← Back to Patent Explorer
US5153708A Expired / Lapsed US ⏱️ 0.0 years remaining

Tape carrier used in tab system

Assignee: Towa Corp
•
Filing: 1991-09-11
•
Granted: 1992-10-06
•
Expires: 2011-09-11
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprises a plurality of square frames, each including a substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, the square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends. At least two substantially rectangular first openings are formed within the mold area at a space between the square opening and an outer periphery of the mold area. A plurality of lead groups, extend from an inside of the square opening to positions adjacent to a periphery of the frame by crossing one of the first openings. At least one second opening is formed at a space between adjacent two of the first openings, and such that none of the leads extend across the second opening, thereby allowing a resin to flow therethrough in a process of resin-molding the integrated circuit chip mounted at the square opening.

Inventors

  • 👤 Naoharu Ohikata
  • 👤 Tadashi Kamiyama
  • 👤 Michio Osada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 13:33
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W74/00; H10W74/01; H10W74/016; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 199 words
A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprising a plurality of square frames, each of said square frames comprising: A substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, said square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends; first opening means including at least two substantially rectangular first openings formed within said mold area at a space between said square opening and an outer periphery of said mold area; a plurality of lead groups, each group including leads extending from an inside of said square opening to positions adjacent to a periphery of the frame by crossing one of said first openings; and second opening means including at least one second opening formed at a space between adjacent two said first openings, such that none of said leads extend across said second opening, for allowing a resin to flow therethrough in a process of resin-molding the integrated circuit chip mounted at the square opening.
Claim 2
Dependent Claim 199 words
A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprising a plurality of square frames, each of said square frames comprising: A substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, said square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends; first opening means including at least two substantially rectangular first openings formed within said mold area at a space between said square opening and an outer periphery of said mold area; a plurality of lead groups, each group including leads extending from an inside of said square opening to positions adjacent to a periphery of the frame by crossing one of said first openings; and second opening means including at least one second opening formed at a space between adjacent two said first openings, such that none of said leads extend across said second opening, for allowing a resin to flow therethrough in a process of resin-molding the integrated circuit chip mounted at the square opening.
Claim 3
Dependent Claim 31 words
A tape carrier according to claim 1, wherein said mold area is a square area and said at least one second opening is provided at one corner of said square area.
Claim 4
Dependent Claim 19 words
A tape carrier according to claim 1, wherein said second opening means includes a plurality of the second openings.
Claim 5
Dependent Claim 36 words
A tape carrier according to claim 1, wherein said mold area is a square area and said second opening means includes a plurality of the second openings provided respectively at the corners of said square area.

References Cited (Backward Citations)

JPH02188939A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-10-06 1996-04-06 1996-10-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-10-06 2000-04-06 2000-10-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-10-06 2004-04-06 2004-10-06 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag