US5105261A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device package having particular lead structure for mounting multiple circuit boards
Assignee: Mitsubishi Electric Corp
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Filing: 1991-09-09
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Granted: 1992-04-14
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Expires: 2011-09-09
Abstract
Abstract The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.
Inventors
- 👤 Tetsuya Ueda
- 👤 Toru Tachikawa
- 👤 Masataka Takehara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 00:12
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/145; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10946; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
135 words
A semiconductor unit, comprising: a semiconductor device; and first and second printed circuit boards; wherein said semiconductor device comprises: a semiconductor element; a package for sealing said semiconductor element; and leads electrically connected to said semiconductor element; said leads projecting from at least first and second sides of said package and being bent in a zigzag manner so that ends of said leads lie on at least first and second planes; and wherein said semiconductor device is mounted on said first and second printed circuit boards in a manner that a first group of said leads projecting from said first side of said package are fixed to said first printed circuit board and a second group of said leads projecting from said second side of said package are fixed to said second printed circuit board.
Claim 2
Dependent Claim
135 words
A semiconductor unit, comprising: a semiconductor device; and first and second printed circuit boards; wherein said semiconductor device comprises: a semiconductor element; a package for sealing said semiconductor element; and leads electrically connected to said semiconductor element; said leads projecting from at least first and second sides of said package and being bent in a zigzag manner so that ends of said leads lie on at least first and second planes; and wherein said semiconductor device is mounted on said first and second printed circuit boards in a manner that a first group of said leads projecting from said first side of said package are fixed to said first printed circuit board and a second group of said leads projecting from said second side of said package are fixed to said second printed circuit board.
Claim 3
Dependent Claim
29 words
A semiconductor unit in accordance with claim 1, wherein said package has a rectangular configuration, and said at least first and second sides of said package include opposite sides.
Claim 4
Dependent Claim
29 words
A semiconductor unit in accordance with claim 1, wherein said package has a rectangular configuration, and said at least first and second sides of said package include four sides.
Claim 5
Dependent Claim
40 words
A semiconductor unit in accordance with claim 1, wherein said first plane includes a plane in a top surface side of said semiconductor device and said second plane includes a plane in a bottom surface side of said semiconductor device.
Claim 6
Dependent Claim
43 words
A semiconductor unit in accordance with claim 4, wherein said at least first and second planes further include a third plane in the top surface side of said semiconductor device and a fourth plane in the bottom surface side of said semiconductor element.
Claim 7
Dependent Claim
15 words
A semiconductor unit in accordance with claim 1, wherein said package includes a plastic package.
Claim 8
Dependent Claim
15 words
A semiconductor unit in accordance with claim 1, wherein said package includes a ceramic package.
Claim 9
Dependent Claim
129 words
A semiconductor unit, comprising: a semiconductor device; and first and second printed circuit boards; wherein said semiconductor device comprises: a semiconductor element; a package for sealing said semiconductor element; and leads electrically connected to said semiconductor element; said leads projecting from at least first and second sides of said package and being bent in a zigzag manner so that ends of said leads lie on at least first and second planes; and wherein said semiconductor device is mounted on said first and second printed circuit boards in a manner that a first group of said leads lying on said first plane are fixed to said first printed circuit board and a second group of said leads lying on said second plane are fixed to said second printed circuit board.
Claim 10
Dependent Claim
129 words
A semiconductor unit, comprising: a semiconductor device; and first and second printed circuit boards; wherein said semiconductor device comprises: a semiconductor element; a package for sealing said semiconductor element; and leads electrically connected to said semiconductor element; said leads projecting from at least first and second sides of said package and being bent in a zigzag manner so that ends of said leads lie on at least first and second planes; and wherein said semiconductor device is mounted on said first and second printed circuit boards in a manner that a first group of said leads lying on said first plane are fixed to said first printed circuit board and a second group of said leads lying on said second plane are fixed to said second printed circuit board.
Claim 11
Dependent Claim
29 words
A semiconductor unit in accordance with claim 8, wherein said package has a rectangular configuration, and said at least first and second sides of said package include opposite sides.
Claim 12
Dependent Claim
29 words
A semiconductor unit in accordance with claim 8, wherein said package has a rectangular configuration, and said at least first and second sides of said package include four sides.
Claim 13
Dependent Claim
40 words
A semiconductor unit in accordance with claim 8, wherein said first plane includes a plane in a top surface side of said semiconductor device and said second plane includes a plane in a bottom surface side of said semiconductor device.
Claim 14
Dependent Claim
43 words
A semiconductor unit in accordance with claim 11, wherein said at least first and second planes further include a third plane in the top surface side of said semiconductor device and a fourth plane in the bottom surface side of said semiconductor element.
Claim 15
Dependent Claim
15 words
A semiconductor unit in accordance with claim 8, wherein said package includes a plastic package.
Claim 16
Dependent Claim
15 words
A semiconductor unit in accordance with claim 8, wherein said package includes a ceramic package.
References Cited (Backward Citations)
JPS55107251A
Cited
JPS5915500A
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JPS5963751A
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JPS60103652A
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JPS6352455A
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US5025307A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-14 | 1995-10-14 | 1996-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-14 | 1999-10-14 | 2000-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-14 | 2003-10-14 | 2004-04-14 | $7700.00 | Window Closed / Lapsed |