Photodefinable interlevel dielectrics

Claim 1

An electronic interconnect structure comprising electrical and dielectric levels wherein a cured polymer is the dielectric level, said polymer being produced by the method comprising: (a) coating a substrate with a prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde having the formula ##STR7## where the recurring unit Q has the structure, ##STR8## and n is an integer from 1 to 10; s is 0 or 1; each X is independently selected from the group consisting of CH 2 , C(CH 3 ) 2 , O, S, SO 2 , CO, and OC 6 H 4 O; each R 1 and R 2 is independently selected from the group consisting of hydrogen, alkyl and alkoxy moieties containing 1 to 10 carbon atoms, phenyl and phenoxy; a and b are independently 0 or integers from 1 to 4; Z is Cl or Br; E is selected from the group consisting of the vinylbenzyl moiety, alkyl moieties containing 1 to 10 carbon atoms, or benzyl, subject to the constraint that at least 50% of all E's are the vinylbenzyl moiety; (b) irradiating the coated prepolymer of (a) through a masking pattern to selectively crosslink the portion of said coating being irradiated; (c) selectively dissolving the non-irradiated part of the prepolymer coating of (a); and (d) curing the crosslinked portion of the prepolymer coating by heating at a temperature in the range of 100° C. to 300° C. for a time sufficient to further crosslink said crosslinked coating and to transform the prepolymer to an infusible glassy solid.