US5179366A
Expired / Lapsed
US
⏱️ 0.0 years remaining
End terminated high power chip resistor assembly
Assignee: NXP USA Inc
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Filing: 1991-06-24
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Granted: 1993-01-12
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Expires: 2011-06-24
Abstract
Abstract An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).
Inventors
- 👤 Robert Wagner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 03:33
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/006; H01C1/00; H01C1/08; H01C1/084; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10007; H05K2201/10022; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10954; H05K2201/10969; H05K3/0058; H05K3/0061; H05K3/3431; H05K3/3442; H05K3/40; H05K3/42; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
113 words
A method for increasing thermal conductivity in an end terminated high power chip resistor wherein increased heat dissipation promotes a higher power rating, comprising: providing an end terminated high power chip resistor having a conductive plate on a portion of a substrate supporting the resistor; mounting the end terminated high power chip resistor on a printed circuit board having at least one metal lined via, wherein the conductive plate is in contact with the metal lined via; and mounting a heat sink to the printed circuit board opposite to the side the end terminated resistor is mounted to so the metal lined via conducts heat from the conductive plate to the heat sink.
Claim 2
Independent Claim
113 words
A method for increasing thermal conductivity in an end terminated high power chip resistor wherein increased heat dissipation promotes a higher power rating, comprising: providing an end terminated high power chip resistor having a conductive plate on a portion of a substrate supporting the resistor; mounting the end terminated high power chip resistor on a printed circuit board having at least one metal lined via, wherein the conductive plate is in contact with the metal lined via; and mounting a heat sink to the printed circuit board opposite to the side the end terminated resistor is mounted to so the metal lined via conducts heat from the conductive plate to the heat sink.
Claim 3
Dependent Claim
33 words
The method for increasing thermal conductivity in the end terminated high power chip resistor of claim 1 wherein mounting the resistor is done by surface mounting the resistor to the printed circuit board.
Claim 4
Dependent Claim
45 words
The method for increasing thermal conductivity in the end terminated high power chip resistor of claim 1 further including filling the metal lined via of the printed circuit board with solder wherein the metal lined via can be either completely or partially filled with solder.
Claim 5
Dependent Claim
84 words
A thermally conductive resistor assembly comprising: an end terminated high power chip resistor having a heat conductive portion; a printed circuit board with at least one metal lined via wherein the end terminated resistor is mounted so the metal lined via is in contact with the heat conductive portion; and a heat sink placed in contact with the printed circuit board so heat is conducted by the metal lined via from the conductive portion of the end terminated chip resistor to the heat sink.
Claim 6
Dependent Claim
84 words
A thermally conductive resistor assembly comprising: an end terminated high power chip resistor having a heat conductive portion; a printed circuit board with at least one metal lined via wherein the end terminated resistor is mounted so the metal lined via is in contact with the heat conductive portion; and a heat sink placed in contact with the printed circuit board so heat is conducted by the metal lined via from the conductive portion of the end terminated chip resistor to the heat sink.
Claim 7
Dependent Claim
27 words
The thermally conductive resistor assembly of claim 4 wherein the resistor has end terminations which are used to surface mount the resistor to the printed circuit board.
Claim 8
Dependent Claim
58 words
An end terminated high power chip resistor attached to a printed circuit board, the resistor having a thermally conductive material bonded to its substrate, the thermally conductive material mounted above a printed circuit board via wherein the via is lined with metal and filled with solder, and a heat sink is in contact with the metal lined via.
Claim 9
Dependent Claim
58 words
An end terminated high power chip resistor attached to a printed circuit board, the resistor having a thermally conductive material bonded to its substrate, the thermally conductive material mounted above a printed circuit board via wherein the via is lined with metal and filled with solder, and a heat sink is in contact with the metal lined via.
Claim 10
Dependent Claim
51 words
An end terminated high power chip resistor for mounting on a printed circuit board, comprising: a resistive film mounted on a supporting substrate; contacts wrapped around ends of the supporting substrate and making contact to the resistive film; and a heat conductive metal attached to the bottom of the supporting substrate.
Claim 11
Dependent Claim
51 words
An end terminated high power chip resistor for mounting on a printed circuit board, comprising: a resistive film mounted on a supporting substrate; contacts wrapped around ends of the supporting substrate and making contact to the resistive film; and a heat conductive metal attached to the bottom of the supporting substrate.
Claim 12
Dependent Claim
82 words
The end terminated high power chip resistor of claim 7 wherein the printed circuit board has a metal lined via and the end terminated high power chip resistor is mounted on the printed circuit board so that the heat conductive metal is in contact with the metal lined via, and further including a heat sink attached to the bottom of the printed circuit board so heat is conducted from the heat conductive metal through the metal lined via to the heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-12 | 1996-07-13 | 1997-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-12 | 2000-07-13 | 2001-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-12 | 2004-07-13 | 2005-01-12 | $7700.00 | Window Closed / Lapsed |