Injector and method for delivering gaseous chemicals to a surface

Claim 2

An injector including a plurality of contiguous, consecutive chemical vapor distribution stages, each of said stages including a plurality of distribution channels leading to corresponding linear hole arrays, each of said stages serving to discretely receive a plurality of gases, each of said gases at each of said stages being diffused by said linear hole arrays, whereby said gases flow through said distribution stages and become increasingly laminar and uniform over an extended length.

Claim 3

The apparatus of claim 1 wherein said injector includes first, second, and third distribution stages, each of said stages including a plurality of linear hole arrays.

Claim 4

The apparatus of claim 2 wherein said first distribution stage includes a plurality of distribution channels, each of said distribution channels including a conduit and a plenum leading to a linear hole array.

Claim 5

The apparatus of claim 2 wherein said second distribution stage includes a plurality of distribution channels, each of said distribution channels including a slot and a trough leading to a linear hole array.

Claim 6

The apparatus of claim 2 wherein said third distribution stage includes a plurality of distribution channels, each of said distribution channels including a slot and a trough leading to a linear hole array.

Claim 7

The apparatus of claim 2 wherein said linear hole arrays of said third distribution stage include more holes than said linear hole arrays of said second distribution stage which include more holes than said linear hole arrays of said first distribution stage.

Claim 8

An injector, for uniformly depositing films or layers to a surface of a wafer or substrate, comprising: a first plate including a first multiple stage distribution channel; a second plate, positioned directly beneath and aligned with said first plate, including a second multiple stage distribution channel; a third plate, positioned directly beneath and aligned with said second plate, including a third multiple stage distribution channel; a chute with a passage positioned beneath said third plate; and a cooling plate positioned on both sides of said chute, the region between said chute and said cooling plate defining ducts, whereby said first plate receives a plurality of gases, each of said gases being individually conveyed to said first multiple stage distribution channel, said first multiple stage distribution channel thereby discretely conveying each of said gases to said aligned second plate, said second multiple stage distribution channel thereby discretely conveying each of said gases to said aligned third plate, said third multiple stage distribution channel thereby discretely conveying each of said gases to said chute such that said passage and said ducts directly convey each of said gases to a region above said surface where said gases are exposed to one another, react, and form a layer on said surface.

Claim 9

An injector, for uniformly depositing films or layers to a surface of a wafer or substrate, comprising: a first plate including a first multiple stage distribution channel; a second plate, positioned directly beneath and aligned with said first plate, including a second multiple stage distribution channel; a third plate, positioned directly beneath and aligned with said second plate, including a third multiple stage distribution channel; a chute with a passage positioned beneath said third plate; and a cooling plate positioned on both sides of said chute, the region between said chute and said cooling plate defining ducts, whereby said first plate receives a plurality of gases, each of said gases being individually conveyed to said first multiple stage distribution channel, said first multiple stage distribution channel thereby discretely conveying each of said gases to said aligned second plate, said second multiple stage distribution channel thereby discretely conveying each of said gases to said aligned third plate, said third multiple stage distribution channel thereby discretely conveying each of said gases to said chute such that said passage and said ducts directly convey each of said gases to a region above said surface where said gases are exposed to one another, react, and form a layer on said surface.

Claim 10

The apparatus of claim 7 wherein said first multiple stage distribution channel, said second multiple stage distribution channel, and said third multiple stage distribution channel each include three discrete linear hole arrays.

Claim 11

The apparatus of claim 7 wherein said first multiple stage distribution channel of said first plate includes a conduit and a plenum leading to a linear hole array.

Claim 12

The apparatus of claim 9 wherein said second multiple stage distribution channel of said second plate includes a slot and a trough leading to a linear hole array.

Claim 13

The apparatus of claim 10 wherein said third multiple stage distribution channel of said third plate includes a slot and a trough leading to a linear hole array.

Claim 14

The apparatus of claim 11 wherein said linear hole array of said third plate includes more holes than said linear hole array of said second plate which includes more holes than said linear hole array of said first plate.

Claim 15

In an atmospheric pressure chemical vapor deposition apparatus for depositing films or layers on wafers or substrates, said apparatus including a conveyor belt, a muffle, and a coating chamber with a chemical delivery system, a chemical injector, and an exhaust system, said coating chamber being positioned within said muffle such that said conveyer belt delivers said wafers or substrates to said coating chamber whereby said chemical injector distributes chemical vapors over the surface of said wafer or substrate for reaction and resultant film deposition on the surface of said wafer or substrate, the improvement comprising an injector which includes: a first plate including a plurality of discrete linear hole arrays, a conduit and a plenum leading to each of said first plate linear hole arrays; a second plate including a plurality of discrete linear hole arrays positioned beneath and aligned with said first plate, a slot and a trough leading to each of said second plate linear hole arrays; and a third plate including a plurality of discrete linear hole arrays positioned beneath and aligned with said second plate, a slot and a trough leading to each of said third plate linear hole arrays, a chute including a passage positioned beneath said third plate, and a cooling plate positioned on both sides of said chute, the region between said chute and said cooling plate defining ducts, whereby each of said gases is individually conveyed to said conduits of said first plate, said conduits discretely conveying said gases to said plenums and said plenums conveying said gases to said slots, troughs, and aligned linear hole arrays of said second plate, said second plate linear hole arrays thereby discretely conveying each of said gases to said slots, troughs, and aligned linear hole arrays of said third plate, each of said third plate linear hole arrays discretely conveying each of said gases to said chute such that said passage and said ducts discretely convey each of said gases to a region above said surface where said gases are exposed to one another and react.

Claim 16

In an atmospheric pressure chemical vapor deposition apparatus for depositing films or layers on wafers or substrates, said apparatus including a conveyor belt, a muffle, and a coating chamber with a chemical delivery system, a chemical injector, and an exhaust system, said coating chamber being positioned within said muffle such that said conveyer belt delivers said wafers or substrates to said coating chamber whereby said chemical injector distributes chemical vapors over the surface of said wafer or substrate for reaction and resultant film deposition on the surface of said wafer or substrate, the improvement comprising an injector which includes: a first plate including a plurality of discrete linear hole arrays, a conduit and a plenum leading to each of said first plate linear hole arrays; a second plate including a plurality of discrete linear hole arrays positioned beneath and aligned with said first plate, a slot and a trough leading to each of said second plate linear hole arrays; and a third plate including a plurality of discrete linear hole arrays positioned beneath and aligned with said second plate, a slot and a trough leading to each of said third plate linear hole arrays, a chute including a passage positioned beneath said third plate, and a cooling plate positioned on both sides of said chute, the region between said chute and said cooling plate defining ducts, whereby each of said gases is individually conveyed to said conduits of said first plate, said conduits discretely conveying said gases to said plenums and said plenums conveying said gases to said slots, troughs, and aligned linear hole arrays of said second plate, said second plate linear hole arrays thereby discretely conveying each of said gases to said slots, troughs, and aligned linear hole arrays of said third plate, each of said third plate linear hole arrays discretely conveying each of said gases to said chute such that said passage and said ducts discretely convey each of said gases to a region above said surface where said gases are exposed to one another and react.

Claim 17

The improvement of claim 13 wherein said first, second, and third plates include three discrete linear hole arrays.

Claim 18

The improvement of claim 13 wherein said linear hole arrays of said third plate include more holes than said linear hole arrays of said second plate which include more holes than said linear hole arrays of said first plate.