US5136827A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wrapping member for semiconductor device and method for manufacturing the wrapping member
Assignee: Toshiba Corp
•
Filing: 1990-10-12
•
Granted: 1992-08-11
•
Expires: 2010-10-12
Abstract
Abstract A wrapping member for holding semiconductor devices comprises a carrier tape and a seal tape. The carrier tape is embossed to form depressed portions, each of which is adapted to receive one semiconductor device. The seal tape is adhered to the carrier tape in a manner to successively cover the depressed portions. A thin metallic film is formed on the surface of at least one of the carrier tape and the seal tape.
Inventors
- 👤 Hiromichi Sawaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:41
CPC Classifications
B; B65; B65B; B65B11/00; B65B11/50; H; H05; H05K; H05K13/00; H05K13/0084
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
89 words
A method for manufacturing a wrapping member for holding semiconductor devices, comprising: a step for molding an organic material into a carrier tape embossed to form depressed portions for holding semiconductor devices and having a carbon-containing plastic body; a step of forming a thin metallic film on said plastic body; a step of forming an organic material into a seal tape for adhering to the carrier tape in a manner which successively covers the depressed portions; and a step of forming a thin metallic film on said seal tape.
Claim 2
Independent Claim
89 words
A method for manufacturing a wrapping member for holding semiconductor devices, comprising: a step for molding an organic material into a carrier tape embossed to form depressed portions for holding semiconductor devices and having a carbon-containing plastic body; a step of forming a thin metallic film on said plastic body; a step of forming an organic material into a seal tape for adhering to the carrier tape in a manner which successively covers the depressed portions; and a step of forming a thin metallic film on said seal tape.
References Cited (Backward Citations)
US4156751A
Cited
US4223512A
Cited
US4702788A
Cited
US4736841A
Cited
US4790433A
Cited
US4712675A
Cited
US4724958A
Cited
US4792042A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-11 | 1996-02-10 | 1996-08-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-11 | 2000-02-10 | 2000-08-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-11 | 2004-02-10 | 2004-08-11 | $7700.00 | Window Closed / Lapsed |