Sputtering apparatus for producing thin films of material

Claim 2

Sputtering apparatus for coating a substrate with a chosen material comprising: a first electrode and means for supporting a target member of said chosen material on said first electrode, said target member having a substantially planar surface; a second electrode and means for supporting a plurality of substrates on said second electrode adjacent to and in alignment with said first electrode, said substrates being located substantially equidistant from the center of the substrate supporting means; means for producing relative rotational motion between said first and second electrodes about an axis through the center of the substrate supporting means; a source of power arranged to impose a voltage across said first and second electrodes to produce a glow discharge in the space between substantially the entire surface of said planar target member and said second electrode, said glow discharge having a peak distribution of sputtered atoms in a direction normal to said first electrode; and shutter means positioned between substantially the entire surface of said planar target member and said second electrode, said shutter means having means for blocking a substantial part of the sputtered atoms from said target member traveling at or near normal incidence to said substrates and at least one opening shaped to permit a substantial part of the sputtered atoms from said target member traveling at an oblique angle to impinge upon said substrates to produce a substantially uniformly thick coating of said chosen material upon substantially the entire surface of said substrates.

Claim 3

The sputtering apparatus according to claim 1 wherein said chosen material comprises a metal or an alloy.

Claim 4

The sputtering apparatus of claim 1 wherein said first electrode supports a plurality of target members and said shutter means has a plurality of openings with an opening in alignment with each of said target members.

Claim 5

The sputtering apparatus of claim 1 wherein said means for blocking a substantial part of said sputtered atoms traveling at or near normal incidence comprises an elongated masking member extending radially across said opening, said elongated masking member having a central region which separates two end regions, said central region being wider than said end regions.

Claim 6

The sputtering apparatus according to claim 1 wherein said target member comprises a substantially flat disk-shaped target body.

Claim 7

Sputtering apparatus for coating a substrate with a ferromagnetic material comprising: a first electrode and means for supporting a target member of a ferromagnetic material on said first electrode, said target member having a substantially planar surface; a second electrode and means for supporting a plurality of substrates on said second electrode adjacent shutter means positioned to and in alignment with said first electrode, said substrates being located substantially equidistant from the center of the substrate supporting means; means for producing relative rotational motion between said first and second electrodes about an axis through the center of the substrate supporting means; a source of power arranged to impose a voltage across said first and second electrodes to produce a glow discharge in the space between substantially the entire surface of said planar target member and said second electrode, said glow discharge having a peak distribution of sputtered atoms in a direction normal to said first electrode; and shutter means positioned between substantially the entire surface of said planar target member and said second electrode, said shutter means having means for blocking a substantial part of the sputtered atoms from said target member traveling at or near normal incidence to said substrates and at least one opening shaped to permit a substantial part of the sputtered atoms from said target member traveling at an oblique angle to impinge upon said substrates to produce a substantially uniformly thick coating of said chosen material upon substantially the entire surface of said substrates.

Claim 8

Sputtering apparatus for coating a substrate with a ferromagnetic material comprising: a first electrode and means for supporting a target member of a ferromagnetic material on said first electrode, said target member having a substantially planar surface; a second electrode and means for supporting a plurality of substrates on said second electrode adjacent shutter means positioned to and in alignment with said first electrode, said substrates being located substantially equidistant from the center of the substrate supporting means; means for producing relative rotational motion between said first and second electrodes about an axis through the center of the substrate supporting means; a source of power arranged to impose a voltage across said first and second electrodes to produce a glow discharge in the space between substantially the entire surface of said planar target member and said second electrode, said glow discharge having a peak distribution of sputtered atoms in a direction normal to said first electrode; and shutter means positioned between substantially the entire surface of said planar target member and said second electrode, said shutter means having means for blocking a substantial part of the sputtered atoms from said target member traveling at or near normal incidence to said substrates and at least one opening shaped to permit a substantial part of the sputtered atoms from said target member traveling at an oblique angle to impinge upon said substrates to produce a substantially uniformly thick coating of said chosen material upon substantially the entire surface of said substrates.

Claim 9

The sputtering apparatus according to claim 6 wherein said ferromagnetic material comprises a metal or an alloy.

Claim 10

The sputtering apparatus according to claim 7 wherein said ferromagnetic material is selected from the group consisting of NiFe and Sendust.

Claim 11

The sputtering apparatus according to claim 7 wherein said ferromagnetic material is oriented with an easy axis in a direction normal to the direction of relative motion.

Claim 12

The sputtering apparatus of claim 6 wherein said first electrode supports a plurality of target members and said shutter means has a plurality of openings with an opening in alignment with each of said target members.

Claim 13

The sputtering apparatus of claim 6 wherein said means for blocking a substantial part of said sputtered atoms traveling at or near normal incidence comprises an elongated masking member extending radially across said opening, said elongated masking member having a central region which separates two end regions, said central region being wider than said end regions.

Claim 14

The sputtering apparatus of claim 11 wherein said shutter means comprises an opening on each side of said elongate masking member.

Claim 15

The sputtering apparatus according to claim 6 wherein said target member comprises a substantially flat disk-shaped target body.