US5175023A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming insulating coating material for electronic circuit board
Assignee: Denso Corp
•
Filing: 1990-08-28
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Granted: 1992-12-29
•
Expires: 2010-08-28
Abstract
Abstract The present invention relates to an insulating coating material for an electronic circuit board, an insulating coating layer for an electronic circuit board, and a method for forming such insulating coating layer, and the insulating coating material is a solution comprising a thermoplastic resin and a solvent containing a low boiling solvent, which solution can be prevented from dropping after its application onto the electronic circuit board, and the insulating coating layer is formed using the coating material on the surface of the electronic circuit board having edge portions thereon so that the coating thickness at the edge portions and that at the other portion than the edge portions are almost equal to each other, further, the method for forming such insulating coating layer is characterized by forming the coating layer using the above insulating coating material according to a spray method or a dipping method.
Inventors
- 👤 Teruhiko Iwase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:08
CPC Classifications
C; C08; C08J; C08J3/00; C08J3/02; C08J3/09; C08J3/091; C09; C09D; C09D133/00; C09D133/04; C09D133/14; C09D133/16; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/44; H01B3/447; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; C08J2333/00; C08J2333/04; C08J2333/14; C08J2333/16; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
168 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises applying a solution consisting essentially of a fluorinated thermoplastic resin, a main solvent and a secondary solvent, by spraying, onto the surface of an electronic circuit board with electronic elements mounted thereon, said main solvent being capable of dissolving said fluorinated thermoplastic resin and having a boiling point not higher than 100° C. at 760 mmHg and said secondary solvent being compatible with said main solvent and having a boiling point higher than that of said main solvent, a mixing rate of said secondary solvent to said main solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said main solvent, and then drying said solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 2
Independent Claim
168 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises applying a solution consisting essentially of a fluorinated thermoplastic resin, a main solvent and a secondary solvent, by spraying, onto the surface of an electronic circuit board with electronic elements mounted thereon, said main solvent being capable of dissolving said fluorinated thermoplastic resin and having a boiling point not higher than 100° C. at 760 mmHg and said secondary solvent being compatible with said main solvent and having a boiling point higher than that of said main solvent, a mixing rate of said secondary solvent to said main solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said main solvent, and then drying said solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 3
Dependent Claim
51 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 1, wherein said main solvent is a fluorocarbon type solvent, and said secondary solvent is at least one selected from the group consisting of m-xylene hexafluoride, ethanol, acetone, hexane, methanol, xylene, ether, benzene and tetrachloro-difluoroethane.
Claim 4
Dependent Claim
41 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 2, wherein said main solvent is 1,1,2-trichloro-1,2,2-trifluoroethane, and said secondary solvent is at least one selected from the group consisting of m-xylene hexafluoride and ethanol.
Claim 5
Dependent Claim
32 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 1, wherein said solution contains 0.1 to 15 parts by weight of said fluorinated thermoplastic resin.
Claim 6
Dependent Claim
26 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 1, wherein said fluorinated thermoplastic resin is perfluoroalkylacryl copolymer resin.
Claim 7
Independent Claim
183 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises dipping an electronic circuit board with electronic elements mounted thereon into a solution consisting essentially of a fluorinated thermoplastic resin, a main solvent and a second solvent, said main solvent being capable of dissolving said fluorinated thermoplastic resin and having a boiling point not higher than 100° C. at 760 mmHg and said secondary solvent being compatible with said main solvent and having a boiling point higher than that of said main solvent, a mixing rate of said secondary solvent to said main solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said main solvent, pulling up the electronic circuit board from the solution to apply the solution onto the surface of the circuit board, and then drying the solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 8
Independent Claim
183 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises dipping an electronic circuit board with electronic elements mounted thereon into a solution consisting essentially of a fluorinated thermoplastic resin, a main solvent and a second solvent, said main solvent being capable of dissolving said fluorinated thermoplastic resin and having a boiling point not higher than 100° C. at 760 mmHg and said secondary solvent being compatible with said main solvent and having a boiling point higher than that of said main solvent, a mixing rate of said secondary solvent to said main solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said main solvent, pulling up the electronic circuit board from the solution to apply the solution onto the surface of the circuit board, and then drying the solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 9
Dependent Claim
51 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 6, wherein said main solvent is a fluorocarbon type solvent, and said secondary solvent is at least one selected from the group consisting of m-xylene hexafluoride, ethanol, acetone, hexane, methanol, xylene, ether, benzene and tetrachloro-difluoroethane.
Claim 10
Dependent Claim
41 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 7, wherein said main solvent is 1,1,2-trichloro-1,2,2-trifluoroethane, and said secondary solvent is at least one selected from the group consisting of m-xylene hexafluoride and ethanol.
Claim 11
Dependent Claim
32 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 6, wherein said solution contains 0.1 to 15 parts by weight of said fluorinated thermoplastic resin.
Claim 12
Dependent Claim
26 words
A method for forming an insulating coating layer for an electronic circuit board according to claim 6, wherein said fluorinated thermoplastic resin is perfluoroalkylacryl copolymer resin.
Claim 13
Independent Claim
173 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises: applying a solution consisting essentially of a perfluoroalkylacryl copolymer resin, a fluorinated solvent and a m-xylene hexafluoride solvent by spraying said solution onto the surface of an electronic circuit board with electronic elements mounted thereon, said fluorinated solvent being capable of dissolving said perfluoroalkylacryl compolymer resin and having a boiling point not higher than 100° C. at 760 mmHg and said m-xylene hexafluoride solvent being compatible with said fluorinated solvent and having a boiling point higher than that of said fluorinated solvent, a mixing rate of said m-xylene hexafluoride solvent to said fluorinated solvent falling in an range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said fluorinated solvent, and then drying said solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 14
Independent Claim
173 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises: applying a solution consisting essentially of a perfluoroalkylacryl copolymer resin, a fluorinated solvent and a m-xylene hexafluoride solvent by spraying said solution onto the surface of an electronic circuit board with electronic elements mounted thereon, said fluorinated solvent being capable of dissolving said perfluoroalkylacryl compolymer resin and having a boiling point not higher than 100° C. at 760 mmHg and said m-xylene hexafluoride solvent being compatible with said fluorinated solvent and having a boiling point higher than that of said fluorinated solvent, a mixing rate of said m-xylene hexafluoride solvent to said fluorinated solvent falling in an range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said fluorinated solvent, and then drying said solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 15
Independent Claim
185 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises: dipping an electronic circuit board with electronic elements mounted thereon int a solution consisting essentially of a perfluoroalkylacryl copolymer resin, a fluorinated solvent and a m-xylene hexafluoride solvent, said fluorinated solvent being capable of dissolving said perfluoroalkylacryl copolymer resin and having a boiling point not higher than 100° C. at 760 mmHg and said m-xylene hexafluoride solvent being compatible with said fluorinated solvent and having a boiling point higher than that of said fluorinated solvent, a mixing rate of said m-xylene hexafluoride solvent to said fluorinated solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said fluorinated solvent, pulling up the electronic circuit board from the solution to apply the solution onto the surface of said circuit board, and drying the solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
Claim 16
Independent Claim
185 words
A method for forming an insulating coating layer for an electronic circuit board, which method comprises: dipping an electronic circuit board with electronic elements mounted thereon int a solution consisting essentially of a perfluoroalkylacryl copolymer resin, a fluorinated solvent and a m-xylene hexafluoride solvent, said fluorinated solvent being capable of dissolving said perfluoroalkylacryl copolymer resin and having a boiling point not higher than 100° C. at 760 mmHg and said m-xylene hexafluoride solvent being compatible with said fluorinated solvent and having a boiling point higher than that of said fluorinated solvent, a mixing rate of said m-xylene hexafluoride solvent to said fluorinated solvent falling in a range of 0.1 to 20 parts by weight with respect to 100 parts by weight of said fluorinated solvent, pulling up the electronic circuit board from the solution to apply the solution onto the surface of said circuit board, and drying the solution to form an insulating coating layer in which the thickness at edge portions having electroconductivity on the circuit board and the thickness at the other portion than the edge portions are almost equal to each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-29 | 1996-06-29 | 1996-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-29 | 2000-06-29 | 2000-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-29 | 2004-06-29 | 2004-12-29 | $7700.00 | Window Closed / Lapsed |