Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials

Claim 1

A device for marking off a reference direction onto a plaquette of a monocrystalline semiconducting material having a low hardness and for cleaving that plaquette, said device comprising means for forming an impression and means for forming a reference line, said means for forming an impression is provided for the formation of an impression on a face, termed head face, of the plaquette, on which face semiconducting components are, or will subsequently be, formed and in an area, termed non useful area of this head face, which area does not carry, or will not subsequently carry any of said components, the impression allowing at least one direction from which a reference direction is deduced, the means for forming the reference line traces the reference according to said reference direction, said reference direction being a direction along which the plaquette is cleaved, and means for tracing a cleavage line along said reference direction, on another face termed rear face of the plaquette and in an area of this rear face which is located below said non useful area, so as to cleave the plaquette for breaking.

Claim 2

A device for marking off a reference direction onto a plaquette of a monocrystalline semiconducting material having a low hardness and for cleaving that plaquette, said device comprising means for forming an impression and means for forming a reference line, said means for forming an impression is provided for the formation of an impression on a face, termed head face, of the plaquette, on which face semiconducting components are, or will subsequently be, formed and in an area, termed non useful area of this head face, which area does not carry, or will not subsequently carry any of said components, the impression allowing at least one direction from which a reference direction is deduced, the means for forming the reference line traces the reference according to said reference direction, said reference direction being a direction along which the plaquette is cleaved, and means for tracing a cleavage line along said reference direction, on another face termed rear face of the plaquette and in an area of this rear face which is located below said non useful area, so as to cleave the plaquette for breaking.

Claim 9

A device for marking off a reference direction onto a plaquette of a monocrystalline semiconducting material having a low hardness and for cleaving that plaquette, said device comprising means for forming an impression and means for forming a reference line, said means for forming an impression is provided for the formation of an impression on the face, termed head face, of the plaquette, on which face semiconducting components are, or will subsequently, be formed and in an area, termed non useful area of this head face, which area does not carry, or will not subsequently carry any of said components, the impression allowing at least one direction from which a reference direction is deduced, the means for forming the reference line traces the reference according to said reference direction, said reference direction having a direction along which the plaquette is cleaved and means for tracing a cleavage line along said reference direction, on another face termed the rear face of the plaquette and in an area of this rear face which is located below said non useful area, so as to cleave the plaquette for breaking and further comprising: support means for supporting said plaquette, said plaquette resting on the support means through its rear face, these support means being mobile in translation along a first axis (X) and a second axis (Y) perpendicular to said first axis, said support means being, in addition, mobile in rotation around a third axis, which is perpendicular to the first and second axes and mobile in translation in a direction parallel to this third axis, means for maintaining the plaquette on said support means, microscopic means for observing of the head face of the plaquette along a sighting axis (Z) which is parallel to the third axis and which has means for locating the first and second axis, said microscopic means including at least one optical microscope observation device, and the means for forming a reference line traces the line when said support means are moved in translation along either one of said first and second axes, and wherein said means for forming an impression and said means for forming a reference line are connected to said optical observation device to define an assembly, said assembly being mobile such that the optical observation device, said means for forming an impression and said means for forming a reference line are positioned alternately along the sighting axis (Z), and wherein said means for tracing a cleavage line comprises a tracing member located below said support means and which is mobile in translation in directions parallel to said first (X), second (Y) and third axes, said support means includes a bored hole providing for the passage of said tracing member and said means for maintaining the plaquette prevents the lifting thereof when the tracing member passes against said plaquette.

Claim 10

A device for marking off a reference direction onto a plaquette of a monocrystalline semiconducting material having a low hardness and for cleaving that plaquette, said device comprising means for forming an impression and means for forming a reference line, said means for forming an impression is provided for the formation of an impression on the face, termed head face, of the plaquette, on which face semiconducting components are, or will subsequently, be formed and in an area, termed non useful area of this head face, which area does not carry, or will not subsequently carry any of said components, the impression allowing at least one direction from which a reference direction is deduced, the means for forming the reference line traces the reference according to said reference direction, said reference direction having a direction along which the plaquette is cleaved and means for tracing a cleavage line along said reference direction, on another face termed the rear face of the plaquette and in an area of this rear face which is located below said non useful area, so as to cleave the plaquette for breaking and further comprising: support means for supporting said plaquette, said plaquette resting on the support means through its rear face, these support means being mobile in translation along a first axis (X) and a second axis (Y) perpendicular to said first axis, said support means being, in addition, mobile in rotation around a third axis, which is perpendicular to the first and second axes and mobile in translation in a direction parallel to this third axis, means for maintaining the plaquette on said support means, microscopic means for observing of the head face of the plaquette along a sighting axis (Z) which is parallel to the third axis and which has means for locating the first and second axis, said microscopic means including at least one optical microscope observation device, and the means for forming a reference line traces the line when said support means are moved in translation along either one of said first and second axes, and wherein said means for forming an impression and said means for forming a reference line are connected to said optical observation device to define an assembly, said assembly being mobile such that the optical observation device, said means for forming an impression and said means for forming a reference line are positioned alternately along the sighting axis (Z), and wherein said means for tracing a cleavage line comprises a tracing member located below said support means and which is mobile in translation in directions parallel to said first (X), second (Y) and third axes, said support means includes a bored hole providing for the passage of said tracing member and said means for maintaining the plaquette prevents the lifting thereof when the tracing member passes against said plaquette.