Process for forming printed circuits

Claim 2

The process for forming a printed electrical circuit on an electrically insulating substrate which comprises: depositing an electrically conductive nickel metal layer on a substrate surface, depositing a mask on said nickel metal layer in a pattern comprising a negative image of said circuit thereby to expose a nickel metal layer having a pattern of said circuit, electroplating an electrically conductive second metal layer on said nickel metal layer having a pattern of said circuit, removing said mask from said nickel metal layer to expose a negative nickel metal image of said circuit, contacting said negative nickel metal image with a carbon monoxide containing gas at a temperature between about 60° C. and 100° C. to effect conversion of exposed nickel metal to vaporous nickel carbonyl while said second metal is unreacted with the carbon monoxide, thereby to selectively remove said exposed nickel metal from said substrate, and heating said vaporous nickel carbonyl to a temperature between about 150° and 250° C. to convert said nickel carbonyl to nickel metal and carbon monoxide.

Claim 3

The process for forming a printed circuit on electrically insulating substrate which comprises: coating a surface of said substrate with an electrically conductive nickel metal layer, electroplating a second metal layer in the form of said circuit on said nickel metal layer to form an exposed negative nickel metal image of said circuit, contacting said negative nickel metal image with a carbon monoxide containing gas at a temperature between about 60° C. and 100° C. to effect conversion of said exposed nickel metal to vaporous nickel carbonyl while said second metal is unreacted with carbon monoxide, thereby to selectively remove said exposed nickel metal from said substrate, and heating said vaporous nickel carbonyl to a temperature between about 150° and 200° C. to convert said nickel carbonyl to nickel metal and carbon monoxide.

Claim 4

The process for forming a printed circuit on electrically insulating substrate which comprises: coating a surface of said substrate with an electrically conductive nickel metal layer, electroplating a second metal layer in the form of said circuit on said nickel metal layer to form an exposed negative nickel metal image of said circuit, contacting said negative nickel metal image with a carbon monoxide containing gas at a temperature between about 60° C. and 100° C. to effect conversion of said exposed nickel metal to vaporous nickel carbonyl while said second metal is unreacted with carbon monoxide, thereby to selectively remove said exposed nickel metal from said substrate, and heating said vaporous nickel carbonyl to a temperature between about 150° and 200° C. to convert said nickel carbonyl to nickel metal and carbon monoxide.

Claim 5

The process of any one of claims 1 or 2 wherein said second metal is copper.

Claim 6

The process of any one of claims 1 or 2 wherein said substrate is coated with an electrical copper circuit on two opposing substrate surfaces.

Claim 7

The process of claim 1 wherein said substrate is a polyimide.

Claim 8

The process of claim 2 wherein said substrate is a polyimide.

Claim 9

The process of claim 3 wherein said substrate is a polyimide.

Claim 10

The process of claim 4 wherein said substrate is a polyimide.

Claim 11

The process for forming a printed electrical circuit on an electrically insulating substrate which comprises: depositing an electrically conductive nickel metal on a surface of the substrate, depositing a mask on said nickel metal layer in a pattern comprising a negative image of said circuit thereby to expose only the nickel metal layer having a pattern of said circuit, electroplating a second electrically conductive metal layer which does not react with carbon monoxide on said nickel metal layer only on the area having a pattern of said circuit, removing said mask from said nickel metal layer to expose the nickel metal that forms a negative image of said circuit, contacting said negative nickel metal image with a gas composition containing carbon monoxide, with said gas at a temperature between about 60° C. and 100° C. to convert said exposed nickel metal to vaporous nickel carbonyl, thereby to remove said exposed nickel metal from said substrate, separately heating said gas composition containing vaporous nickel carbonyl to a temperature between about 150° and 250° C. to convert said nickel carbonyl to nickel carbonyl to nickel metal and carbon monoxide, washing said insulating substrate with a liquid composition suitable for dissolving and removing residual compounds remaining on the substrate after the nickel layer is removed, and rinsing said liquid composition from the substrate to form an electrically insulating substrate coated with an electrically conductive metal pattern formed by a first layer of nickel metal adhering to the substrate and a second conductive metal layer adhering to said layer of nickel metal.

Claim 12

The process for forming a printed electrical circuit on an electrically insulating substrate which comprises: depositing an electrically conductive nickel metal on a surface of the substrate, depositing a mask on said nickel metal layer in a pattern comprising a negative image of said circuit thereby to expose only the nickel metal layer having a pattern of said circuit, electroplating a second electrically conductive metal layer which does not react with carbon monoxide on said nickel metal layer only on the area having a pattern of said circuit, removing said mask from said nickel metal layer to expose the nickel metal that forms a negative image of said circuit, contacting said negative nickel metal image with a gas composition containing carbon monoxide, with said gas at a temperature between about 60° C. and 100° C. to convert said exposed nickel metal to vaporous nickel carbonyl, thereby to remove said exposed nickel metal from said substrate, separately heating said gas composition containing vaporous nickel carbonyl to a temperature between about 150° and 250° C. to convert said nickel carbonyl to nickel carbonyl to nickel metal and carbon monoxide, washing said insulating substrate with a liquid composition suitable for dissolving and removing residual compounds remaining on the substrate after the nickel layer is removed, and rinsing said liquid composition from the substrate to form an electrically insulating substrate coated with an electrically conductive metal pattern formed by a first layer of nickel metal adhering to the substrate and a second conductive metal layer adhering to said layer of nickel metal.

Claim 13

The process of claim 9 wherein said substrate comprises an epoxy fiberglass composite material.

Claim 14

The process of claim 9 wherein said substrate is a polyimide composition.

Claim 15

The process of claim 9 wherein said nickel metal is deposited by immersing said substrate into an electroless nickel plating bath composition.

Claim 16

The process of claim 9 wherein said nickel metal is deposited by laminating with an adhesive a nickel metal foil to the surfaces of said substrate.

Claim 17

The process of claim 9 wherein said second electrically conductive and electroplated metal is copper.

Claim 18

The process of any one of claims 1, 2 or 9 wherein said second electrically conductive and electroplated metal is silver.

Claim 19

The process of any one of claims 1, 2 or 9 wherein said second electrically conductive and electroplated metal is gold.

Claim 20

The process of any one of claims 1, 2 or 9 wherein said nickel is deposited from an electroless nickel bath contains at least one compound containing boron.

Claim 21

The process of any one of claims 1, 2 or 9 wherein said nickel is deposited from an electroless nickel bath contains one or more compounds containing phosphorous.

Claim 22

The process of any one of claims 1, 2 or 9 wherein said gas composition contains a mixture of carbon monoxide and carbon dioxide.

Claim 23

The process of claim 1 wherein said gas composition contains a mixture of carbon monoxide diluted with an inert gas selected from the group consisting of nitrogen, helium and argon.

Claim 24

The process of any one of claims 1, 2 or 9 wherein a third metal layer is electroplated on the second metal layer.

Claim 25

The process of claim 21 wherein said third metal layer comprises a tin-lead alloy.