Patent US4271900A successfully refreshed from Google Patents.
US5136367A
Expired / Lapsed
US
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Low cost erasable programmable read only memory package
Assignee: Texas Instruments Inc
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Filing: 1990-08-31
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Granted: 1992-08-04
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Expires: 2010-08-31
Abstract
Abstract A semiconductor device and package includes a tape mounted semiconductor chip using bumped contacts, the top side of the chip is covered with a thin layer of ultra violet transmissive material, and a plastic removable frame surrounds the device and is removed after testing the device and prior to mounting the device on a printed circuit board.
Inventors
- 👤 Anthony M. Chiu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 04:13
CPC Classifications
G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/10; G11C16/18
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
102 words
A low cost package for Erasable-Programmable-Read-Only-Memory devices, including a tape leadframe having leads integrally connected to the top side of the semiconductor chip, comprising: a semiconductor chip attached to a tape leadframe, bumped contacts on the top side of the semiconductor device in electrical connection with the bumped leads on the lead frame; an ultra violet transmissive encapsulant material encapsulating the top side of the EPROM semiconductor device; and a removable molded frame attached to the leads and a portion of the leadframe, surrounding and spaced from the encapsulated semiconductor chip with a portion of the leads extending through the molded frame.
Claim 2
Dependent Claim
102 words
A low cost package for Erasable-Programmable-Read-Only-Memory devices, including a tape leadframe having leads integrally connected to the top side of the semiconductor chip, comprising: a semiconductor chip attached to a tape leadframe, bumped contacts on the top side of the semiconductor device in electrical connection with the bumped leads on the lead frame; an ultra violet transmissive encapsulant material encapsulating the top side of the EPROM semiconductor device; and a removable molded frame attached to the leads and a portion of the leadframe, surrounding and spaced from the encapsulated semiconductor chip with a portion of the leads extending through the molded frame.
Claim 3
Dependent Claim
42 words
The packaged semiconductor device according to claim 1, wherein the leads connected to the top side of the semiconductor chips are fanned out of the ultra violet transmissive coated semiconductor device and extend through the molded frame in two or more sides.
Claim 4
Dependent Claim
30 words
The packaged semiconductor device according to claim 2, wherein the leads extending through the molded frame are folded against the molded frame to provide test contacts to the semiconductor device.
Claim 5
Dependent Claim
27 words
The packaged semiconductor device according to claim 2, wherein the leads extending through the molded frame are straight to provide contacts from above and below the device.
Claim 6
Dependent Claim
24 words
The packaged semiconductor device according to claim 1, wherein the bumped contacts includes a barrier metal on aluminum, with a compliant bump of gold.
Claim 7
Dependent Claim
29 words
The packaged semiconductor device according to claim 1, wherein the bumped contacts includes barrier metal of TiW on aluminum, with a compliant bump of copper coated with protective metal.
Claim 8
Dependent Claim
16 words
The packaged semiconductor device according to claim 1, wherein the tape-leadframe leads have bumped contacts thereon.
Claim 9
Dependent Claim
20 words
The packaged semiconductor device according to claim 7, wherein the lead frame is a bumped copper tape plated with gold.
Claim 10
Dependent Claim
20 words
The packaged semiconductor device according to claim 7, wherein the lead frame is a bumped copper tape plated with palladium.
Claim 11
Dependent Claim
17 words
The packaged semiconductor device according to claim 7, wherein the leadframe is a bumped bare copper tape.
Claim 12
Dependent Claim
39 words
The packaged semiconductor device according to claim 1, wherein there are dam bars between leads, and including multiple sets of registration holes to align the device during the removal of the dam bars and the removal of the frame.
Claim 13
Dependent Claim
98 words
A low cost package for Erasable-Programmable-Read-Only-Memory devices, including a tape leadframe having leads integrally connected to the top side of the semiconductor chip, comprising: a semiconductor chip attached to a tape leadframe, non-bumped contacts on the top side of the semiconductor device in electrical connection with the bumped leads on the lead frame; an ultra violet transmissive encapsulant material encapsulating the top side of the semiconductor chip; a removable molded frame attached to the leads and a portion of the leadframe, surrounding and spaced from the semiconductor chip, a portion of the leads extending through the molded frame.
Claim 14
Dependent Claim
98 words
A low cost package for Erasable-Programmable-Read-Only-Memory devices, including a tape leadframe having leads integrally connected to the top side of the semiconductor chip, comprising: a semiconductor chip attached to a tape leadframe, non-bumped contacts on the top side of the semiconductor device in electrical connection with the bumped leads on the lead frame; an ultra violet transmissive encapsulant material encapsulating the top side of the semiconductor chip; a removable molded frame attached to the leads and a portion of the leadframe, surrounding and spaced from the semiconductor chip, a portion of the leads extending through the molded frame.
Claim 15
Dependent Claim
42 words
The packaged semiconductor device according to claim 12, wherein the leads connected to the top side of the semiconductor chip are fanned out of the ultra violet transmissive coated semiconductor device and extend through the molded frame in two or more sides.
Claim 16
Dependent Claim
31 words
The packaged semiconductor device according to claim 13, wherein the leads wires extending through the molded frame are folded against the molded frame to provide test contacts to the semiconductor device.
Claim 17
Dependent Claim
27 words
The packaged semiconductor device according to claim 14, wherein the leads extending through the molded frame are straight to provide contacts from above and below the device.
Claim 18
Dependent Claim
18 words
The packaged semiconductor device according to claim 12, wherein the bonding is made to bare aluminum bond pads.
Claim 19
Dependent Claim
24 words
The packaged semiconductor device according to claim 12, wherein bonding is made to aluminum bond pads coated with a thin layer of protective material.
Claim 20
Dependent Claim
16 words
The packaged semiconductor device according to claim 12, wherein the tape-leadframe leads have bumped contacts thereon.
Claim 21
Dependent Claim
20 words
The packaged semiconductor device according to claim 18, wherein the lead frame is a bumped copper tape plated with gold.
Claim 22
Dependent Claim
20 words
The packaged semiconductor device according to claim 18, wherein the lead frame is a bumped copper tape plated with palladium.
Claim 23
Dependent Claim
17 words
The packaged semiconductor device according to claim 18, wherein the leadframe is a bumped bare copper tape.
Claim 24
Dependent Claim
38 words
The packaged semiconductor device according to claim 12, wherein the tape leadframe includes dam bars between leads and includes multiple registration holes to align the device during the removal of dam bars and the removal of the frame.
Claim 25
Dependent Claim
22 words
The packaged semiconductor device according to claim 12, wherein the semiconductor chip and top-side encapsulant has less than a 40 mil thickness.
Claim 26
Dependent Claim
17 words
The packaged semiconductor device according to claim 18, wherein the leadframe is a flat bare copper tape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-04 | 1996-02-03 | 1996-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-04 | 2000-02-03 | 2000-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-04 | 2004-02-03 | 2004-08-04 | $7700.00 | Window Closed / Lapsed |