US5103375A
Expired / Lapsed
US
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Electronic module assembly and method of manufacture
Assignee: Aumovio Systems Inc
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Filing: 1990-02-05
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Granted: 1992-04-07
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Expires: 2010-02-05
Abstract
Abstract An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.
Inventors
- 👤 David J. Cottingham
- 👤 Michael I. Petrites
- 👤 Thomas J. Tischhauser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:43
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0277; H05K1/028; H05K1/18; H05K1/189; H05K5/00; H05K5/0026; H05K5/0043; H05K1/03; H05K1/05; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09063; H05K2201/09109; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/20; H05K2201/2009; H05K3/00; H05K3/0058; H05K3/0061; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
211 words
An electronic module assembly comprising: a rigid thermally conductive base having integral at least first and second portions of each of which having a planar first surface on one side and a second opposite side surface; a common integral insulating film having at least two different planar portions, each of said different planar portions of said film planarly mounted to each of said planar first surfaces of said first and second portions of said base, respectively; first and second electrically conductive circuitry patterns each provided respectively on each of said different planar portions of said common integral insulating film, a plurality of discrete electrical components provided on and connected to each of said first and second circuitry patterns; said rigid base having a bend along an axis such that said first and second base portion first surfaces are non-coplanar and said second surfaces form the external surface of a protective housing for said components which are located in an interior spaced bounded by at least said first and second base portion first surfaces; wherein conductive circuit paths on said film interconnect said first and second circuitry patterns, and wherein said film has openings therein to said base along said axis, said interconnecting circuit paths on said film provided between said openings.
Claim 2
Dependent Claim
211 words
An electronic module assembly comprising: a rigid thermally conductive base having integral at least first and second portions of each of which having a planar first surface on one side and a second opposite side surface; a common integral insulating film having at least two different planar portions, each of said different planar portions of said film planarly mounted to each of said planar first surfaces of said first and second portions of said base, respectively; first and second electrically conductive circuitry patterns each provided respectively on each of said different planar portions of said common integral insulating film, a plurality of discrete electrical components provided on and connected to each of said first and second circuitry patterns; said rigid base having a bend along an axis such that said first and second base portion first surfaces are non-coplanar and said second surfaces form the external surface of a protective housing for said components which are located in an interior spaced bounded by at least said first and second base portion first surfaces; wherein conductive circuit paths on said film interconnect said first and second circuitry patterns, and wherein said film has openings therein to said base along said axis, said interconnecting circuit paths on said film provided between said openings.
Claim 3
Dependent Claim
67 words
An electronic module assembly according to claim 1 which includes: connector means including a plurality of pins electrically connected to said conductive circuitry patterns for providing external electrical access to said components located in said interior space; and module enclosure means which mates with and is joined to said bent base and which, together with said bent base and said connector means, substantially encloses said interior space.
Claim 4
Dependent Claim
48 words
An electronic module assembly according to claim 2, wherein said base has an integral intermediate portion between said first and second portions, said first, second and intermediate portions forming three housing sides for said interior space, said base generally having C-shape when mated to said module enclosing means.
Claim 5
Dependent Claim
23 words
An electronic module assembly according to claim 3 wherein said first surfaces of said base plate first and second portions are substantially parallel.
Claim 6
Dependent Claim
44 words
An electronic module assembly according to claim 3 wherein said connector means includes a rigid connector housing which mates with said base and forms a boundary of said interior space, said electrical pins of said connector means being directly connected to said circuitry patterns.
Claim 7
Dependent Claim
42 words
An electronic module assembly according to claim 2 wherein said thermally conductive base has a substantial heat capacity such that said base acts as a heat sink for said pluralities of discrete electrical components provided on said first and second circuitry patterns.
Claim 8
Dependent Claim
20 words
An electronic module assembly according to claim 2 wherein said base is metallic and therefore both thermally and electrically conductive.
Claim 9
Dependent Claim
15 words
An electronic module assembly according to claim 7 wherein said base comprises a metal plate.
Claim 10
Dependent Claim
219 words
An electronic module assembly comprising: a single rigid thermally conductive base plate having integral at least first and second portions each of which having a planar first surface on one side and a second opposite side surface; a common integral insulating sheet of film having at least different planar portions, each of said different planar portions of said film planarly mounted to each of said planar first surfaces of said first and second portions of said base plate, respectively; first and second electrically conductive circuitry patterns each provided respectively on each of said different planar portions of said common integral insulating film, a plurality of discrete electrical components provided on and connected to each of said first and second circuitry patterns; said rigid base plate having a bend along an axis such that said first and second base portion first surfaces are non-coplanar and said second surfaces form the external surface of a protective housing for said components which are located in an interior spaced bounded by at least said first and second base portion first surfaces; wherein a nonbonded loop portion of said film is provided between said first and second base portions and located generally along said axis, and wherein conductive circuit paths are provided on said film loop portion interconnecting said first and second circuitry patterns.
Claim 11
Dependent Claim
219 words
An electronic module assembly comprising: a single rigid thermally conductive base plate having integral at least first and second portions each of which having a planar first surface on one side and a second opposite side surface; a common integral insulating sheet of film having at least different planar portions, each of said different planar portions of said film planarly mounted to each of said planar first surfaces of said first and second portions of said base plate, respectively; first and second electrically conductive circuitry patterns each provided respectively on each of said different planar portions of said common integral insulating film, a plurality of discrete electrical components provided on and connected to each of said first and second circuitry patterns; said rigid base plate having a bend along an axis such that said first and second base portion first surfaces are non-coplanar and said second surfaces form the external surface of a protective housing for said components which are located in an interior spaced bounded by at least said first and second base portion first surfaces; wherein a nonbonded loop portion of said film is provided between said first and second base portions and located generally along said axis, and wherein conductive circuit paths are provided on said film loop portion interconnecting said first and second circuitry patterns.
Claim 12
Dependent Claim
69 words
An electronic module assembly according to claim 9 which includes: connector means including a plurality of pins electrically connected to said conductive circuitry patterns for providing external electrical access to said components located in said interior space; and module enclosure means which mates with and is joined to said bent base plate and which, together with said bent base plate and said connector means, substantially encloses said interior space.
Claim 13
Dependent Claim
50 words
An electronic module assembly according to claim 10 wherein said base plate has an integral intermediate portion between said first and second portions, said first, second and intermediate portions forming three housing sides for said interior space, said base plate generally having C-shape when mated to said module enclosing means.
Claim 14
Dependent Claim
22 words
An electronic module assembly according to claim 11 wherein said first surfaces of said base first and second portions are substantially parallel.
Claim 15
Dependent Claim
45 words
An electronic module assembly according to claim 11 wherein said connector means includes a rigid connector housing which mates with said base plate and forms a boundary of said interior space, said electrical pins of said connector means being directly connected to said circuitry patterns.
Claim 16
Dependent Claim
44 words
An electronic module assembly according to claim 10 wherein said thermally conductive base plate has a substantial heat capacity such that said base plate acts as a heat sink for said pluralities of discrete electrical components provided on said first and second circuitry patterns.
Claim 17
Dependent Claim
21 words
An electronic module assembly according to claim 10 wherein said base plate is metallic and therefore both thermally and electrically conductive.
Claim 18
Dependent Claim
16 words
An electronic module assembly according to claim 15 wherein said base plate comprises a metal plate.
References Cited (Backward Citations)
FR1519246A
Cited
US3676746A
Cited
US3816911A
Cited
US3766439A
Cited
US4152671A
Cited
US4394707A
Cited
US4495546A
Cited
US4528728A
Cited
US4792879A
Cited
WO1985005756A1
Cited
US4703984A
Cited
US4958260A
Cited
US4811165A
Cited
US4922059A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-07 | 1995-10-07 | 1996-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-07 | 1999-10-07 | 2000-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-07 | 2003-10-07 | 2004-04-07 | $7700.00 | Window Closed / Lapsed |