US5139818A
Expired / Lapsed
US
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Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
Assignee: Motors Liquidation Co
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Filing: 1991-06-06
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Granted: 1992-08-18
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Expires: 2011-06-06
Abstract
Abstract Photochemical and electroless metallization techniques have been combined to create high resolution circuits with line widths and spaces of about one mil on alumina substrates. In this process, small amounts of a xylene-soluble platinum metallo-organic compound are first applied to the surface of the alumina substrate. A mask is then used to selectively expose the platinum metallo-organic compound to ultraviolet light in the areas that are to be metallized, so as to transform the platinum metallo-organic compound into a xylene-insoluble form. After a xylene rinse removes the original soluble platinum compound from the unexposed areas, the substrate is fired in air at about 450° C. for about five minutes, so as to pyrolize the insoluble, irradiated platinum metallo-organic compound into catalytically active platinum. This is followed by electroless deposition of copper onto the ultraviolet-treated regions where the catalytically active platinum resides.
Inventors
- 👤 Andrew M. Mance
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 02:45
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/50; C04B41/51; C04B41/5122; C04B41/52; C04B41/80; C04B41/81; C04B41/85; C04B41/88; C04B41/89; C23; C23C; C23C18/00; C23C18/14; C23C18/143; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/18; C23C18/1851; C23C18/1862; C23C18/1865; C23C18/1868; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/20; C23C18/28; C23C18/30; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; C04B2111/00; C04B2111/00474; C04B2111/00844; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
153 words
A method for applying catalytically active metal clusters onto a substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate, comprising the steps of: depositing a film of a metallo-organic solution onto the substrate, said metallo-organic solution comprising a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light for a duration sufficient to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature and for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into clusters of catalytically active platinum; such that said catalytically active platinum provides the catalyst for subsequent electroless copper deposition at said selectively irradiated regions, which thereby produce fine line, high resolution, geometries of copper on said substrate.
Claim 2
Independent Claim
153 words
A method for applying catalytically active metal clusters onto a substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate, comprising the steps of: depositing a film of a metallo-organic solution onto the substrate, said metallo-organic solution comprising a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light for a duration sufficient to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature and for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into clusters of catalytically active platinum; such that said catalytically active platinum provides the catalyst for subsequent electroless copper deposition at said selectively irradiated regions, which thereby produce fine line, high resolution, geometries of copper on said substrate.
Claim 3
Dependent Claim
44 words
A method for applying catalytically active metal clusters onto a ceramic substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate as recited in claim 1 wherein said substrate is alumina.
Claim 4
Dependent Claim
49 words
A method for applying catalytically active metal clusters onto a ceramic substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate as recited in claim 1 wherein said xylene-soluble platinum amine compound is tris(1,2-diaminopropane) platinum(IV) 2-ethylhexanoate.
Claim 5
Dependent Claim
51 words
A method for applying catalytically active metal clusters onto a ceramic substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate as recited in claim 1 wherein said deep ultraviolet light includes the wavelength of about 254 nanometers.
Claim 6
Dependent Claim
65 words
A method for applying catalytically active metal clusters onto a ceramic substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate as recited in claim 1, wherein said pyrolyzing step occurs at a temperature between about 300° C. and about 1000° C. and for a duration of up to about five minutes.
Claim 7
Independent Claim
182 words
A method for applying catalytically active metal clusters onto an alumina substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the alumina substrate, comprising the steps of: depositing a film of a metallo-organic solution onto the alumina substrate, said metallo-organic solution comprising a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light including the wavelength of about 254 nanometers for a duration sufficient to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; rinsing said substrate in xylene for a duration sufficient to remove said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature between about 300° and 1000° C. for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into clusters of catalytically active platinum; such that said catalytically active platinum provides the catalyst for subsequent electroless copper deposition at said selectively irradiated regions, which thereby produce fine line, high resolution, geometries of copper on said substrate.
Claim 8
Independent Claim
182 words
A method for applying catalytically active metal clusters onto an alumina substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the alumina substrate, comprising the steps of: depositing a film of a metallo-organic solution onto the alumina substrate, said metallo-organic solution comprising a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light including the wavelength of about 254 nanometers for a duration sufficient to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; rinsing said substrate in xylene for a duration sufficient to remove said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature between about 300° and 1000° C. for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into clusters of catalytically active platinum; such that said catalytically active platinum provides the catalyst for subsequent electroless copper deposition at said selectively irradiated regions, which thereby produce fine line, high resolution, geometries of copper on said substrate.
Claim 9
Dependent Claim
49 words
A method for applying catalytically active metal clusters onto a ceramic substrate for subsequent catalysis of electroless copper deposition, for the purpose of providing fine line, high resolution, geometries of copper on the substrate as recited in claim 6, wherein said xylene-soluble platinum amine compound is tris(1,2-diaminopropane) platinum(IV) 2-ethylhexanoate.
Claim 10
Independent Claim
150 words
A method for electrolessly depositing copper onto an alumina substrate comprising the steps of: selectively depositing a metal catalyst onto said alumina substrate prior to the electroless deposition of copper onto said alumina substrate, so that said selective contact defines said desired regions of subsequent electroless copper deposition, wherein the improvement comprises the following steps for depositing said metal catalyst onto said alumina substrate: depositing a film of a metallo-organic solution onto said alumina substrate, said metallo-organic solution being a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light so as to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; removing said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature sufficient to thermally decompose said xylene-insoluble platinum compound into catalytically active platinum at said selectively irradiated regions.
Claim 11
Independent Claim
150 words
A method for electrolessly depositing copper onto an alumina substrate comprising the steps of: selectively depositing a metal catalyst onto said alumina substrate prior to the electroless deposition of copper onto said alumina substrate, so that said selective contact defines said desired regions of subsequent electroless copper deposition, wherein the improvement comprises the following steps for depositing said metal catalyst onto said alumina substrate: depositing a film of a metallo-organic solution onto said alumina substrate, said metallo-organic solution being a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light so as to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; removing said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature sufficient to thermally decompose said xylene-insoluble platinum compound into catalytically active platinum at said selectively irradiated regions.
Claim 12
Dependent Claim
25 words
A method for electrolessly depositing copper onto an alumina substrate as recited in claim 8 wherein said xylene-soluble platinum amine compound is tris(1,2-diaminopropane) platinum(IV) 2-ethylhexanoate.
Claim 13
Dependent Claim
27 words
A method for electrolessly depositing copper onto an alumina substrate as recited in claim 8 wherein said deep ultraviolet light includes the wavelength of about 254 nanometers.
Claim 14
Dependent Claim
41 words
A method for electrolessly depositing copper onto an alumina substrate as recited in claim 8 wherein said pyrolyzing step occurs at a temperature between about 300° C. and about 1000° C. and for a duration of up to about five minutes.
Claim 15
Independent Claim
177 words
A method for electrolessly depositing copper onto an alumina substrate comprising the steps of: selectively depositing a metal catalyst onto said alumina substrate prior to the electroless deposition of copper onto said alumina substrate, so that said selective contact defines said desired regions of subsequent electroless copper deposition, wherein the improvement comprises the following steps for depositing said metal catalyst onto said alumina substrate: depositing a film of a metallo-organic solution onto said alumina substrate, said metallo-organic solution being a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light containing the wavelength of about 254 nanometers, so as to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; rinsing said substrate in xylene for a duration sufficient to remove said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature between about 300° C. and 1000° C. for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into catalytically active platinum at said selectively irradiated regions.
Claim 16
Independent Claim
177 words
A method for electrolessly depositing copper onto an alumina substrate comprising the steps of: selectively depositing a metal catalyst onto said alumina substrate prior to the electroless deposition of copper onto said alumina substrate, so that said selective contact defines said desired regions of subsequent electroless copper deposition, wherein the improvement comprises the following steps for depositing said metal catalyst onto said alumina substrate: depositing a film of a metallo-organic solution onto said alumina substrate, said metallo-organic solution being a xylene-soluble platinum amine compound; selectively irradiating said xylene-soluble platinum amine compound with deep ultraviolet light containing the wavelength of about 254 nanometers, so as to selectively transform said xylene-soluble platinum amine compound into a xylene-insoluble platinum compound; rinsing said substrate in xylene for a duration sufficient to remove said remaining xylene-soluble platinum amine compound from said substrate; and pyrolyzing said xylene-insoluble platinum compound in an oxygen-containing environment at a temperature between about 300° C. and 1000° C. for a duration sufficient to thermally decompose said xylene-insoluble platinum compound into catalytically active platinum at said selectively irradiated regions.
Claim 17
Dependent Claim
25 words
A method for electrolessly depositing copper onto an alumina substrate as recited in claim 12 wherein said xylene-soluble platinum amine compound is tris(1,2-diaminopropane) platinum(IV) 2-ethylhexanoate.
References Cited (Backward Citations)
US4201719A
Cited
US4268536A
Cited
US4481236A
Cited
US4622069A
Cited
US4574095A
Cited
US4650108A
Cited
US4686114A
Cited
US4808274A
Cited
US4962088A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-18 | 1996-02-17 | 1996-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-18 | 2000-02-17 | 2000-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-18 | 2004-02-17 | 2004-08-18 | $7700.00 | Window Closed / Lapsed |