US5132038A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composition for preparing printed circuit through-holes for metallization
Assignee: MacDermid Acumen Inc
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Filing: 1990-04-18
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Granted: 1992-07-21
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Expires: 2010-04-18
Abstract
Abstract Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solution, the composition being in the form of a substantially homogeneous, substantially clear mixture comprised of a substantially water-immiscible organic material which acts upon the insulating substrate of the circuit board, water, an alkakli metal compound and a surfactant component. The composition is useful as a pretreatment prior to the use of an alkaline permanganate solution in a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
Inventors
- 👤 Peter E. Kukanskis
- 👤 Joseph J. D'Ambrisi
- 👤 John J. Kuzmik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:22
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0055; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; H05K2203/0786; H05K2203/0793; H05K2203/0796; H05K2203/12; H05K2203/122
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
159 words
A composition in the form of a substantially homogeneous, substantially clear mixture for use in treatment of through-hole surfaces in printed circuit boards, which are comprised of insulating substrate material, preparatory to contact of such surfaces with an alkaline permanganate solution, said composition consisting essentially of water; from about 5 to about 30% by weight of an organic liquid selected from the group consisting of compounds of the structural formula ##STR3## where n is an integer from 1 to 4, an alkali metal compound in an amount up to about 10% by weight, selected from the group consisting of alkali metal hydroxide, alkali metal carbonate, alkali metal phosphate, alkali metal siliate, and mixtures thereof; and a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR4## where n is an integer from 1 to 20, glucosides, alkyl haphthalene sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
Claim 2
Dependent Claim
159 words
A composition in the form of a substantially homogeneous, substantially clear mixture for use in treatment of through-hole surfaces in printed circuit boards, which are comprised of insulating substrate material, preparatory to contact of such surfaces with an alkaline permanganate solution, said composition consisting essentially of water; from about 5 to about 30% by weight of an organic liquid selected from the group consisting of compounds of the structural formula ##STR3## where n is an integer from 1 to 4, an alkali metal compound in an amount up to about 10% by weight, selected from the group consisting of alkali metal hydroxide, alkali metal carbonate, alkali metal phosphate, alkali metal siliate, and mixtures thereof; and a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR4## where n is an integer from 1 to 20, glucosides, alkyl haphthalene sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
Claim 3
Dependent Claim
15 words
The composition according to claim 1 wherein said organic liquid is ethylene glycol phenyl ether.
Claim 4
Dependent Claim
37 words
The composition to claim 1 wherein said surfactant component is selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR5## where n is an integer from 1 to 20, and mixtures thereof.
Claim 5
Dependent Claim
25 words
The composition according to claim 1 wherein said alkali metal compound is present in an amount of from about 5 to about 10% by weight.
Claim 6
Dependent Claim
21 words
The composition according to any of claims 3 or 1. wherein said disulfonated alkyl diphenyl oxide is sodium N-hexyl diphenyloxide disulfonate.
Claim 7
Dependent Claim
120 words
A composition in the form of substantially homogeneous, substantially clear mixture for use in treatment of through-holes surfaces in printed circuit boards, comprised of insulating substrate material, preparatory to contact as such surfaces with an alkaline permanganate solution, said composition consisting essentially of water; from about 5 to about 30% by weight of propylene glycol phenyl ether; from about 5 to about 10% of sodium hydroxide; and from about 5 to about 50% by weight of a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR6## where n is an integer from 1 to 20, glucosides, alkyl naphthalnee sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
Claim 8
Dependent Claim
120 words
A composition in the form of substantially homogeneous, substantially clear mixture for use in treatment of through-holes surfaces in printed circuit boards, comprised of insulating substrate material, preparatory to contact as such surfaces with an alkaline permanganate solution, said composition consisting essentially of water; from about 5 to about 30% by weight of propylene glycol phenyl ether; from about 5 to about 10% of sodium hydroxide; and from about 5 to about 50% by weight of a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR6## where n is an integer from 1 to 20, glucosides, alkyl naphthalnee sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
Claim 9
Dependent Claim
17 words
The composition according to claim 8 wherein said disulfonated alkyl diphenyl oxide is sodium N-hexyl diphenyloxide disulfonate.
Claim 10
Dependent Claim
136 words
A composition in the form of a substantially homogeneous, substantially, clear mixture for use in treatment of through-hole surfaces in printed circuit boards, which are comprised of insulating substrate material, preparatory to contact of such surfaces with an alkaline permanganate solution said composition consisting essentially of water; from 5 to 30% by weight of 1 -phenoxy -2-propanol; and alkali metal compound in an amount up to about 10% by weight, selected from the group consisting of alkali metal hydroxide, alkali metal carbonate, alkali metal phosphate, alkali metal silicate, and mixtures thereof; and a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR7## where n is a integer from 1 to 20, glucosides, alkyl naphthalene sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
Claim 11
Dependent Claim
136 words
A composition in the form of a substantially homogeneous, substantially, clear mixture for use in treatment of through-hole surfaces in printed circuit boards, which are comprised of insulating substrate material, preparatory to contact of such surfaces with an alkaline permanganate solution said composition consisting essentially of water; from 5 to 30% by weight of 1 -phenoxy -2-propanol; and alkali metal compound in an amount up to about 10% by weight, selected from the group consisting of alkali metal hydroxide, alkali metal carbonate, alkali metal phosphate, alkali metal silicate, and mixtures thereof; and a surfactant component selected from the group consisting of disulfonated alkyl diphenyl oxides corresponding to the formula ##STR7## where n is a integer from 1 to 20, glucosides, alkyl naphthalene sodium sulfonates, tetrasodium-N-alkylsulfonsuccinates, organic phosphate esters, benzene sulfonic acid sodium salt, and mixtures thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-21 | 1996-01-20 | 1996-07-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-21 | 2000-01-20 | 2000-07-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-21 | 2004-01-20 | 2004-07-21 | $7700.00 | Window Closed / Lapsed |