US5157972A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pressure sensor with high modules support
Assignee: Rosemount Inc
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Filing: 1991-03-29
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Granted: 1992-10-27
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Expires: 2011-03-29
Abstract
Abstract A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.
Inventors
- 👤 David A. Broden
- 👤 Brian J. Bischoff
- 👤 Bennett L. Louwagie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:02
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0072; G01L9/0073; Y; Y10; Y10T; Y10T29/00; Y10T29/43
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
127 words
A fluid pressure sensor, comprising: a diaphragm layer having a layer face bounded by a layer rim, the layer face exposing a semiconductor bonding region surrounding a sensing diaphragm formed in the diaphragm layer; means coupling a fluid pressure to the sensing diaphragm to deflect the sensing diaphragm; means coupled to the sensing diaphragm for sensing the deflection and providing an output representative of pressure; a support block having first and second block faces bounded by a block rim, the first block face exposing a ceramic bonding region facing the semiconductor bonding region; and a thin film layer formed of a metal thin film disposed between the facing semiconductor and ceramic bonding regions, the thin film layer bonding the semiconductor bonding region to the ceramic bonding region.
Claim 2
Dependent Claim
127 words
A fluid pressure sensor, comprising: a diaphragm layer having a layer face bounded by a layer rim, the layer face exposing a semiconductor bonding region surrounding a sensing diaphragm formed in the diaphragm layer; means coupling a fluid pressure to the sensing diaphragm to deflect the sensing diaphragm; means coupled to the sensing diaphragm for sensing the deflection and providing an output representative of pressure; a support block having first and second block faces bounded by a block rim, the first block face exposing a ceramic bonding region facing the semiconductor bonding region; and a thin film layer formed of a metal thin film disposed between the facing semiconductor and ceramic bonding regions, the thin film layer bonding the semiconductor bonding region to the ceramic bonding region.
Claim 3
Dependent Claim
31 words
The sensor of claim 1, wherein the support block is formed of a brittle material having a modulus of elasticity substantially higher than the modulus of elasticity of the diaphragm layer.
Claim 4
Dependent Claim
29 words
The sensor of claim 2 wherein the means for applying fluid pressure to the diaphragm includes a pressure passageway between the first and second faces of the support block.
Claim 5
Dependent Claim
29 words
The sensor of claim 3 wherein the means for sensing deflection include a conductor disposed on the first face of the support block to capacitively couple to the diaphragm.
Claim 6
Dependent Claim
31 words
The sensor of claim 4 wherein the means for sensing deflection includes an electrical feedthrough lead connecting to the conductor and passing through the first support block to the second face.
Claim 7
Dependent Claim
15 words
The sensor of claim 5 wherein the electrical feedthrough lead passes through the pressure passageway.
Claim 8
Dependent Claim
31 words
The sensor of claim 5 wherein the support block further includes a feedthrough passageway extending between the first and second faces thereof, the electrical feedthrough lead passing through the feedthrough passageway.
Claim 9
Dependent Claim
39 words
The sensor of claim 5 wherein the means for coupling pressure further comprises an isolator filled with isolator fluid and including an isolator diaphragm and a metal tube coupling isolator fluid from the isolator diaphragm to the sensing diaphragm.
Claim 10
Dependent Claim
27 words
The sensor of claim 8 further comprising a ceramic tube sealingly coupling pressure from the metal tube to the pressure passageway, the ceramic tube providing stress isolation.
Claim 11
Dependent Claim
19 words
The sensor of claim 9 wherein the ceramic tube electrically isolates the metal tube from the electrical feedthrough means.
Claim 12
Dependent Claim
24 words
The sensor of claim 8 wherein an annular groove in cut into the second face of the first ceramic block to provide stress isolation.
Claim 13
Dependent Claim
15 words
The sensor of claim 8 wherein the metal tube is brazed into the pressure passageway.
Claim 14
Dependent Claim
33 words
The sensor of claim 8 wherein the support block are formed of a ceramic material having a temperature coefficient of expansion substantially matched to the temperature coefficient of expansion of the diaphragm layer.
Claim 15
Dependent Claim
30 words
The sensor of claim 8 wherein the support block has a thickness between its first and second faces that is at least 15 times the thickness of the diaphragm layer.
Claim 16
Dependent Claim
32 words
The sensor of claim 14 wherein the support block has a thickness between its first and second faces that is at least 15 to 40 times the thickness of the diaphragm layer.
Claim 17
Dependent Claim
111 words
A fluid pressure sensor, comprising: a diaphragm layer having a layer face bounded by a layer rim, the layer face exposing a semiconductor bonding region surrounding a sensing diaphragm formed in the diaphragm layer; means coupling a fluid pressure to the sensing diaphragm to deflect the sensing diaphragm; means coupled to the sensing diaphragm for sensing the deflection and providing an output representative of pressure; a thin film layer formed of a metal thin film bonded to the semiconductor bonding region; and a support block having first and second block faces bounded by a block rim, the first block face exposing a ceramic bonding region bonded to the semiconductor bonding region.
Claim 18
Dependent Claim
111 words
A fluid pressure sensor, comprising: a diaphragm layer having a layer face bounded by a layer rim, the layer face exposing a semiconductor bonding region surrounding a sensing diaphragm formed in the diaphragm layer; means coupling a fluid pressure to the sensing diaphragm to deflect the sensing diaphragm; means coupled to the sensing diaphragm for sensing the deflection and providing an output representative of pressure; a thin film layer formed of a metal thin film bonded to the semiconductor bonding region; and a support block having first and second block faces bounded by a block rim, the first block face exposing a ceramic bonding region bonded to the semiconductor bonding region.
Claim 19
Dependent Claim
33 words
The sensor of claim 16, wherein the support block is formed of an electrically insulating, sintered material having a modulus of elasticity substantially higher than the modulus of elasticity of the diaphragm layer.
Claim 20
Dependent Claim
29 words
The sensor of claim 17 wherein the means for applying fluid pressure to the diaphragm includes a pressure passageway between the first and second faces of the support block.
Claim 21
Dependent Claim
29 words
The sensor of claim 18 wherein the means for sensing deflection include a conductor disposed on the first face of the support block to capacitively couple to the diaphragm.
Claim 22
Dependent Claim
31 words
The sensor of claim 19 wherein the means for sensing deflection includes an electrical feedthrough lead connecting to the conductor and passing through the first support block to the second face.
Claim 23
Dependent Claim
15 words
The sensor of claim 20 wherein the electrical feedthrough lead passes through the pressure passageway.
Claim 24
Dependent Claim
31 words
The sensor of claim 20 wherein the support block further includes a feedthrough passageway extending between the first and second faces thereof, the electrical feedthrough lead passing through the feedthrough passageway.
Claim 25
Dependent Claim
39 words
The sensor of claim 20 wherein the means for coupling pressure further comprises an isolator filled with isolator fluid and including an isolator diaphragm and a metal tube coupling isolator fluid from the isolator diaphragm to the sensing diaphragm.
Claim 26
Dependent Claim
27 words
The sensor of claim 23 further comprising a ceramic tube sealingly coupling pressure from the metal tube to the pressure passageway, the ceramic tube providing stress isolation.
Claim 27
Dependent Claim
19 words
The sensor of claim 24 wherein the ceramic tube electrically isolates the metal tube from the electrical feedthrough means.
Claim 28
Dependent Claim
24 words
The sensor of claim 23 wherein an annular groove in cut into the second face of the first ceramic block to provide stress isolation.
Claim 29
Dependent Claim
15 words
The sensor of claim 23 wherein the metal tube is brazed into the pressure passageway.
Claim 30
Dependent Claim
33 words
The sensor of claim 23 wherein the support block are formed of a ceramic material having a temperature coefficient of expansion substantially matched to the temperature coefficient of expansion of the diaphragm layer.
Claim 31
Dependent Claim
30 words
The sensor of claim 23 wherein the support block has a thickness between its first and second faces that is at least 15 times the thickness of the diaphragm layer.
Claim 32
Dependent Claim
32 words
The sensor of claim 29 wherein the support block has a thickness between its first and second faces that is at least 15 to 40 times the thickness of the diaphragm layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-27 | 1996-04-27 | 1996-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-27 | 2000-04-27 | 2000-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-27 | 2004-04-27 | 2004-10-27 | $7700.00 | Window Closed / Lapsed |