Rigid circuit board structure using impingement cooling
Abstract
Abstract A circuit board construction including a circuit board with circuit modules installed on at least one face of the board, and at least one baffle plate connected rigidly to the board. The baffle plate is of approximately the same dimensions as the circuit board and is rigidly connected to it in a parallel, spaced-apart relationship. The baffle plate has openings at selected locations to direct air onto board-mounted circuit modules, and forms one face of an inlet air plenum, the other face of which is one surface of the circuit board to which the baffle plate is attached, or one face of an adjacent surface. The construction thereby provides impingement cooling of its components, and greatly improved structural rigidity of the circuit boards. One of the forms of the device illustrated has a single baffle plate associated with each circuit board, with circuit modules located on either the inner surface or the outer surface of the board. An alternative form of the invention includes a circuit board with circuit modules on both faces, and two baffle plates, one on each side of the circuit board, such that an intake air plenum is formed between each baffle plate and the surface of an adjacent circuit board or baffle plate.
Inventors
- 👤 Denes L. Zsolnay
Bibliographic Details
Claims Analysis
Total Claims: 4References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-03-22 | 1996-09-21 | 1997-03-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-03-22 | 2000-09-21 | 2001-03-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-03-22 | 2004-09-21 | 2005-03-23 | $7700.00 | Window Closed / Lapsed |