US5116440A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacturing multilayer printed wiring board
Assignee: Risho Kogyo Co Ltd
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Filing: 1990-02-06
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Granted: 1992-05-26
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Expires: 2010-02-06
Abstract
Abstract In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.
Inventors
- 👤 Kazunori Takeguchi
- 👤 Kohji Hirata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:25
CPC Classifications
B; B32; B32B; B32B37/00; B32B37/14; B32B37/16; B32B37/18; B32B37/182; B32B37/0007; B32B37/0023; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4697; B29; B29L; B29L2031/00; B29L2031/34; B29L2031/3425; B32B2457/00; B32B2457/08; H05K1/00; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/10; H05K2201/10007; H05K2201/10204; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/11; H05K2203/1147
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
180 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet has a plurality of layers, at least two of said layers having different elastic moduli.
Claim 2
Dependent Claim
180 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet has a plurality of layers, at least two of said layers having different elastic moduli.
Claim 3
Dependent Claim
19 words
A process as claimed in claim 1, wherein said rubber or composite rubber sheet is formed with a hole.
Claim 4
Dependent Claim
19 words
A process as claimed in claim 1, wherein said rubber or composite rubber sheet is formed with a recess.
Claim 5
Dependent Claim
146 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a plurality of layers, at least two of said layers having different elastic moduli.
Claim 6
Dependent Claim
146 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a plurality of layers, at least two of said layers having different elastic moduli.
Claim 7
Dependent Claim
19 words
A process as claimed in claim 4, wherein said rubber or composite rubber sheet is formed with a hole.
Claim 8
Dependent Claim
19 words
A process as claimed in claim 4, wherein said rubber or composite rubber sheet is formed with a recess.
Claim 9
Dependent Claim
136 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet is formed with a hole.
Claim 10
Dependent Claim
136 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet is formed with a hole.
Claim 11
Dependent Claim
136 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet is formed with a recess.
Claim 12
Dependent Claim
136 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet is formed with a recess.
Claim 13
Dependent Claim
170 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet is formed with a hole.
Claim 14
Dependent Claim
170 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet is formed with a hole.
Claim 15
Dependent Claim
170 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet is formed with a recess.
Claim 16
Dependent Claim
170 words
A process for manufacturing a multilayer printed wiring board for mounting an electronic device, comprising the steps of putting a prepreg with a hole on a printed wiring board, putting a copper clad laminate with a hole or a second printed wiring board with a hole on said prepreg so that the hole in said prepreg will be in alignment with the hole in said laminate or said second printed wiring board to form a cavity, mounting a rubber or composite rubber sheet in said cavity to form an assembly, applying heat and pressure to said assembly to melt said prepreg and bond said laminate or said second printed wiring board with said printed wiring board, and removing said rubber or composite rubber sheet, wherein said rubber or composite rubber sheet has a smaller size than said cavity and a larger thickness than the depth of said cavity, wherein said rubber or composite rubber sheet is elastic, and wherein said rubber or composite rubber sheet is formed with a recess.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-26 | 1995-11-25 | 1996-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-26 | 1999-11-25 | 2000-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-26 | 2003-11-25 | 2004-05-26 | $7700.00 | Window Closed / Lapsed |