US5168919A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Air cooled heat exchanger for multi-chip assemblies
Assignee: Hewlett Packard Development Co LP
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Filing: 1990-06-29
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Granted: 1992-12-08
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Expires: 2010-06-29
Abstract
Abstract An air-cooled self-contained evaporator and condenser apparatus with no external power source, the apparatus including a cold plate having a first surface with recesses formed therein in a matrix or array corresponding to the matrix or array of chips on a multi-chip module or unit. The opposite surface of the cold plate includes a finned arrangement which, in conjunction with the cold plate, forms part of an isolated evaporation chamber of the cooling unit, with the chamber housing a boilable fluid which changes phase from liquid to vapor. Positioned above and contiguous with the isolated chamber is a condensing chamber, including a plurality of tubular passageways, the external portions of which are finned for ready removal of heat. For attachment of the cold plate portion of the unit to the chips, suitable heat transfer slugs, such as aluminum nitride slugs, are affixed in the recesses, with opposites surfaces thereof bonded to the exposed faces of the chips. Heat is transferred from the chips through the slugs, through the cold plate to cause boiling of the fluid within the chamber, the vapors of which are condensed in the upper part of the cooling unit to thus return as fluid to the chamber.
Inventors
- 👤 Jack Berenholz
- 👤 John K. Bowman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:02
CPC Classifications
F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; F28D15/0266; H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F28F; F28F1/00; F28F1/10; F28F1/12; F28F1/24; F28F1/32; F28F3/00; F28F3/02; F28F3/04; F28F3/048; F28F3/12; H10W40/20; H10W40/22; H10W40/226
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
247 words
Apparatus for removing heat from at least one heat dissipating electronic component comprising: heat transfer means having first and second opposed surfaces; pocket means within said first surface, said pocket means having a floor and said walls that extend towards but not as far as said second surface; at least one thermally conductive member attached to an external surface of said component in heat transfer relation therewith, said at least one thermally conductive member secured in said pocket means to mount said component to said heat transfer means in thermally coupled, electrically isolated therewith, said at least one thermally conductive member substantially filling said pocket means to provide low thermal resistance paths from said component to said floor and sidewalls of said pocket means; chamber means including, as part thereof, at least a portion of said heat transfer means; a boilable liquid within said chamber means, said liquid being separated from said at least one component and having the characteristic of boiling to generate vapors in response to transfer of heat from said at least one component to said liquid via said heat transfer means; said heat transfer means further comprising a plurality of spaced apart heat transfer members protruding from said second surface into said boilable liquid to increase the heat transfer area of said heat transfer means; and condensing means in fluid flow connection with said chamber means for enabling condensing of said vapor and gravity return of the condensed fluid to said chamber means.
Claim 2
Dependent Claim
247 words
Apparatus for removing heat from at least one heat dissipating electronic component comprising: heat transfer means having first and second opposed surfaces; pocket means within said first surface, said pocket means having a floor and said walls that extend towards but not as far as said second surface; at least one thermally conductive member attached to an external surface of said component in heat transfer relation therewith, said at least one thermally conductive member secured in said pocket means to mount said component to said heat transfer means in thermally coupled, electrically isolated therewith, said at least one thermally conductive member substantially filling said pocket means to provide low thermal resistance paths from said component to said floor and sidewalls of said pocket means; chamber means including, as part thereof, at least a portion of said heat transfer means; a boilable liquid within said chamber means, said liquid being separated from said at least one component and having the characteristic of boiling to generate vapors in response to transfer of heat from said at least one component to said liquid via said heat transfer means; said heat transfer means further comprising a plurality of spaced apart heat transfer members protruding from said second surface into said boilable liquid to increase the heat transfer area of said heat transfer means; and condensing means in fluid flow connection with said chamber means for enabling condensing of said vapor and gravity return of the condensed fluid to said chamber means.
Claim 3
Dependent Claim
26 words
The apparatus according to claim 1 wherein said chamber means and said condensing means are formed as a hermetically sealed unit with said boilable liquid therein.
Claim 4
Dependent Claim
32 words
The apparatus according to claim 1 wherein said heat transfer members a comprise fins and said second surface is provided by a plate shaped member forming one wall of said chamber means.
Claim 5
Dependent Claim
33 words
The apparatus according to claim 1 wherein said condensing means includes auxiliary heat transfer means on the exterior thereof for exposure to air circulation for enabling cooling of vapors within said condensing means.
Claim 6
Dependent Claim
19 words
Apparatus according to claim 1, wherein said at least one thermally conductive member comprises a thermally conductive, dielectric material.
Claim 7
Dependent Claim
14 words
Apparatus according to claim 5, wherein said thermally conductive, dielectric material comprises aluminum nitride.
Claim 8
Dependent Claim
26 words
Apparatus according to claim 1, wherein a surface coating of dielectric is interposed between said at least one thermally conductive member and said heat transfer means.
Claim 9
Dependent Claim
189 words
Apparatus for removing heat from a matrix array of heat dissipating semiconductor devices comprising: a chamber including a heat transfer mounting surface external to said chamber, said heat transfer mounting surface having a like matrix of pockets formed therein, said pockets each having a floor and sidewalls that extend into said mounting surface; thermally conductive substrate accommodated and secured in respective ones of said pockets, said semiconductor devices attached to said substrate to closely space said semiconductor devices from said heat transfer mounting surface, said thermally conductive substrates providing electrically isolated low thermal resistance paths between said semiconductor devices and said heat transfer mounting surface through said floors sand said side walls of said pockets; a plurality of spaced apart heat transfer member extending into said chamber from the surface of said container opposite said heat transfer mounting surface; a boilable coolant disposed in said chamber and completely covering said heat transfer fins; and condenser means operatively communicating with said container means to receive said boilable coolant in a gaseous phase from said container means and to condense said boilable coolant from its gaseous phase into it liquid phase.
Claim 10
Dependent Claim
189 words
Apparatus for removing heat from a matrix array of heat dissipating semiconductor devices comprising: a chamber including a heat transfer mounting surface external to said chamber, said heat transfer mounting surface having a like matrix of pockets formed therein, said pockets each having a floor and sidewalls that extend into said mounting surface; thermally conductive substrate accommodated and secured in respective ones of said pockets, said semiconductor devices attached to said substrate to closely space said semiconductor devices from said heat transfer mounting surface, said thermally conductive substrates providing electrically isolated low thermal resistance paths between said semiconductor devices and said heat transfer mounting surface through said floors sand said side walls of said pockets; a plurality of spaced apart heat transfer member extending into said chamber from the surface of said container opposite said heat transfer mounting surface; a boilable coolant disposed in said chamber and completely covering said heat transfer fins; and condenser means operatively communicating with said container means to receive said boilable coolant in a gaseous phase from said container means and to condense said boilable coolant from its gaseous phase into it liquid phase.
Claim 11
Dependent Claim
24 words
The apparatus according to claim 8 further including passage means for returning the liquid coolant by gravity from said condenser means to said chamber.
Claim 12
Dependent Claim
36 words
The apparatus according to claim 9 wherein said condenser means includes an interior chamber means, and said chamber means, said chamber and said passage means are formed as a hermetically sealed unit with said coolant therein.
Claim 13
Dependent Claim
26 words
The apparatus according to claim 10 wherein said condenser means includes passage means with external fins and wherein the external fins are exposed to air circulation.
Claim 14
Dependent Claim
15 words
The apparatus according to claim 8, wherein said heat transfer members comprise spaced apart fins.
Claim 15
Dependent Claim
15 words
Apparatus according to claim 8, wherein said thermally conductive members are comprised of dielectric material.
Claim 16
Dependent Claim
13 words
Apparatus according to claim 8, where said electronic devices comprise integrated circuit devices.
Claim 17
Dependent Claim
23 words
Apparatus according to claim 8, wherein said thermally conductive members comprise aluminum nitride members having flanges overlapping said first surface adjacent said pockets.
Claim 18
Dependent Claim
26 words
Apparatus according to claim 8, wherein a surface coating of dielectric is interposed between said at least one thermally conductive member and said heat transfer means.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-08 | 1996-06-08 | 1996-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-08 | 2000-06-08 | 2000-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-08 | 2004-06-08 | 2004-12-08 | $7700.00 | Window Closed / Lapsed |