Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
178 words
A substrate for growing a gallium nitride compound-semiconductor device (Al x Ga 1-x N: X=0 inclusive), comprising: a sapphire substrate; and a buffer layer formed on said sapphire substrate, said buffer layer being formed by the metalorganic vapor phase epitaxy method (MOVPE) comprising growing a layer by flowing different kinds of organometallic gas in unturbulent state over the surface of said sapphire substrate and reacting said different kinds of organometallic gas near said surface of said substrate, said buffer layer being composed of aluminum nitride (AlN) showing a pattern mixed with a lattice pattern indicating single crystal and a halo pattern indicating amorphous state on the photographic image obtained by a reflective high energy electron diffraction method (RHEED), and being formed at a condition that the incident angle of said organometallic gas flow at the inlet side of said sapphire substrate against said surface of said sapphire substrate is in the range from 90° to 75°, and being formed in the state where said sapphire substrate is arranged inside a tube covering the upper surface of said substrate.
Claim 2
Dependent Claim
178 words
A substrate for growing a gallium nitride compound-semiconductor device (Al x Ga 1-x N: X=0 inclusive), comprising: a sapphire substrate; and a buffer layer formed on said sapphire substrate, said buffer layer being formed by the metalorganic vapor phase epitaxy method (MOVPE) comprising growing a layer by flowing different kinds of organometallic gas in unturbulent state over the surface of said sapphire substrate and reacting said different kinds of organometallic gas near said surface of said substrate, said buffer layer being composed of aluminum nitride (AlN) showing a pattern mixed with a lattice pattern indicating single crystal and a halo pattern indicating amorphous state on the photographic image obtained by a reflective high energy electron diffraction method (RHEED), and being formed at a condition that the incident angle of said organometallic gas flow at the inlet side of said sapphire substrate against said surface of said sapphire substrate is in the range from 90° to 75°, and being formed in the state where said sapphire substrate is arranged inside a tube covering the upper surface of said substrate.
Claim 3
Dependent Claim
19 words
A substrate according to claim 1, wherein said buffer layer is formed in a thickness of 100 to 500Å.
Claim 4
Dependent Claim
36 words
A substrate according to claim 1, wherein said buffer layer is grown at a condition that the growing temperature is from a temperature of 380° C. or more to a temperature of less than 550° C.
Claim 5
Dependent Claim
19 words
A substrate according to claim 3, wherein said buffer layer is formed in a thickness of 100 to 500Å.
Claim 6
Dependent Claim
34 words
A substrate according to claim 1, wherein said interval between said tube and said surface of said sapphire substrate arranged inside of said tube gets narrow along the flowing direction of said organometallic gas.
Claim 7
Dependent Claim
188 words
A light emitting diode comprising: a sapphire substrate; a buffer layer formed on said sapphire substrate, said buffer layer being formed by a metalorganic vapor phase epitaxy method (MOVPE) comprising growing a layer by flowing different kinds of organometallic gas in unturbulent state over the surface of said sapphire substrate and reacting said different kinds of organometallic gas near said surface of said substrate, said buffer layer being composed of aluminum nitride (AlN) showing a pattern mixed with a lattice pattern indicating single crystal and a halo pattern indicating amorphous state on the photographic image obtained by a reflective high energy electron diffraction method (RHEED), and being formed at a condition that the incident angle of said organometallic gas flow at the inlet side of said sapphire substrate against said surface of said sapphire substrate is in the range from 90° to 75°, and being formed in the state where said sapphire substrate is arranged inside of a tube covering the upper surface of said substrate; and a layer for emitting light comprising gallium nitride compound-semiconductor (Al x Ga 1-x N; X=0 inclusive) formed on said buffer layer.
Claim 8
Dependent Claim
188 words
A light emitting diode comprising: a sapphire substrate; a buffer layer formed on said sapphire substrate, said buffer layer being formed by a metalorganic vapor phase epitaxy method (MOVPE) comprising growing a layer by flowing different kinds of organometallic gas in unturbulent state over the surface of said sapphire substrate and reacting said different kinds of organometallic gas near said surface of said substrate, said buffer layer being composed of aluminum nitride (AlN) showing a pattern mixed with a lattice pattern indicating single crystal and a halo pattern indicating amorphous state on the photographic image obtained by a reflective high energy electron diffraction method (RHEED), and being formed at a condition that the incident angle of said organometallic gas flow at the inlet side of said sapphire substrate against said surface of said sapphire substrate is in the range from 90° to 75°, and being formed in the state where said sapphire substrate is arranged inside of a tube covering the upper surface of said substrate; and a layer for emitting light comprising gallium nitride compound-semiconductor (Al x Ga 1-x N; X=0 inclusive) formed on said buffer layer.
Claim 9
Dependent Claim
21 words
A light emitting diode according to claim 6, wherein said buffer layer is formed in a thickness of 100 to 500Å.
Claim 10
Dependent Claim
38 words
A light emitting diode according to claim 6, wherein said buffer layer is grown at a condition that the growing temperature is from a temperature of 380° C. or more to a temperature of less than 800° C.
Claim 11
Dependent Claim
21 words
A light emitting diode according to claim 8, wherein said buffer layer is formed in a thickness of 100 to 500Å.
Claim 12
Dependent Claim
36 words
A light emitting diode according to claim 6, wherein said interval between said tube and said face of said sapphire substrate arranged inside of said tube gets narrow along the flowing direction of said organometallic gas.