US5121875A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wave soldering in a protective atmosphere enclosure over a solder pot
Assignee: Praxair Technology Inc
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Filing: 1991-10-03
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Granted: 1992-06-16
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Expires: 2011-10-03
Abstract
Abstract A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.
Inventors
- 👤 Lawrence J. Hagerty
- 👤 Mark S. Nowotarski
- 👤 David A. Diamantopoulous
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; B23K35/00; B23K35/22; B23K35/38; H05K2203/00; H05K2203/08; H05K2203/086; H05K3/3489
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
55 words
A method for wave soldering metal comprising surfaces on a printed circuit board, said method comprising: (a) applying no-clean flux to the board in air; (b) preheating the board in air; (c) attaching the board to a solder wave in a protective atmosphere; (d) detaching the board from the solder wave in a controlled atmosphere;
Claim 2
Independent Claim
55 words
A method for wave soldering metal comprising surfaces on a printed circuit board, said method comprising: (a) applying no-clean flux to the board in air; (b) preheating the board in air; (c) attaching the board to a solder wave in a protective atmosphere; (d) detaching the board from the solder wave in a controlled atmosphere;
Claim 3
Dependent Claim
30 words
The invention as in claim 1 wherein the flux is applied to provide a layer of flux not more than 4 microns thick after evaporation of solvents from the flux.
Claim 4
Dependent Claim
15 words
The invention as in claim 1 wherein the flux comprises a di-basic acid in solvent.
Claim 5
Dependent Claim
15 words
The invention as in claim 1 wherein the flux comprises adipic acid in a solvent.
Claim 6
Dependent Claim
18 words
The invention as in claim 1 wherein the flux compises adipic acid in ethyl alcohol or isopropyl alcohol.
Claim 7
Dependent Claim
28 words
The invention as in claim 1 wherein the board is preheated to a temperature in the range from 70° C. to the melting point of the solder used.
Claim 8
Dependent Claim
30 words
The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 5% oxygen by volume.
Claim 9
Dependent Claim
31 words
The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 100 ppm oxygen by volume.
Claim 10
Dependent Claim
31 words
The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 10 ppm oxygen by volume.
Claim 11
Dependent Claim
44 words
The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 5% oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.
Claim 12
Dependent Claim
45 words
The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 100 ppm oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.
Claim 13
Dependent Claim
45 words
The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 10 ppm oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.
Claim 14
Dependent Claim
19 words
The invention as in claim 1 wherein the protective atmosphere for attaching to the solder includes a mono-carboxylic acid.
Claim 15
Dependent Claim
18 words
The invention as in claim 1 wherein the protective atmosphere for attaching to the solder includes formic acid.
Claim 16
Dependent Claim
24 words
The invention as in claim 1 wherein the atmosphere maintained above the board has a lower density than the atmosphere maintained below the board.
Claim 17
Dependent Claim
43 words
The invention as in claim 1 wherein said atmospheres are provided by supplying nitrogen gas containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 4,000 and 40,000.
Claim 18
Dependent Claim
49 words
The invention as in claim 1 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 2,000 and 20,000.
Claim 19
Dependent Claim
65 words
The invention as in claim 1 wherein said steps for attaching to and detaching from a solder wave are performed by admitting the board through an inlet into a hood enclosing not more than a solder pot containing the solder wave attaching the board to and detaching the board from the solder wave within said hood; egressing the board through an exit in said hood.
Claim 20
Dependent Claim
65 words
The invention as in claim 1 wherein said atmospheres are supplied by a first gas distributor below the board in the region of attachment of the board to the solder wave, a second gas distributor above the board in the region above the solder wave, and a third gas distributor below the board in the region of detachment of the board from the solder wave.
Claim 21
Dependent Claim
23 words
The invention as in claim 19 wherein gas is supplied to emanate in a laminar flow from at least one of said distributors.
Claim 22
Dependent Claim
70 words
The invention as in claim 18 wherein said atmospheres are provided by supplying nitrogen gas containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 5 and 50 times the curtained and uncurtained areas (in square centimeters) of both the hood entrance and exit and any other uncurtained openings including leakage openings in said hood.
Claim 23
Dependent Claim
76 words
The invention as in claim 18 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 2.5 and 25 times the curtained and uncurtained areas (in square centimeters) of both the hood entrance and exit and any other uncurtained openings including leakage openings in said hood.
Claim 24
Dependent Claim
74 words
The invention as in claim 18 wherein said atmospheres are provided by supplying nitrogen gas at a flow rate (in normal cubic centimeters per second) of 2,000 plus between 40 and 60 times the uncurtained area (in square centimeters) in said hood times the -0.1 power of the difference between the oxygen concentration (in ppm by volume) desired in said atmospheres and the oxygen concentration (in ppm by volume) in the supplied nitrogen gas.
Claim 25
Dependent Claim
80 words
The invention as in claim 18 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof at a flow rate (in normal cubic centimeters per second) of 1,000 plus between 20 and 30 times the uncurtained area (in square centimeters) in said hood times the -0.1 power of the difference between the oxygen concentration (in ppm by volume) desired in said atmospheres and the oxygen concentration (in ppm by volume) in the supplied nitrogen gas.
References Cited (Backward Citations)
JPS542243A
Cited
US4606493A
Cited
US4538757A
Cited
US4610391A
Cited
US4921156A
Cited
US4821947A
Cited
US5076487A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-16 | 1995-12-16 | 1996-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-16 | 1999-12-16 | 2000-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-16 | 2003-12-16 | 2004-06-16 | $7700.00 | Window Closed / Lapsed |