US5181986A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plasma processing apparatus
Assignee: Fuji Electric Co Ltd
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Filing: 1991-03-29
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Granted: 1993-01-26
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Expires: 2011-03-29
Abstract
Abstract In a plasma processing device a plasma generation chamber communicates with a processing chamber holding a substrate. A first solenoid is disposed around the generation chamber in a coaxial relationship therewith and a second solenoid is disposed near the substrate. Processing includes generating a gas plasma by flowing a gas into the generation chamber, introducing microwave radiation into the chamber and controlling the first solenoid current to produce a magnetic field in the generation chamber. In particular, the value of a magnetic flux density at any point on a plane perpendicular to an axis of the first solenoid at a lengthwise midpoint is made to be higher than 1.01 times the value of the magnetic flux density satisfying the electron cyclotron resonance condition. And the value of the magnetic flux density at any point on a plane perpendicular to the axis of the first solenoid at an end is made to be lower than 0.99 times the value of the magnetic flux density satisfying the electron cycltoron resonance condition. Plasma is extracted from the generation chamber along lines of magnetic force produced by the first solenoid into the processing chamber and is directed onto a surface of the semiconductor substrate along lines of magnetic force of a cusp-shaped magnetic field produced by the second solenoid so that the plasma processes the surface of the semiconductor substrate.
Inventors
- 👤 Kiyoshi Ohiwa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:47
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32192; H01J37/32431; H01J37/3266; H01J37/32697; H01J37/32706
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
201 words
In a plasma processing apparatus for processing a semiconductor substrate, the apparatus having a plasma generation chamber communicating with a processing chamber for holding the substrate, a first excitation solenoid being disposed around the plasma generation chamber in a coaxial relationship therewith, a second excitation solenoid disposed in the vicinity of the semiconductor substrate, a method for plasma processing the semiconductor substrate comprising: generating a gas plasma by flowing a gas into the plasma generation chamber, introducing microwave radiation into the plasma generation chamber and controlling a current flowing through the first excitation solenoid thereby defining a magnetic field and generating the gas plasma by a resonant effect with the microwave radiation, wherein the current is maintained within a current range in which plasma density decreases suddenly with an increase in the current; and extracting the gas plasma from the plasma generation chamber along lines of magnetic force produced by the first excitation solenoid into the processing chamber and directing the plasma onto a surface of the semiconductor substrate disposed in the processing chamber along lines of magnetic force of a cusp-shaped magnetic field produced by the second excitation solenoid so that the plasma processes the surface of the semiconductor substrate.
Claim 2
Dependent Claim
201 words
In a plasma processing apparatus for processing a semiconductor substrate, the apparatus having a plasma generation chamber communicating with a processing chamber for holding the substrate, a first excitation solenoid being disposed around the plasma generation chamber in a coaxial relationship therewith, a second excitation solenoid disposed in the vicinity of the semiconductor substrate, a method for plasma processing the semiconductor substrate comprising: generating a gas plasma by flowing a gas into the plasma generation chamber, introducing microwave radiation into the plasma generation chamber and controlling a current flowing through the first excitation solenoid thereby defining a magnetic field and generating the gas plasma by a resonant effect with the microwave radiation, wherein the current is maintained within a current range in which plasma density decreases suddenly with an increase in the current; and extracting the gas plasma from the plasma generation chamber along lines of magnetic force produced by the first excitation solenoid into the processing chamber and directing the plasma onto a surface of the semiconductor substrate disposed in the processing chamber along lines of magnetic force of a cusp-shaped magnetic field produced by the second excitation solenoid so that the plasma processes the surface of the semiconductor substrate.
Claim 3
Dependent Claim
24 words
A method as claimed in claim 1, wherein the current is maintained at a value lower than a medium value of the current range.
Claim 4
Dependent Claim
35 words
A method as claimed in claim 1, wherein plasma density corresponding to an upper limit of the current range is approximately one tenth of plasma density corresponding to a lower limit of the current range.
Claim 5
Dependent Claim
30 words
A method as claimed in claim 1, wherein a second gas including an element to be deposited onto the surface of the semiconductor substrate is introduced into the processing chamber..
Claim 6
Dependent Claim
168 words
In a plasma processing apparatus for processing a semiconductor substrate, the apparatus having a plasma generation chamber communicating with a processing chamber for holding the substrate, a first excitation solenoid being disposed around the plasma generation chamber in a coaxial relationship therewith, a method for plasma processing the semiconductor substrate comprising: generating a gas plasma by flowing a gas into the plasma generation chamber, introducing microwave radiation into the plasma generation chamber and flowing a current through the first excitation solenoid for defining a magnetic field thereby generating the gas plasma by a resonant effect with the microwave radiation; varying the current flowing through the first excitation solenoid to find a current range within which plasma density suddenly decreases with an increase in the current; and extruding plasma from the plasma generation chamber and directing the plasma onto a surface of the semiconductor substrate held in the processing chamber while maintaining the current within the current range so that the plasma processes the surface of the semiconductor substrate.
Claim 7
Dependent Claim
168 words
In a plasma processing apparatus for processing a semiconductor substrate, the apparatus having a plasma generation chamber communicating with a processing chamber for holding the substrate, a first excitation solenoid being disposed around the plasma generation chamber in a coaxial relationship therewith, a method for plasma processing the semiconductor substrate comprising: generating a gas plasma by flowing a gas into the plasma generation chamber, introducing microwave radiation into the plasma generation chamber and flowing a current through the first excitation solenoid for defining a magnetic field thereby generating the gas plasma by a resonant effect with the microwave radiation; varying the current flowing through the first excitation solenoid to find a current range within which plasma density suddenly decreases with an increase in the current; and extruding plasma from the plasma generation chamber and directing the plasma onto a surface of the semiconductor substrate held in the processing chamber while maintaining the current within the current range so that the plasma processes the surface of the semiconductor substrate.
Claim 8
Dependent Claim
52 words
A method as claimed in claim 5, wherein a second excitation solenoid is disposed in the vicinity of the semiconductor substrate and a current is passed through the second excitation solenoid to produce a magnetic field with a polarity opposite to that of the magnetic field produced by the first excitation solenoid.
Claim 9
Dependent Claim
21 words
A method as claimed in claim 6, wherein the second excitation solenoid is disposed so as to surround the semiconductor substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-26 | 1996-07-27 | 1997-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-26 | 2000-07-27 | 2001-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-26 | 2004-07-27 | 2005-01-26 | $7700.00 | Window Closed / Lapsed |