US5179601A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium
Assignee: Hitachi Ltd
•
Filing: 1991-10-30
•
Granted: 1993-01-12
•
Expires: 2011-10-30
Abstract
Abstract A method of manufacturing a circuit structure where the electric and/or optical transmission medium or media include at least one of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium. The transmission media are insert-molded in plastics which is a housing for electronic and electric devices and parts. The circuit structure serves both for conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.
Inventors
- 👤 Masao Gotoh
- 👤 Makoto Iida
- 👤 Kenichi Waragai
- 👤 Yonezo Yanokura
- 👤 Masaki Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:01
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/16; B29C45/1671; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0274; H05K1/0284; H05K3/00; H05K3/10; H05K3/20; H05K3/202; H05K1/0213; H05K1/0263; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/09818; H05K2201/0999; H05K2203/00; H05K2203/30; H05K2203/302; H05K3/0011; H05K3/0014
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
80 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium.
Claim 2
Independent Claim
80 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium.
Claim 3
Dependent Claim
29 words
A method of manufacturing a circuit structure as set forth in claim 1, wherein: said first polymer is a thermosetting resin and; said second polymer is a thermoplastic resin.
Claim 4
Dependent Claim
35 words
A method of manufacturing a circuit structure as set forth in Claim 1 wherein: said molding at a low pressure is a transfer molding; and said molding at a high pressure is an injection molding.
Claim 5
Dependent Claim
54 words
A method of manufacturing a circuit structure as set forth in Claim 1 wherein: said molding at a low pressure is conducted at a pressure of 3 to 9 MPa; and said molding at a high pressure is conducted at a pressure of 0.8 to 50 times that of said molding at low pressure.
Claim 6
Dependent Claim
42 words
A method of manufacturing a circuit structure as set forth in claim 1, wherein said at least one type of media includes one or more of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium.
Claim 7
Independent Claim
152 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium; wherein said first polymer is a thermosetting resin selected from the group consisting of single substances and filler composites of epoxy resin, phenol resin, and diallyl phthalate resin; and wherein said second polymer is a thermoplastic resin having heat deflection temperature of more an 200° C. and selected from the group consisting of polyphenylene sulfide (PPS), polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF), polyethylene terephthalate (PET), polyether etherketone (PEEK), and all-aromatic polyester.
Claim 8
Independent Claim
152 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium; wherein said first polymer is a thermosetting resin selected from the group consisting of single substances and filler composites of epoxy resin, phenol resin, and diallyl phthalate resin; and wherein said second polymer is a thermoplastic resin having heat deflection temperature of more an 200° C. and selected from the group consisting of polyphenylene sulfide (PPS), polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF), polyethylene terephthalate (PET), polyether etherketone (PEEK), and all-aromatic polyester.
Claim 9
Independent Claim
128 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium; wherein said molding at a low pressure is a transfer molding conducted at a pressure of 3 to 9 MPa; and wherein said molding at a high pressure is an injection molding conducted at a pressure of 0.8 to 50 times that of said molding at low pressure.
Claim 10
Independent Claim
128 words
A method of manufacturing a circuit structure comprising the steps of: disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold; molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium; and molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium; wherein said molding at a low pressure is a transfer molding conducted at a pressure of 3 to 9 MPa; and wherein said molding at a high pressure is an injection molding conducted at a pressure of 0.8 to 50 times that of said molding at low pressure.
References Cited (Backward Citations)
FR1124765A
Cited
FR2134440A1
Cited
JPS58180095A
Cited
US4693543A
Cited
US4750799A
Cited
EP0178579A2
Cited
US4695120A
Cited
US4714312A
Cited
US4758063A
Cited
EP0272027A2
Cited
FR2638594A1
Cited
US5071223A
Cited
US4953933A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-12 | 1996-07-13 | 1997-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-12 | 2000-07-13 | 2001-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-12 | 2004-07-13 | 2005-01-12 | $7700.00 | Window Closed / Lapsed |