US5130783A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible film semiconductor package
Assignee: Texas Instruments Inc
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Filing: 1991-03-04
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Granted: 1992-07-14
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Expires: 2011-03-04
Abstract
Abstract A thin film package is formed using a lost cost TAB interconnection on a semiconductor device and sandwiching the device between thin films of plastic to form a sealed, thin, light weight package for the semiconductor device.
Inventors
- 👤 Neil R. McLellan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 04:23
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W72/00; H10W72/071; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/40; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
105 words
A thin film semiconductor device package, comprising: a semiconductor device; a plurality of leads having one end attached to the semiconductor device and a second end extending away from the semiconductor device; a first thin film on one side of the semiconductor die and leads; and a second thin film on the side of the semiconductor die and leads opposite said first thin film; wherein said first and second thin films are bonded to each other between said leads, and bonded to said leads to form a sealed thin film package for said semiconductor device, with said second ends extending from said thin film package.
Claim 2
Dependent Claim
105 words
A thin film semiconductor device package, comprising: a semiconductor device; a plurality of leads having one end attached to the semiconductor device and a second end extending away from the semiconductor device; a first thin film on one side of the semiconductor die and leads; and a second thin film on the side of the semiconductor die and leads opposite said first thin film; wherein said first and second thin films are bonded to each other between said leads, and bonded to said leads to form a sealed thin film package for said semiconductor device, with said second ends extending from said thin film package.
Claim 3
Dependent Claim
20 words
The thin film package according to claim 1, wherein said first and second thin films have an ultrasonic bond therebetween.
Claim 4
Dependent Claim
41 words
The thin film package according to claim 1, wherein said second lead ends extend out from where said first and second thin films are bonded to each other between said leads, and where said thin films are bonded to said leads.
Claim 5
Dependent Claim
34 words
The thin film package according to claim 1, including a metal ring within the thin film package supporting the thin film in the region where the lead ends are attached to the semiconductor device.
Claim 6
Dependent Claim
17 words
The thin film package according to claim 1, wherein the thin film is a polyphenylene sulfide resin.
Claim 7
Dependent Claim
21 words
The thin film package according to claim 1, wherein the leads are connected to the semiconductor device with a TAB bond.
Claim 8
Dependent Claim
22 words
The thin film package according to claim 1, wherein the thin film a plurality of semiconductor devices on a continuous leadframe strip.
Claim 9
Dependent Claim
130 words
A thin film semiconductor device package, comprising: a semiconductor device; a plurality of leads having one end attached to the semiconductor device and a second end extend away from the semiconductor device; a first thin film on one side of the semiconductor die and leads; a second thin film on the side of the semiconductor die and leads opposite said first thin film; and a metal ring within the thin film package supporting the thin film in the region where the lead ends are attached to the semiconductor device. wherein said first and second thin films are bonded to each other between said leads and bonded to said leads to form a sealed thin film package for said semiconductor device with said second ends extending from said thin film package.
Claim 10
Dependent Claim
130 words
A thin film semiconductor device package, comprising: a semiconductor device; a plurality of leads having one end attached to the semiconductor device and a second end extend away from the semiconductor device; a first thin film on one side of the semiconductor die and leads; a second thin film on the side of the semiconductor die and leads opposite said first thin film; and a metal ring within the thin film package supporting the thin film in the region where the lead ends are attached to the semiconductor device. wherein said first and second thin films are bonded to each other between said leads and bonded to said leads to form a sealed thin film package for said semiconductor device with said second ends extending from said thin film package.
Claim 11
Dependent Claim
20 words
The thin film package according to claim 8, wherein said first and second thin films have an ultrasonic bond therebetween.
Claim 12
Dependent Claim
41 words
The thin film package according to claim 8, wherein said second lead ends extend out from where said first and second thin films are bonded to each other between said leads, and where the thin films are bonded to said leads.
Claim 13
Dependent Claim
17 words
The thin film package according to claim 8, wherein the thin film is a polyphenylene sulfide resin.
Claim 14
Dependent Claim
21 words
The thin film package according to claim 8, wherein the leads are connected to the semiconductor device with a TAB bond.
Claim 15
Dependent Claim
23 words
The thin film package according to claim 8, wherein the thin film seals a plurality of semiconductor devices on a continuous leadframe strip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-07-14 | 1996-01-13 | 1996-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-14 | 2000-01-13 | 2000-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-14 | 2004-01-13 | 2004-07-14 | $7700.00 | Window Closed / Lapsed |