US5114780A
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Electronic articles containing a fluorinated poly(arylene ether) dielectric
Assignee: Honeywell International Inc
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Filing: 1990-09-17
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Granted: 1992-05-19
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Expires: 2010-09-17
Abstract
Abstract An electronic article such as a multichip module or an integrated circuit chip has a multilayer interconnect with multiple layers of conductive material and a dielectric material made of a fluorinated poly(arylene ether) having a repeat unit such as <IMAGE>
Inventors
- 👤 Frank W. Mercer
- 👤 Timothy D. Goodman
- 👤 Aldrich N. K. Lau
- 👤 Lanchi P. Vo
- 👤 Richard C. Sovish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; C; C08; C08G; C08G65/00; C08G65/34; C08G65/38; C08G65/40; C08G65/4006; C08G75/00; C08G75/20; C08G75/23; C08L; C08L81/00; C08L81/06; C08G2650/00; C08G2650/02; C08G2650/20; C08G2650/28; C08G2650/46; C08G2650/48; C08L2203/00; C08L2203/20; C08L2312/00; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
184 words
A multichip module comprising a substrate, a plurality of semiconductor chips carried on the substrate, and a multilayer interconnect which connects the semiconductor chips and comprises plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR30## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR31## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 2
Dependent Claim
184 words
A multichip module comprising a substrate, a plurality of semiconductor chips carried on the substrate, and a multilayer interconnect which connects the semiconductor chips and comprises plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR30## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR31## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 3
Dependent Claim
16 words
A multichip module according to claim 1, wherein in the fluorinated poly(arylene ether) --W-- is ##STR32##
Claim 4
Dependent Claim
14 words
A multichip module according to claim 1, wherein in the fluorinated poly(arylene ether) ##STR33##
Claim 5
Dependent Claim
24 words
A multichip module according to claim 1, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR34##
Claim 6
Dependent Claim
24 words
A multichip module according to claim 1, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR35##
Claim 7
Dependent Claim
104 words
A multichip module according to claim 1 or 5, wherein the fluorinated poly(arylene ether) has been crosslinked with a bistriazene compound of the formula ##STR36## wherein --R 1 , --R 2 , --R 3 , and --R 4 are independently --H, --C 6 H 5 , --C 6 H 4 Y', or C 1 -C 4 alkyl; --R 5 -- is --O--, --SO 2 --, ##STR37## --B is --F, --Cl, --Br, --CH 3 , or --CF 3 ; r is 0, 1, 2, 3, or 4; and --Y' is halogen, --NO 2 , --C 6 H 5 , or C 1 -C 4 alkyl.
Claim 8
Dependent Claim
13 words
A multichip module according to claim 6, wherein the bistriazene compound is ##STR38##
Claim 9
Dependent Claim
29 words
A multichip module according to claim 1, wherein the fluorinated poly(arylene ether) has been crosslinked by heating in air at a temperature between about 300 and about 400° C.
Claim 10
Dependent Claim
25 words
A multichip module according to claim 1, wherein the fluorinated poly(arylene ether) has been crosslinked by heating an intimate mixture thereof with a peroxydic compound.
Claim 11
Dependent Claim
25 words
A multichip module according to claim 9, wherein the peroxydic compound is selected from the group consisting of cumene hydroperoxide, dicumyl peroxide, and benzoyl peroxide.
Claim 12
Dependent Claim
176 words
An article comprising an integrated circuit chip and a multilayer interconnect on the chip, the multilayer interconnect comprising plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR39## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR40## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 13
Dependent Claim
176 words
An article comprising an integrated circuit chip and a multilayer interconnect on the chip, the multilayer interconnect comprising plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR39## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR40## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 14
Dependent Claim
15 words
An article according to claim 11, wherein in the fluorinated poly(arylene ether) --W-- is ##STR41##
Claim 15
Dependent Claim
13 words
An article according to claim 11, wherein in the fluorinated poly(arylene ether) ##STR42##
Claim 16
Dependent Claim
101 words
An article according to claim 11, wherein the fluorinated poly(arylene ether) has been crosslinked with a bistriazene compound of the formula ##STR43## wherein --R 1 , --R 2 , --R 3 , and --R 4 are independently --H, --C 6 H 5 , --C 6 H 4 Y', or C 1 -C 4 alkyl; --R 5 -- is --O--, --SO 2 --, ##STR44## --B is --F, --Cl, --Br, --CH 3 , or --CF 3 ; r is 0, 1, 2, 3, or 4; and --Y' is halogen, --NO 2 , --C 6 H 5 , or C 1 -C 4 alkyl.
Claim 17
Dependent Claim
12 words
An article according to claim 14, wherein the bistriazene compound is ##STR45##
Claim 18
Dependent Claim
24 words
An article according to claim 11, wherein the fluorinated poly(arylene ether) has been crosslinked by heating an intimate mixture thereof with a peroxydic compound.
Claim 19
Dependent Claim
24 words
An article according to claim 16, wherein the peroxydic compound is selected from the group consisting of cumene hydroperoxide, dicumyl peroxide, and benzoyl peroxide.
Claim 20
Dependent Claim
155 words
An integrated circuit chip having thereon a protective layer, wherein the protective layer comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR46## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR47## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 21
Dependent Claim
155 words
An integrated circuit chip having thereon a protective layer, wherein the protective layer comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR46## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR47## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 22
Dependent Claim
17 words
An integrated circuit chip according to claim 18, wherein in the fluorinated poly(arylene ether) --W-- is ##STR48##
Claim 23
Dependent Claim
15 words
An integrated circuit chip according to claim 18, wherein in the fluorinated poly(arylene ether) ##STR49##
Claim 24
Dependent Claim
103 words
An integrated circuit chip according to claim 18, wherein the fluorinated poly(arylene ether) has been crosslinked with a bistriazene compound of the formula ##STR50## wherein --R 1 , --R 2 , --R 3 , and --R 4 are independently --H, --C 6 H 5 , --C 6 H 4 Y', or C 1 -C 4 alkyl; --R 5 -- is --O--, --SO 2 --, ##STR51## --B is --F, --Cl, --Br, --CH 3 , or --CF 3 ; r is 0, 1, 2, 3, or 4; and --Y' is halogen, --NO 2 , --C 6 H 5 , or C 1 -C 4 alkyl.
Claim 25
Dependent Claim
14 words
An integrated circuit chip according to claim 21, wherein the bistriazene compound is ##STR52##
Claim 26
Dependent Claim
26 words
An integrated circuit chip according to claim 18, wherein the fluorinated poly(arylene ether) has been crosslinked by heating an intimate mixture thereof with a peroxydic compound.
Claim 27
Dependent Claim
26 words
An integrated circuit chip according to claim 23, wherein the peroxydic compound is selected from the group consisting of cumene hydroperoxide, dicumyl peroxide, and benzoyl peroxide.
Claim 28
Dependent Claim
159 words
A circuit board comprising a substrate having on a surface thereof a conductor pattern, wherein the substrate comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR53## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR54## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 29
Dependent Claim
159 words
A circuit board comprising a substrate having on a surface thereof a conductor pattern, wherein the substrate comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR53## wherein each --A is independently --F, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; p is 0, 1, or 2; --Z-- is a direct bond, --C(CH 3 ) 2 --, --C(CF 3 ) 2 --, --O--, --S--, --SO 2 --, --CO--, --P(C 6 H 5 )--, C(CH 3 )(C 6 H 5 ), --C(C 6 H 5 ) 2 --, --(CF 2 ) 1-6 --, or ##STR54## wherein --Y-- is --O-- or a direct bond; and m is 0, 1, or 2; each --X is independently --H, --Cl, --Br, --CF 3 , --CH 3 , --CH 2 CH═CH 2 , or --C 6 H 5 ; q is 0, 1, or 2; and n is 1 or 2.
Claim 30
Dependent Claim
16 words
A circuit board according to claim 25, wherein in the fluorinated poly(arylene ether) --W-- is ##STR55##
Claim 31
Dependent Claim
14 words
A circuit board according to claim 25, wherein in the fluorinated poly(arylene ether) ##STR56##
Claim 32
Dependent Claim
102 words
A circuit board according to claim 25, wherein the fluorinated poly(arylene ether) has been crosslinked with a bistriazene compound of the formula ##STR57## wherein --R 1 , --R 2 , --R 3 , and --R 4 are independently --H, --C 6 H 5 , --C 6 H 4 Y', or C 1 -C 4 alkyl; --R 5 -- is --O--, --SO 2 --, ##STR58## --B is --F, --Cl, --Br, --CH 3 , or --CF 3 ; r is 0, 1, 2, 3, or 4; and --Y' is halogen, --NO 2 , --C 6 H 5 , or C 1 -C 4 alkyl.
Claim 33
Dependent Claim
13 words
A circuit board according to claim 28, wherein the bistriazene compound is ##STR59##
Claim 34
Dependent Claim
25 words
A circuit board according to claim 25, wherein the fluorinated poly(arylene ether) has been crosslinked by heating an intimate mixture thereof with a peroxydic compound.
Claim 35
Dependent Claim
25 words
A circuit board according to claim 25, wherein the peroxydic compound is selected from the group consisting of cumene hydroperoxide, dicumyl peroxide, and benzoyl peroxide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-19 | 1995-11-18 | 1996-05-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-19 | 1999-11-18 | 2000-05-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-19 | 2003-11-18 | 2004-05-19 | $7700.00 | Window Closed / Lapsed |