to manufacture the finished electronic devices. The process comprises contacting the surface to be cleaned with an effective amount of a cleaning agent comprising a carboxylic acid selected from acetic acid or formic acid at a temperature sufficient to form volatile metal-ligand complexes on the surface of the substrate to be cleaned. The volatile metal-ligand complexes are sublimed from the surface of the substrate providing a clean, substantially residue-free surface.

Inventors

  • 👤 David A. Bohling
  • 👤 John C. Ivankovits
  • 👤 David A. Roberts

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 00:17
CPC Classifications
C; C11; C11D; C11D3/00; C11D3/16; C11D3/20; C11D3/22; H; H10; H10P; H10P70/00; H10P70/10; H10P70/12; C11D7/00; C11D7/02; C11D7/04; C11D7/08; C11D7/22; C11D7/26; C11D7/265; C23; C23F; C23F1/00; C23F1/10; C23F1/12; C23G; C23G5/00; H10P70/50; H10P70/52; H10P95/00; C11D2111/00; C11D2111/10; C11D2111/14; C11D2111/22

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 78 words
A process for cleaning metal-containing contaminants from a surface of a substrate of the type used in fabricating integrated circuits and semiconductors comprising contacting the surface with an effective amount of a cleaning agent comprising a carboxylic acid selected from the group consisting of formic acid and acetic acid in the vapor phase at a temperature sufficient to form a volatile metal-ligand complex and subliming the metal-ligand complex to remove the metal contaminants and provide a clean surface.
Claim 2
Dependent Claim 78 words
A process for cleaning metal-containing contaminants from a surface of a substrate of the type used in fabricating integrated circuits and semiconductors comprising contacting the surface with an effective amount of a cleaning agent comprising a carboxylic acid selected from the group consisting of formic acid and acetic acid in the vapor phase at a temperature sufficient to form a volatile metal-ligand complex and subliming the metal-ligand complex to remove the metal contaminants and provide a clean surface.
Claim 3
Dependent Claim 25 words
The process according to claim 1 wherein the substrate to be cleaned is selected from silicon, silicon oxide, borophosphosilicate glass, phosphosilicate glass and strontium titanate.
Claim 4
Dependent Claim 51 words
The process according to claim 2 wherein the metal-containing contaminants to be cleaned from the surface of the substrate comprise a metal oxide represented by the formulae MO, MO 2 , MO 3 , M 2 O and M 2 O 3 wherein M represents the metal of the metal oxide.
Claim 5
Dependent Claim 28 words
The process according to claim 3 wherein the metal-containing contaminant comprises an oxide of a metal selected from the group consisting of copper, iron, nickel, chromium and gold.
Claim 6
Dependent Claim 15 words
The process according to claim 4 wherein the metal-containing contaminant comprises an oxide of copper.
Claim 7
Dependent Claim 40 words
The process according to claim 2 wherein the metal-containing contaminant comprises a metal halide represented by the formula M +n (X - ) n wherein n is 1, 2 or 3 and X is a chlorine, bromine or iodine atom.
Claim 8
Dependent Claim 23 words
The process according to claim 6 wherein M is selected from the group consisting of copper, aluminum, nickel, iron, yttrium, manganese and chromium.

References Cited (Backward Citations)

US4714517A Cited
US4900363A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-05-24 1996-11-23 1997-05-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-05-24 2000-11-23 2001-05-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-05-24 2004-11-23 2005-05-25 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag