US5097101A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
Assignee: AMERICAN VIDEO GRAPHICS LP
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Filing: 1991-02-05
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Granted: 1992-03-17
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Expires: 2011-02-05
Abstract
Abstract A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Inventors
- 👤 Douglas W. Trobough
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/0382; H05K2201/09; H05K2201/09009; H05K2201/091; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/0113; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
117 words
A method of processing a sheet of flexible insulating material having first and second opposite sides and first and second layers of metal on the first and second sides respectively, said method comprising: (a) removing metal of the first and second layers so as to leave at least one contact pad on the first side and at least one discrete island on the second side, the island confronting the contact pad through the sheet of insulating material, and (b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the contact pad is deformed plastically to form a contact bump.
Claim 2
Independent Claim
117 words
A method of processing a sheet of flexible insulating material having first and second opposite sides and first and second layers of metal on the first and second sides respectively, said method comprising: (a) removing metal of the first and second layers so as to leave at least one contact pad on the first side and at least one discrete island on the second side, the island confronting the contact pad through the sheet of insulating material, and (b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the contact pad is deformed plastically to form a contact bump.
Claim 3
Dependent Claim
31 words
A method in accordance with claim 1, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.
Claim 4
Dependent Claim
27 words
A method in accordance with claim 1, further comprising: (c) applying a layer of flexible conductive material to the second side of the sheet of flexible material.
Claim 5
Dependent Claim
13 words
A flexible circuit board manufactured by a method in accordance with claim 1.
Claim 6
Independent Claim
132 words
A method of forming a flexible circuit board from a sheet of insulating material having first and second opposite sides, said method comprising: (a) depositing first and second layers of metal on the first and second sides respectively of the sheet of insulating material, (b) removing metal of the first and second layers so as to define at least one discrete contact pad on the first side of the sheet of insulating material and at least one discrete island on the second side, the island confronting the pad through the sheet of insulating material, and (c) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Claim 7
Independent Claim
132 words
A method of forming a flexible circuit board from a sheet of insulating material having first and second opposite sides, said method comprising: (a) depositing first and second layers of metal on the first and second sides respectively of the sheet of insulating material, (b) removing metal of the first and second layers so as to define at least one discrete contact pad on the first side of the sheet of insulating material and at least one discrete island on the second side, the island confronting the pad through the sheet of insulating material, and (c) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Claim 8
Dependent Claim
31 words
A method in accordance with claim 5, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.
Claim 9
Dependent Claim
27 words
A method in accordance with claim 5, further comprising: (d) applying a layer of flexible conductive material to the second side of the sheet of flexible material.
Claim 10
Dependent Claim
13 words
A flexible circuit board manufactured by a method in accordance with claim 5.
Claim 11
Independent Claim
100 words
A method of processing a sheet of insulating material having first and second opposite sides, at least one discrete contact pad on the first side, and a continuous layer of metal on the second side, comprising: (a) removing metal from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and (b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Claim 12
Independent Claim
100 words
A method of processing a sheet of insulating material having first and second opposite sides, at least one discrete contact pad on the first side, and a continuous layer of metal on the second side, comprising: (a) removing metal from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and (b) applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Claim 13
Dependent Claim
31 words
A method in accordance with claim 9, wherein the flexible insulating material is polyimide, the metal of the first layer contains copper and the metal of the second layer contains copper.
Claim 14
Dependent Claim
27 words
A method in accordance with claim 9, further comprising: (c) applying a layer of flexible conductive material to the second side of the sheet of flexible material.
Claim 15
Dependent Claim
13 words
A flexible circuit board manufactured by a method in accordance with claim 9.
References Cited (Backward Citations)
US2912745A
Cited
US4116517A
Cited
US4173712A
Cited
US4403272A
Cited
US4396457A
Cited
US4784972A
Cited
US4736277A
Cited
US4835859A
Cited
GB2222727A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-17 | 1995-09-16 | 1996-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-17 | 1999-09-16 | 2000-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-17 | 2003-09-16 | 2004-03-17 | $7700.00 | Window Closed / Lapsed |