US5098766A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated wire circuit board
Assignee: International Business Machines Corp
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Filing: 1991-05-24
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Granted: 1992-03-24
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Expires: 2011-05-24
Abstract
Abstract A circuit board with insulated wire thereon is encapsulated with a photocurable adhesive composition comprising a phenoxy resin; a reaction product of an unsaturated carboxylic acid and epoxidized non-linear novolak; reaction product of an unsaturated carboxylic acid and a tetrabrominated diglycidyl ether of a phenol; monohydroxy dipentaerythritol acrylate and/or pentaerythritol tetraacrylate; polyethylenically unsaturated compound; and photoinitiator, and optionally, hexamethylol melamine-formaldehyde; and/or a thixotropic agent.
Inventors
- 👤 Jeffrey D. Gelorme
- 👤 Eugene R. Skarvinko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 01:23
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; C; C08; C08G; C08G59/00; C08G59/02; C08G59/04; C08G59/06; C08G59/08; C09; C09J; C09J163/00; C09J163/10; C09J171/00; C09J4/00; C09J4/06; C08L; C08L2666/00; C08L2666/02; C08L2666/14; C08L2666/22; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/10; H05K3/103; H05K3/22; H05K3/28; H05K3/285; H05K3/287; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31518; Y10T428/31522
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
266 words
An encapsulated wire circuit board comprising a rigid base plane; a layer of glass epoxy prepreg covering said base plane; a layer of photocured adhesive covering said epoxy prepreg, said adhesive comprising: A) about 21% to about 32% phenoxy resin; B) about 7.5% to about 17.5% by weight of reaction product of monoethylenically unsaturated carboxylic acid and an epoxy polymer being an epoxidized non-linear novolak having at least six terminal epoxy groups, wherein the relative amount of said acid to said epoxy polymer is sufficient to react stoichiometrically with about 80% to about 100% of the epoxide functionality of said epoxy polymer; C) about 30% to about 36% by weight of reaction product of tetrabrominated diglycidyl ether of a phenol and monoethylenically unsaturated carboxylic acid, wherein the relative amount of said acid to said ether is sufficient to react stoichiometrically with about 80% to about 100% of the epoxide functionality of said epoxy polymer; D) about 9% to about 19.5% by weight of monohydroxy-dipentaerythritol pentaacrylate, or pentaerythritol tetracrylate, or mixtures thereof; E) about 3.5% to about 14% by weight of polyethylenically unsaturated compound selected from the group consisting of diacrylates of diols, dimethacrylates of diols, triacrylates of triols, trimethacrylates of triols, methylene bisacrylamide, methylene bismethacrylamide, divinyl succinate; divinyl adipate; divinyl phthalate, divinyl terephthalate, and the reaction product of sorbaldehyde reacted with hydroxy groups present on phenoxy polymer; F) up to about 6.5% by weight of hexamethyoxymethyl melamine; G) about 1% to about 6.5% by weight of photoinitiator; and H) up to about 10% by weight of a thixotropic agent; and insulated wires encapsulated in said adhesive.
Claim 2
Dependent Claim
266 words
An encapsulated wire circuit board comprising a rigid base plane; a layer of glass epoxy prepreg covering said base plane; a layer of photocured adhesive covering said epoxy prepreg, said adhesive comprising: A) about 21% to about 32% phenoxy resin; B) about 7.5% to about 17.5% by weight of reaction product of monoethylenically unsaturated carboxylic acid and an epoxy polymer being an epoxidized non-linear novolak having at least six terminal epoxy groups, wherein the relative amount of said acid to said epoxy polymer is sufficient to react stoichiometrically with about 80% to about 100% of the epoxide functionality of said epoxy polymer; C) about 30% to about 36% by weight of reaction product of tetrabrominated diglycidyl ether of a phenol and monoethylenically unsaturated carboxylic acid, wherein the relative amount of said acid to said ether is sufficient to react stoichiometrically with about 80% to about 100% of the epoxide functionality of said epoxy polymer; D) about 9% to about 19.5% by weight of monohydroxy-dipentaerythritol pentaacrylate, or pentaerythritol tetracrylate, or mixtures thereof; E) about 3.5% to about 14% by weight of polyethylenically unsaturated compound selected from the group consisting of diacrylates of diols, dimethacrylates of diols, triacrylates of triols, trimethacrylates of triols, methylene bisacrylamide, methylene bismethacrylamide, divinyl succinate; divinyl adipate; divinyl phthalate, divinyl terephthalate, and the reaction product of sorbaldehyde reacted with hydroxy groups present on phenoxy polymer; F) up to about 6.5% by weight of hexamethyoxymethyl melamine; G) about 1% to about 6.5% by weight of photoinitiator; and H) up to about 10% by weight of a thixotropic agent; and insulated wires encapsulated in said adhesive.
Claim 3
Dependent Claim
82 words
The board of claim 1 wherein the amount of A) is about 26% to about 27% by weight; B) is about 12% to about 13% by weight; C) is about 30% to about 31% by weight; D) is about 14% to about 15% by weight; E) is about 8% to about 9% by weight; F) is about 1% to about 2% by weight; G) is about 1% to about 2% by weight; and H) is about 4% to about 6% by weight.
Claim 4
Dependent Claim
15 words
The board of claim 1 wherein said epoxidized non-linear novolak has the average formula: ##STR8##
Claim 5
Dependent Claim
49 words
The board of claim 3 wherein said tetrabrominated diglycidyl ether is of bisphenol A and has an epoxy equivalent of about 200 to about 220; D) is monohydroxy-dipentaerythritol dentaacrylate; said polyethylenically unsaturated compound is trimethylol propane triacrylate; said photoinitiator is 2,2-dimethoxy-2-phenyl acetophenone; and said thixotropic agent is colloidal silica.
Claim 6
Dependent Claim
82 words
The board of claim 4 wherein the amount of A) is about 26% to about 27% by weight; B) is about 12% to about 13% by weight; C) is about 30% to about 31% by weight; D) is about 14% to about 15% by weight; E) is about 8% to about 9% by weight; F) is about 1% to about 2% by weight; G) is about 1% to about 2% by weight; and H) is about 4% to about 6% by weight.
Claim 7
Dependent Claim
25 words
The board of claim 1 wherein said tetrabrominated diglycidyl ether is of bisphenol A and has an epoxy equivalent of about 200 to about 220.
Claim 8
Dependent Claim
10 words
The board of claim 1 wherein D) is monohydroxydipentaerythritol pentaacrylate.
Claim 9
Dependent Claim
13 words
The board of claim 1 wherein said polyethylenically unsaturated compound is trimethylolpropane triacrylate.
Claim 10
Dependent Claim
11 words
The board of claim 1 wherein said photoinitiator is 2,2-dimethoxy-2-phenyl acetophenol.
Claim 11
Dependent Claim
12 words
The board of claim 1 wherein said thixotropic agent is colloidal silica.
Claim 12
Dependent Claim
80 words
The board of claim 1 wherein said polyethylenically unsaturated compound is selected from the group consisting of ethylene diacrylate; diethylene glycol diacrylate; glycerol diacrylate; glycerol triacrylate; ethylene dimethacrylate; 1,3-propylene dimethacrylate; 1,2,4-butene triol trimethacrylate; 1,4-benzenediol dimethacrylate; 1,3-propane diol diacrylate; 1,6-hexane diol diacrylate; the bis-acrylates and methacrylates of polyethylene glycols of molecular weight 200-500; trimethylol propane triacrylate; methylene bisacryl and bismethacrylamide; divinyl succinate; divinyl adipate; divinyl phthalate, divinyl terephthalate, and the reaction product of sorbaldehyde with hydroxyl groups present on phenoxy polymer.
References Cited (Backward Citations)
US4774126A
Cited
US5041187A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-03-24 | 1995-09-23 | 1996-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-24 | 1999-09-23 | 2000-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-24 | 2003-09-23 | 2004-03-24 | $7700.00 | Window Closed / Lapsed |