US5172853A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for applying solder to printed wiring boards and printed wiring board to which solder has been applied
Assignee: Bus Elektronik & Co KG GmbH
•
Filing: 1991-12-02
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Granted: 1992-12-22
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Expires: 2011-12-02
Abstract
Abstract A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump-shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.
Inventors
- 👤 Werner Maiwald
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:13
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/043; H05K2203/05; H05K2203/0562; H05K2203/0568; H05K3/303; H05K3/305; H05K3/3452; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
89 words
A method for applying solder to printed wiring boards, which comprises: a) producing a printed wiring board with electrically conductive regions; b) applying soldering paste as a solder deposit on the electrically conductive regions; c) melting the solder deposits to form hump-shaped solid solder applications joined to the printed wiring board; and d) leveling out the hump-shaped solder applications by areally applying pressure to the solder applications in the direction of the printed wiring board, and reinforcing the leveling of the hump-shaped solder application by heating the applied solder.
Claim 2
Independent Claim
89 words
A method for applying solder to printed wiring boards, which comprises: a) producing a printed wiring board with electrically conductive regions; b) applying soldering paste as a solder deposit on the electrically conductive regions; c) melting the solder deposits to form hump-shaped solid solder applications joined to the printed wiring board; and d) leveling out the hump-shaped solder applications by areally applying pressure to the solder applications in the direction of the printed wiring board, and reinforcing the leveling of the hump-shaped solder application by heating the applied solder.
Claim 3
Dependent Claim
16 words
The method according to claim 1, which comprises applying non-eutectic soldering paste in method step b).
Claim 4
Dependent Claim
24 words
The method according to claim 1, which comprises applying the solder deposit to the electrically conductive regions in method step b) by screen printing.
Claim 5
Dependent Claim
24 words
The method according to claim 1, which comprises applying the solder deposit to the electrically conductive regions in method step b) by mask printing.
Claim 6
Dependent Claim
25 words
The method according to claim 1, which comprises applying the solder deposit to the electrically conductive regions in method step b) by a metering method.
Claim 7
Dependent Claim
33 words
The method according to claim 1, which comprises applying a dry film solder stop mask of defined layer thickness in method step a) to regions to which solder is not to be applied.
Claim 8
Dependent Claim
50 words
The method according to claim 6, which comprises dimensioning a quantity of the soldering paste in method step b) to make the flat-pressed solder application flush with a surface of the solder stop mask layer facing away from the printed wiring board after method step d) has been carried out.
Claim 9
Independent Claim
97 words
A method for applying solder to printed wiring boards, which comprises: a) producing a printed wiring board with electrically conductive regions and applying a dry film solder stop mask of defined layer thickness to regions to which solder is not to be applied; b) applying soldering paste as a solder deposit on the electrically conductive regions; c) melting the solder deposits to form hump-shaped solid solder applications joined to the printed wiring board; and d) leveling out the hump-shaped solder applications by areally applying pressure to the solder applications in the direction of the printed wiring board.
Claim 10
Independent Claim
97 words
A method for applying solder to printed wiring boards, which comprises: a) producing a printed wiring board with electrically conductive regions and applying a dry film solder stop mask of defined layer thickness to regions to which solder is not to be applied; b) applying soldering paste as a solder deposit on the electrically conductive regions; c) melting the solder deposits to form hump-shaped solid solder applications joined to the printed wiring board; and d) leveling out the hump-shaped solder applications by areally applying pressure to the solder applications in the direction of the printed wiring board.
Claim 11
Dependent Claim
16 words
The method according to claim 8, which comprises applying non-eutectic soldering paste in method step b).
Claim 12
Dependent Claim
24 words
The method according to claim 8, which comprises applying the solder deposit to the electrically conductive regions in method step b) by screen printing.
Claim 13
Dependent Claim
24 words
The method according to claim 8, which comprises applying the solder deposit to the electrically conductive regions in method step b) by mask printing.
Claim 14
Dependent Claim
25 words
The method according to claim 8, which comprises applying the solder deposit to the electrically conductive regions in method step b) by a metering method.
Claim 15
Dependent Claim
50 words
The method according to claim 8, which comprises dimensioning a quantity of the soldering paste in method step b) to make the flat-pressed solder application flush with a surface of the solder stop mask layer facing away from the printed wiring board after method step d) has been carried out.
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US2615768A
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EP0063304A2
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US4485166A
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DE3535685A1
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US4752027A
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JPH02113596A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-22 | 1996-06-22 | 1996-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-22 | 2000-06-22 | 2000-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-22 | 2004-06-22 | 2004-12-22 | $7700.00 | Window Closed / Lapsed |