US5099388A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Alumina multilayer wiring substrate provided with high dielectric material layer
Assignee: Niterra Co Ltd
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Filing: 1990-06-15
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Granted: 1992-03-24
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Expires: 2010-06-15
Abstract
Abstract An alumina multilayer wiring substrate having a high dielectric, low inductance capacitor in the substrate on which a VLSI is to be mounted to effectively eliminate electrical noise(s) which may hinder the operation of the VLSI at high speed (frequency) is provided.
Inventors
- 👤 Masahiro Ogawa
- 👤 Kozo Yamasaki
- 👤 Mitsuru Hirano
- 👤 Michael A. Schmitt
- 👤 Bidyut K. Bhattacharyya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:45
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H01; H01G; H01G4/00; H01G4/002; H01G4/018; H01G4/06; H01G4/08; H01G4/12; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4688
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
127 words
A wiring substrate comprising: a dielectric material layer having a first dielectric material layer surface and a second dielectric material layer surface; a first metallized layer on said first dielectric material layer surface; a second metallized layer on said second dielectric material layer surface; a first alumina layer having an inward surface contacting said first metallized layer and an outward surface; a second alumina layer having an inward surface contacting said second metallized layer and an outward surface; a first conductor electrically connecting to and extending from said first metallized layer through said first alumina layer; and a second conductor electrically extending from said second metallized layer through said dielectric material layer, through but not electrically connecting said first metallized layer, and through said first alumina layer.
Claim 2
Dependent Claim
127 words
A wiring substrate comprising: a dielectric material layer having a first dielectric material layer surface and a second dielectric material layer surface; a first metallized layer on said first dielectric material layer surface; a second metallized layer on said second dielectric material layer surface; a first alumina layer having an inward surface contacting said first metallized layer and an outward surface; a second alumina layer having an inward surface contacting said second metallized layer and an outward surface; a first conductor electrically connecting to and extending from said first metallized layer through said first alumina layer; and a second conductor electrically extending from said second metallized layer through said dielectric material layer, through but not electrically connecting said first metallized layer, and through said first alumina layer.
Claim 3
Dependent Claim
47 words
A wiring substrate according to claim 1, further comprising: a second electrode layer electrically extending to said second conductor at said outward surface of said first alumina layer; and a first electrode layer extending to said first conductor at said outward surface of said first alumina layer.
Claim 4
Dependent Claim
16 words
A wiring substrate according to claim 1, wherein said dielectric material layer comprises a dielectric material.
Claim 5
Dependent Claim
28 words
A wiring substrate according to claim 3, wherein said dielectric material comprises alumina and from 5 to 50 weight percent of said dielectric material of an auxiliary material.
Claim 6
Dependent Claim
13 words
A wiring substrate according to claim 4, wherein said auxiliary material comprises molybdenum.
Claim 7
Dependent Claim
14 words
A wiring substrate according to claim 4, wherein said auxiliary material comprises molybdenum oxide.
Claim 8
Dependent Claim
13 words
A wiring substrate according to claim 4, wherein said auxiliary material comprises tungsten.
Claim 9
Dependent Claim
14 words
A wiring substrate according to claim 4, wherein said auxiliary material comprises tungsten oxide.
Claim 10
Dependent Claim
22 words
A wiring substrate according to claim 4, wherein said auxiliary material comprises any combination of molybdenum, molybdenum oxide, tungsten, or tungsten oxide.
Claim 11
Dependent Claim
24 words
A wiring substrate according to claim 1, wherein said first metallized layer and said second metallized layer comprise primarily a high melting point metal.
Claim 12
Dependent Claim
15 words
A wiring substrate according to claim 10, wherein said high melting point metal comprises molybdenum.
Claim 13
Dependent Claim
15 words
A wiring substrate according to claim 10 wherein said high melting point metal comprises tungsten.
References Cited (Backward Citations)
US4816323A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-24 | 1995-09-23 | 1996-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-24 | 1999-09-23 | 2000-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-24 | 2003-09-23 | 2004-03-24 | $7700.00 | Window Closed / Lapsed |