US5156319A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire bonding inspection equipment
Assignee: Toshiba Corp
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Filing: 1991-09-12
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Granted: 1992-10-20
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Expires: 2011-09-12
Abstract
Abstract Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device are broken by a breaking unit, and a defect mark is applied on the defective semiconductor device by a defective mark putting unit in response to the defect signal, the defect mark applying unit applying the defect mark on an area other than an area to be covered with sealing material.
Inventors
- 👤 Mitsusada Shibasaka
- 👤 Yuichi Miyahara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:32
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/20; H10P74/203; H10P72/00; H10P72/06; H10P72/0614; H10P74/23; H10P74/27; H10W; H10W46/00; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W46/601; H10W72/0711; H10W72/07531; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
126 words
Wire bonding inspection equipment which is used in a wire bonding step for wire bonding a semiconductor device to a surrounding member, and which is used in a sealing step for sealing said semiconductor device, comprising: judging means for judging whether or not wire bonding is acceptable and for producing a defect signal when said semiconductor device is judged to be defective; breaking means, responsive to said defect signal, for breaking wires of a defective semiconductor device; and defect mark applying means for applying a defect mark on said defective semiconductor device in response to said defect signal, said defect mark applying means applying said defect mark on an area of said defective semiconductor device other than an area designated to be covered with sealing material.
Claim 2
Dependent Claim
126 words
Wire bonding inspection equipment which is used in a wire bonding step for wire bonding a semiconductor device to a surrounding member, and which is used in a sealing step for sealing said semiconductor device, comprising: judging means for judging whether or not wire bonding is acceptable and for producing a defect signal when said semiconductor device is judged to be defective; breaking means, responsive to said defect signal, for breaking wires of a defective semiconductor device; and defect mark applying means for applying a defect mark on said defective semiconductor device in response to said defect signal, said defect mark applying means applying said defect mark on an area of said defective semiconductor device other than an area designated to be covered with sealing material.
Claim 3
Dependent Claim
26 words
Wire bonding inspection equipment as recited in claim 1, wherein said defect mark applying means applies said defect mark after said breaking means breaks said wires.
Claim 4
Dependent Claim
51 words
Wire bonding inspection equipment as recited in claim 1, wherein said breaking means comprises: a pressing plate member for breaking all bonded wires of said defective semiconductor device; and means for moving said pressing plate member relative to said defective semiconductor device for breaking all wires of said defective semiconductor device.
Claim 5
Dependent Claim
63 words
Wire bonding inspection equipment as recited in claim 1, wherein said breaking means comprises: a motor; a disk, rotated by said motor, said disk having wires fixed thereto for breaking bonded wires of said defective semiconductor device; and means for moving said disk relative to said bonded wires of said defective semiconductor device for breaking said bonded wires of said defective semiconductor device.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-20 | 1996-04-20 | 1996-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-20 | 2000-04-20 | 2000-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-20 | 2004-04-20 | 2004-10-20 | $7700.00 | Window Closed / Lapsed |