US5158657A
Expired / Lapsed
US
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Circuit substrate and process for its production
Assignee: Canon Inc
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Filing: 1991-03-21
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Granted: 1992-10-27
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Expires: 2011-03-21
Abstract
Abstract A circuit substrate has a substrate, a conductor wire provided on the substrate, a first insulating film that covers the conductor wire, and a conductive film that covers the first insulating film. At least one of the first insulating film and the conductive film is formed by electro-deposition coating.
Inventors
- 👤 Susumu Kadokura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 02:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0221; H05K3/00; H05K3/22; H05K3/28; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09809; H05K2201/09818; H05K2201/09981; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/46; H05K3/4644; H05K3/4664; Y; Y10; Y10T; Y10T428/00; Y10T428/25; Y10T428/251; Y10T428/252; Y10T428/254; Y10T428/256; Y10T428/257
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
49 words
A circuit substrate comprising a substrate, a conductive circuit pattern provided on said substrate, a first insulating film that covers said conductive circuit pattern, and a conductive film that covers said first insulating film, wherein both said first insulating film and said conductive film are formed by electro-depositing coating.
Claim 2
Dependent Claim
49 words
A circuit substrate comprising a substrate, a conductive circuit pattern provided on said substrate, a first insulating film that covers said conductive circuit pattern, and a conductive film that covers said first insulating film, wherein both said first insulating film and said conductive film are formed by electro-depositing coating.
Claim 3
Dependent Claim
18 words
A circuit substrate according to claim 1, wherein said conductive film is covered with a second insulating film.
Claim 4
Dependent Claim
17 words
A circuit substrate according to claim 2, wherein said second insulating film is formed by electro-deposition coating.
Claim 5
Dependent Claim
16 words
A circuit substrate according to claim 1, wherein said first insulating film comprises a ceramic powder.
Claim 6
Dependent Claim
16 words
A circuit substrate according to claim 3, wherein said second insulating film comprises a ceramic powder.
Claim 7
Dependent Claim
15 words
A circuit substrate according to claim 1, wherein said conductive film comprises a conductive powder.
Claim 8
Dependent Claim
30 words
A circuit substrate according to claim 6, wherein said conductive powder comprises a material selected from the group consisting of a metallized ceramic powder and a metallized natural mica powder.
Claim 9
Dependent Claim
47 words
A circuit substrate according to claim 6, wherein said conductive powder comprises a mixture selected from the group consisting of a metallized ceramic powder and a metallized natural mica powder and a material selected from the group consisting of a metallized resin powder and a metal powder.
Claim 10
Dependent Claim
38 words
A circuit substrate according to claim 1 wherein a second insulating film is provided to cover said conductive film, and said first insulating film, said conductive film and said second insulating film are all formed by electro-deposition coating.
Claim 11
Dependent Claim
88 words
A process for producing a circuit substrate, comprising a first step of forming on a substrate a circuit pattern comprising a conductor wire, a second step of porviding a first insulating film to cover the circuit pattern, and a third step of providing a conductive film to cover the first insulating film, wherein said second step and said third step each comprises an electro-deposition coating, said electro-deposition coating being carried out by immersing said substrate in an electro-deposition coating composition, and setting the conductor wire as an electrode.
Claim 12
Dependent Claim
88 words
A process for producing a circuit substrate, comprising a first step of forming on a substrate a circuit pattern comprising a conductor wire, a second step of porviding a first insulating film to cover the circuit pattern, and a third step of providing a conductive film to cover the first insulating film, wherein said second step and said third step each comprises an electro-deposition coating, said electro-deposition coating being carried out by immersing said substrate in an electro-deposition coating composition, and setting the conductor wire as an electrode.
Claim 13
Dependent Claim
36 words
A process for producing a circuit substrate according to claim 10, wherein the step of forming said conductive film is followed by a fourth step of providing a second insulating film to cover the conductive film.
Claim 14
Dependent Claim
19 words
A process for producing a circuit substrate according to claim 11, wherein said fourth step comprises an elector-deposition coating.
Claim 15
Dependent Claim
37 words
A process for producing a circuit substrate according to claim 10, wherein said second step comprises said electro-deposition coating, and wherein a ceramic powder is incorporated into said elecro-deposition coating composition to form the first insulating film.
Claim 16
Dependent Claim
35 words
A process for producing a circuit substrate according to claim 10, wherein third step comprises said electro-deposition coating and wherein a conductive powder is incorporated into said electro-deposition coating composition to form the conductive film.
Claim 17
Dependent Claim
34 words
A process for producing a circuit substrate according to claim 14, wherein said conductive powder comprises a material selected from the group consisting of a metallized ceramic powder and a metallized natural mica powder.
Claim 18
Dependent Claim
50 words
A process for producing a circuit substrate according to claim 14, wherein said conductive powder comprises a mixture selected from the group consisting of a metallized ceramic powder and a metallized natural mica powder and a material selected from the group consisting of metallized resin powder and a metal powder.
Claim 19
Dependent Claim
37 words
A process for producing a circuit substrate according to cliam 10, wherein said fourth step comprises said electro-depositing coating, and wherein a ceramic powder is incorporated into said electro-deposition coating composition to form the second insulating film.
Claim 20
Dependent Claim
37 words
A process for producing a circuit substrate according to cliam 10, wherein said fourth step comprises said electro-depositing coating, and wherein a ceramic powder is incorporated into said electro-deposition coating composition to form the second insulating film.
Claim 21
Dependent Claim
44 words
A process for producing a circuit substrate according to claim 10, wherein a fourth step is provided to form a second insulating film that covers the conductive film, and wherein said second step, said third step and said fourth step each comprises an electro-deposition.
References Cited (Backward Citations)
US4579882A
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JPS59223763A
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US4601916A
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JPS6438798A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-10-27 | 1996-04-27 | 1996-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-27 | 2000-04-27 | 2000-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-27 | 2004-04-27 | 2004-10-27 | $7700.00 | Window Closed / Lapsed |